CN103796421A - 具有低热阻的低电感柔性粘合 - Google Patents
具有低热阻的低电感柔性粘合 Download PDFInfo
- Publication number
- CN103796421A CN103796421A CN201310477213.9A CN201310477213A CN103796421A CN 103796421 A CN103796421 A CN 103796421A CN 201310477213 A CN201310477213 A CN 201310477213A CN 103796421 A CN103796421 A CN 103796421A
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- circuit
- conductive trace
- electronic
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Semiconductor Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/662,659 | 2012-10-29 | ||
US13/662,659 US9078352B2 (en) | 2012-10-29 | 2012-10-29 | Low inductance flex bond with low thermal resistance |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103796421A true CN103796421A (zh) | 2014-05-14 |
CN103796421B CN103796421B (zh) | 2017-04-12 |
Family
ID=49303749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310477213.9A Active CN103796421B (zh) | 2012-10-29 | 2013-10-14 | 一种电子电路及其制造方法和用于降低电子电路中电感的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9078352B2 (zh) |
EP (1) | EP2725611A3 (zh) |
JP (1) | JP5855068B2 (zh) |
KR (1) | KR101594218B1 (zh) |
CN (1) | CN103796421B (zh) |
TW (1) | TWI539873B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107732651A (zh) * | 2016-08-12 | 2018-02-23 | 美国亚德诺半导体公司 | 光发射器封装件 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9402303B2 (en) * | 2013-06-03 | 2016-07-26 | Apple Inc. | Flexible printed circuit cables with slits |
US10934727B2 (en) | 2015-03-02 | 2021-03-02 | Odin, Llc | Deck hoist and basket for use in construction |
CN108064417B (zh) * | 2015-06-26 | 2022-01-18 | 英特尔公司 | 具有聚集的绝缘线的封装组合件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1278451C (zh) * | 2001-06-14 | 2006-10-04 | 帕瑞康技术公司 | 用于对各向异性导电弹性材料预加应力的设备和方法 |
US20080225476A1 (en) * | 2006-01-11 | 2008-09-18 | Chris Karabatsos | Tab wrap foldable electronic assembly module and method of manufacture |
US7838409B2 (en) * | 2005-05-04 | 2010-11-23 | Oracle America, Inc. | Structures and methods for an application of a flexible bridge |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4687695A (en) * | 1985-09-27 | 1987-08-18 | Hamby Bill L | Flexible printed circuits and methods of fabricating and forming plated thru-holes therein |
US4918811A (en) * | 1986-09-26 | 1990-04-24 | General Electric Company | Multichip integrated circuit packaging method |
US4783695A (en) * | 1986-09-26 | 1988-11-08 | General Electric Company | Multichip integrated circuit packaging configuration and method |
US4755783A (en) * | 1986-11-18 | 1988-07-05 | Rogers Corporation | Inductive devices for printed wiring boards |
JPH05166867A (ja) * | 1991-12-12 | 1993-07-02 | Hitachi Ltd | 半導体集積回路装置 |
US5198965A (en) * | 1991-12-18 | 1993-03-30 | International Business Machines Corporation | Free form packaging of specific functions within a computer system |
US5419038A (en) * | 1993-06-17 | 1995-05-30 | Fujitsu Limited | Method for fabricating thin-film interconnector |
BE1007618A3 (nl) * | 1993-10-13 | 1995-08-22 | Philips Electronics Nv | Flexibel bevestigingsorgaan alsmede object voorzien van een dergelijk bevestigingsorgaan, drager voorzien van een object en een dergelijk bevestigingsorgaan en verpakking voorzien van een aantal van dergelijke bevestigingsorganen. |
US5742484A (en) * | 1997-02-18 | 1998-04-21 | Motorola, Inc. | Flexible connector for circuit boards |
US6603079B2 (en) * | 1999-02-05 | 2003-08-05 | Mack Technologies Florida, Inc. | Printed circuit board electrical interconnects |
JP3936925B2 (ja) * | 2003-06-30 | 2007-06-27 | 日本オプネクスト株式会社 | 光伝送モジュール |
JP2005064129A (ja) * | 2003-08-08 | 2005-03-10 | Cmk Corp | リジッドフレックスプリント配線板 |
WO2006050446A1 (en) * | 2004-11-02 | 2006-05-11 | Sun Microsystems, Inc. | Structures and methods for proximity communication using bridge chips |
US20060223227A1 (en) * | 2005-04-04 | 2006-10-05 | Tessera, Inc. | Molding method for foldover package |
US7649245B2 (en) * | 2005-05-04 | 2010-01-19 | Sun Microsystems, Inc. | Structures and methods for a flexible bridge that enables high-bandwidth communication |
US20060289986A1 (en) * | 2005-06-27 | 2006-12-28 | Vadim Sherman | In-package connection between integrated circuit dies via flex tape |
JP2007287751A (ja) * | 2006-04-12 | 2007-11-01 | Toyoda Gosei Co Ltd | 発光装置 |
US7388756B1 (en) * | 2006-12-12 | 2008-06-17 | The Boeing Company | Method and system for angled RF connection using a flexible substrate |
JP5256620B2 (ja) * | 2007-02-26 | 2013-08-07 | 富士通オプティカルコンポーネンツ株式会社 | 光送信器および光受信器 |
JP2009081342A (ja) * | 2007-09-27 | 2009-04-16 | Sharp Corp | 多層プリント配線板とその製造方法 |
JP2010123680A (ja) * | 2008-11-18 | 2010-06-03 | Toshiba Corp | 半導体装置、接続導体及び半導体装置の製造方法 |
US8766099B2 (en) * | 2009-09-29 | 2014-07-01 | Apple Inc. | Component mounting structures for electronic devices |
US8508947B2 (en) * | 2010-10-01 | 2013-08-13 | Intel Corporation | Flex cable and method for making the same |
US9190720B2 (en) * | 2012-03-23 | 2015-11-17 | Apple Inc. | Flexible printed circuit structures |
US8998454B2 (en) * | 2013-03-15 | 2015-04-07 | Sumitomo Electric Printed Circuits, Inc. | Flexible electronic assembly and method of manufacturing the same |
US9402303B2 (en) * | 2013-06-03 | 2016-07-26 | Apple Inc. | Flexible printed circuit cables with slits |
-
2012
- 2012-10-29 US US13/662,659 patent/US9078352B2/en not_active Expired - Fee Related
-
2013
- 2013-09-14 TW TW102133355A patent/TWI539873B/zh not_active IP Right Cessation
- 2013-09-26 EP EP13186185.8A patent/EP2725611A3/en not_active Withdrawn
- 2013-10-14 CN CN201310477213.9A patent/CN103796421B/zh active Active
- 2013-10-23 JP JP2013219797A patent/JP5855068B2/ja not_active Expired - Fee Related
- 2013-10-23 KR KR1020130126567A patent/KR101594218B1/ko not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1278451C (zh) * | 2001-06-14 | 2006-10-04 | 帕瑞康技术公司 | 用于对各向异性导电弹性材料预加应力的设备和方法 |
US7838409B2 (en) * | 2005-05-04 | 2010-11-23 | Oracle America, Inc. | Structures and methods for an application of a flexible bridge |
US20080225476A1 (en) * | 2006-01-11 | 2008-09-18 | Chris Karabatsos | Tab wrap foldable electronic assembly module and method of manufacture |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107732651A (zh) * | 2016-08-12 | 2018-02-23 | 美国亚德诺半导体公司 | 光发射器封装件 |
US10459157B2 (en) | 2016-08-12 | 2019-10-29 | Analog Devices, Inc. | Optical emitter packages |
Also Published As
Publication number | Publication date |
---|---|
CN103796421B (zh) | 2017-04-12 |
JP5855068B2 (ja) | 2016-02-09 |
EP2725611A3 (en) | 2018-01-24 |
US9078352B2 (en) | 2015-07-07 |
JP2014090170A (ja) | 2014-05-15 |
TWI539873B (zh) | 2016-06-21 |
EP2725611A2 (en) | 2014-04-30 |
TW201424487A (zh) | 2014-06-16 |
US20140118966A1 (en) | 2014-05-01 |
KR101594218B1 (ko) | 2016-02-15 |
KR20140056002A (ko) | 2014-05-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160721 Address after: Singapore Singapore Applicant after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: Milpitas, California Applicant before: LSI Corp. |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20181019 Address after: Singapore Singapore Patentee after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: Singapore Singapore Patentee before: Avago Technologies General IP (Singapore) Pte. Ltd. |
|
TR01 | Transfer of patent right |