CN103782380B - 半导体模块 - Google Patents

半导体模块 Download PDF

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Publication number
CN103782380B
CN103782380B CN201280039872.8A CN201280039872A CN103782380B CN 103782380 B CN103782380 B CN 103782380B CN 201280039872 A CN201280039872 A CN 201280039872A CN 103782380 B CN103782380 B CN 103782380B
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CN
China
Prior art keywords
electrode
terminal
electrode pattern
semiconductor element
semiconductor module
Prior art date
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Application number
CN201280039872.8A
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English (en)
Chinese (zh)
Other versions
CN103782380A (zh
Inventor
图子祐辅
村上善则
谷本智
佐藤伸二
松井康平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Nissan Motor Co Ltd
Original Assignee
Fuji Electric Co Ltd
Nissan Motor Co Ltd
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Publication of CN103782380A publication Critical patent/CN103782380A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5438—Dispositions of bond wires the bond wires having multiple connections on the same bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5453—Dispositions of bond wires connecting between multiple bond pads on a chip, e.g. daisy chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Inverter Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
CN201280039872.8A 2011-08-25 2012-08-24 半导体模块 Active CN103782380B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011184019A JP5798412B2 (ja) 2011-08-25 2011-08-25 半導体モジュール
JP2011-184019 2011-08-25
PCT/JP2012/071398 WO2013027819A1 (ja) 2011-08-25 2012-08-24 半導体モジュール

Publications (2)

Publication Number Publication Date
CN103782380A CN103782380A (zh) 2014-05-07
CN103782380B true CN103782380B (zh) 2019-12-13

Family

ID=47746554

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280039872.8A Active CN103782380B (zh) 2011-08-25 2012-08-24 半导体模块

Country Status (5)

Country Link
US (1) US8921998B2 (https=)
EP (1) EP2750184B1 (https=)
JP (1) JP5798412B2 (https=)
CN (1) CN103782380B (https=)
WO (1) WO2013027819A1 (https=)

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JP2016012973A (ja) * 2014-06-27 2016-01-21 株式会社オートネットワーク技術研究所 回路装置
US10522517B2 (en) 2014-07-03 2019-12-31 Nissan Motor Co., Ltd. Half-bridge power semiconductor module and manufacturing method therefor
CN106062949B (zh) 2014-09-17 2018-11-30 富士电机株式会社 半导体模块
JP2016061661A (ja) * 2014-09-17 2016-04-25 富士電機株式会社 圧力センサ装置および圧力センサ装置の製造方法
JP6327105B2 (ja) * 2014-10-17 2018-05-23 三菱電機株式会社 半導体装置
US10756057B2 (en) * 2014-11-28 2020-08-25 Nissan Motor Co., Ltd. Half-bridge power semiconductor module and method of manufacturing same
JP2016115900A (ja) * 2014-12-18 2016-06-23 三菱電機株式会社 半導体モジュールおよび半導体装置
CN104867888A (zh) * 2015-05-04 2015-08-26 嘉兴斯达半导体股份有限公司 一种高散热性SiC的功率模块
WO2017002390A1 (ja) * 2015-06-30 2017-01-05 シャープ株式会社 回路モジュール
EP3226014B1 (en) * 2016-03-30 2024-01-10 Mitsubishi Electric R&D Centre Europe B.V. Method for estimating a level of damage or a lifetime expectation of a power semiconductor module comprising at least one die
US10404186B2 (en) 2016-10-27 2019-09-03 General Electric Company Power module systems and methods having reduced common mode capacitive currents and reduced electromagnetic interference
JP6809294B2 (ja) * 2017-03-02 2021-01-06 三菱電機株式会社 パワーモジュール
JP2018195694A (ja) * 2017-05-17 2018-12-06 株式会社Ｓｏｋｅｎ 電力変換器
JP6888468B2 (ja) * 2017-08-01 2021-06-16 富士電機株式会社 鉄道車両用電力変換装置
JP7252705B2 (ja) * 2017-09-28 2023-04-05 デンカ株式会社 多層回路基板及びその製造方法
JP2019091804A (ja) 2017-11-15 2019-06-13 シャープ株式会社 パワー半導体モジュールおよび電子機器
JP6954029B2 (ja) * 2017-11-15 2021-10-27 富士電機株式会社 電力変換装置および鉄道車両用電力変換装置
US10411609B2 (en) * 2017-12-22 2019-09-10 Panasonic Intellectual Property Management Co., Ltd. Substrate mounted inverter device
CN111199959B (zh) * 2018-11-19 2021-11-02 台达电子企业管理（上海）有限公司 功率模块的封装结构
WO2020261433A1 (ja) * 2019-06-26 2020-12-30 三菱電機株式会社 半導体装置および電力変換装置
TWI735179B (zh) * 2020-03-11 2021-08-01 佳世達科技股份有限公司 電子裝置與其減低漏電流方法
JP7318615B2 (ja) * 2020-09-11 2023-08-01 トヨタ自動車株式会社 電力変換装置
FR3131503B1 (fr) * 2021-12-28 2025-09-12 Thales Sa Composant de puissance à filtrage local et convertisseur mettant en œuvre plusieurs composants de puissance à filtrage local
CN114725055A (zh) * 2022-02-28 2022-07-08 华为数字能源技术有限公司 一种功率模块、电力系统和电子设备
EP4519918A1 (en) * 2022-05-19 2025-03-12 Huawei Digital Power Technologies Co., Ltd. Power converter package with shielding against common mode conducted emissions
JP2024015805A (ja) 2022-07-25 2024-02-06 マツダ株式会社 スイッチングデバイスおよびスイッチングモジュール
CN120072785A (zh) * 2023-11-28 2025-05-30 华为数字能源技术有限公司 功率模组以及光伏优化器

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Also Published As

Publication number Publication date
EP2750184A4 (en) 2015-08-26
JP5798412B2 (ja) 2015-10-21
CN103782380A (zh) 2014-05-07
EP2750184B1 (en) 2020-10-07
US8921998B2 (en) 2014-12-30
EP2750184A1 (en) 2014-07-02
US20140159225A1 (en) 2014-06-12
WO2013027819A1 (ja) 2013-02-28
JP2013045974A (ja) 2013-03-04

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