CN103796421B - 一种电子电路及其制造方法和用于降低电子电路中电感的方法 - Google Patents

一种电子电路及其制造方法和用于降低电子电路中电感的方法 Download PDF

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Publication number
CN103796421B
CN103796421B CN201310477213.9A CN201310477213A CN103796421B CN 103796421 B CN103796421 B CN 103796421B CN 201310477213 A CN201310477213 A CN 201310477213A CN 103796421 B CN103796421 B CN 103796421B
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CN
China
Prior art keywords
flexible circuit
circuit
electronic equipment
electronic
conductive trace
Prior art date
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Application number
CN201310477213.9A
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English (en)
Chinese (zh)
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CN103796421A (zh
Inventor
唐纳德·R·拉特瑞尔
瑟德·E·阿得利
彼得·科斯
詹姆森·F·麦克唐纳
罗斯·S·威尔逊
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Avago Technologies International Sales Pte Ltd
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Avago Technologies Fiber IP Singapore Pte Ltd
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Publication of CN103796421A publication Critical patent/CN103796421A/zh
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN201310477213.9A 2012-10-29 2013-10-14 一种电子电路及其制造方法和用于降低电子电路中电感的方法 Active CN103796421B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/662,659 US9078352B2 (en) 2012-10-29 2012-10-29 Low inductance flex bond with low thermal resistance
US13/662,659 2012-10-29

Publications (2)

Publication Number Publication Date
CN103796421A CN103796421A (zh) 2014-05-14
CN103796421B true CN103796421B (zh) 2017-04-12

Family

ID=49303749

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310477213.9A Active CN103796421B (zh) 2012-10-29 2013-10-14 一种电子电路及其制造方法和用于降低电子电路中电感的方法

Country Status (6)

Country Link
US (1) US9078352B2 (https=)
EP (1) EP2725611A3 (https=)
JP (1) JP5855068B2 (https=)
KR (1) KR101594218B1 (https=)
CN (1) CN103796421B (https=)
TW (1) TWI539873B (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9402303B2 (en) * 2013-06-03 2016-07-26 Apple Inc. Flexible printed circuit cables with slits
US10934727B2 (en) 2015-03-02 2021-03-02 Odin, Llc Deck hoist and basket for use in construction
KR102422980B1 (ko) * 2015-06-26 2022-07-19 인텔 코포레이션 집합형 절연 와이어를 구비하는 패키지 어셈블리
CN107732651B (zh) * 2016-08-12 2020-08-04 美国亚德诺半导体公司 光发射器封装件
US12283555B2 (en) 2018-03-23 2025-04-22 Analog Devices International Unlimited Company Semiconductor packages

Citations (2)

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CN1278451C (zh) * 2001-06-14 2006-10-04 帕瑞康技术公司 用于对各向异性导电弹性材料预加应力的设备和方法
US7838409B2 (en) * 2005-05-04 2010-11-23 Oracle America, Inc. Structures and methods for an application of a flexible bridge

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US4918811A (en) * 1986-09-26 1990-04-24 General Electric Company Multichip integrated circuit packaging method
US4783695A (en) * 1986-09-26 1988-11-08 General Electric Company Multichip integrated circuit packaging configuration and method
US4755783A (en) * 1986-11-18 1988-07-05 Rogers Corporation Inductive devices for printed wiring boards
JPH05166867A (ja) * 1991-12-12 1993-07-02 Hitachi Ltd 半導体集積回路装置
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
US5419038A (en) * 1993-06-17 1995-05-30 Fujitsu Limited Method for fabricating thin-film interconnector
BE1007618A3 (nl) * 1993-10-13 1995-08-22 Philips Electronics Nv Flexibel bevestigingsorgaan alsmede object voorzien van een dergelijk bevestigingsorgaan, drager voorzien van een object en een dergelijk bevestigingsorgaan en verpakking voorzien van een aantal van dergelijke bevestigingsorganen.
US5742484A (en) * 1997-02-18 1998-04-21 Motorola, Inc. Flexible connector for circuit boards
US6603079B2 (en) * 1999-02-05 2003-08-05 Mack Technologies Florida, Inc. Printed circuit board electrical interconnects
JP3936925B2 (ja) * 2003-06-30 2007-06-27 日本オプネクスト株式会社 光伝送モジュール
JP2005064129A (ja) * 2003-08-08 2005-03-10 Cmk Corp リジッドフレックスプリント配線板
WO2006050446A1 (en) * 2004-11-02 2006-05-11 Sun Microsystems, Inc. Structures and methods for proximity communication using bridge chips
US20060223227A1 (en) * 2005-04-04 2006-10-05 Tessera, Inc. Molding method for foldover package
US7649245B2 (en) * 2005-05-04 2010-01-19 Sun Microsystems, Inc. Structures and methods for a flexible bridge that enables high-bandwidth communication
US20060289986A1 (en) * 2005-06-27 2006-12-28 Vadim Sherman In-package connection between integrated circuit dies via flex tape
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US9402303B2 (en) * 2013-06-03 2016-07-26 Apple Inc. Flexible printed circuit cables with slits

Patent Citations (2)

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CN1278451C (zh) * 2001-06-14 2006-10-04 帕瑞康技术公司 用于对各向异性导电弹性材料预加应力的设备和方法
US7838409B2 (en) * 2005-05-04 2010-11-23 Oracle America, Inc. Structures and methods for an application of a flexible bridge

Also Published As

Publication number Publication date
US20140118966A1 (en) 2014-05-01
KR20140056002A (ko) 2014-05-09
CN103796421A (zh) 2014-05-14
TW201424487A (zh) 2014-06-16
US9078352B2 (en) 2015-07-07
JP2014090170A (ja) 2014-05-15
KR101594218B1 (ko) 2016-02-15
EP2725611A2 (en) 2014-04-30
JP5855068B2 (ja) 2016-02-09
TWI539873B (zh) 2016-06-21
EP2725611A3 (en) 2018-01-24

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Effective date of registration: 20160721

Address after: Singapore Singapore

Applicant after: Avago Technologies General IP (Singapore) Pte. Ltd.

Address before: Milpitas, California

Applicant before: LSI Corp.

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Effective date of registration: 20181019

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Patentee after: Avago Technologies General IP (Singapore) Pte. Ltd.

Address before: Singapore Singapore

Patentee before: Avago Technologies General IP (Singapore) Pte. Ltd.

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