CN103906785A - 环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法 - Google Patents

环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法 Download PDF

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Publication number
CN103906785A
CN103906785A CN201280053406.5A CN201280053406A CN103906785A CN 103906785 A CN103906785 A CN 103906785A CN 201280053406 A CN201280053406 A CN 201280053406A CN 103906785 A CN103906785 A CN 103906785A
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China
Prior art keywords
epoxy resin
general formula
iii
composition
composition epoxy
Prior art date
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Pending
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CN201280053406.5A
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English (en)
Chinese (zh)
Inventor
吉田优香
竹泽由高
高桥裕之
宫崎靖夫
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Resonac Corp
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Hitachi Chemical Co Ltd
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Priority claimed from PCT/JP2011/075345 external-priority patent/WO2013065159A1/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201710241334.1A priority Critical patent/CN107312161B/zh
Publication of CN103906785A publication Critical patent/CN103906785A/zh
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    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
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  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
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  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
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  • Spectroscopy & Molecular Physics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
CN201280053406.5A 2011-11-02 2012-10-31 环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法 Pending CN103906785A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710241334.1A CN107312161B (zh) 2011-11-02 2012-10-31 环氧树脂组合物、半固化或固化环氧树脂组合物及它们的制造方法、使用这些组合物的产品

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2011-241668 2011-11-02
JP2011241668 2011-11-02
PCT/JP2011/075345 WO2013065159A1 (ja) 2011-11-02 2011-11-02 樹脂組成物、並びにそれを用いた樹脂シート、プリプレグ、積層板、金属基板及びプリント配線板
JPPCT/JP2011/075345 2011-11-02
JP2012-090473 2012-04-11
JP2012090473 2012-04-11
PCT/JP2012/078240 WO2013065759A1 (ja) 2011-11-02 2012-10-31 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、配線板、半硬化エポキシ樹脂組成物の製造方法及び硬化エポキシ樹脂組成物の製造方法

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CN103906785A true CN103906785A (zh) 2014-07-02

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CN201280053406.5A Pending CN103906785A (zh) 2011-11-02 2012-10-31 环氧树脂组合物、半固化环氧树脂组合物、固化环氧树脂组合物、树脂片、预浸料坯、层叠板、金属基板、配线板、半固化环氧树脂组合物的制造方法以及固化环氧树脂组合物的制造方法

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JP (2) JP6119610B2 (ja)
KR (1) KR20140099870A (ja)
CN (2) CN107312161B (ja)
TW (1) TWI485174B (ja)
WO (1) WO2013065759A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107207701A (zh) * 2015-01-29 2017-09-26 日立化成株式会社 环氧树脂组合物、半固化环氧树脂组合物、树脂片及预浸渍体
CN107614563A (zh) * 2015-05-22 2018-01-19 日立化成株式会社 环氧树脂组合物、导热材料前体、b阶片、预浸渍体、散热材料、层叠板、金属基板和印刷配线板
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