CN103765447B - 带有加固性电子模块的接触‑非接触混合型集成电路卡 - Google Patents

带有加固性电子模块的接触‑非接触混合型集成电路卡 Download PDF

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CN103765447B
CN103765447B CN201280042198.9A CN201280042198A CN103765447B CN 103765447 B CN103765447 B CN 103765447B CN 201280042198 A CN201280042198 A CN 201280042198A CN 103765447 B CN103765447 B CN 103765447B
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皮埃尔·贝纳托
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    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
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    • G06—COMPUTING; CALCULATING OR COUNTING
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    • G06K19/07773—Antenna details
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/481—Disposition
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Abstract

本发明涉及一种接触非接触混合型智能卡，包括由多个层构成的卡主体，其中称为支承层(40)的一个层支承由至少一个线圈构成的印制天线(41)并且支承集成电路模块，该集成电路模块通过分别位于天线线圈的内端部(45)和外端部(46)的延长部分上的两个内部和外部连接接触片(43，44)连接至所述印制天线，该模块位于卡上的由卡的第一侧面、卡的与所述第一侧面垂直的第二侧面、与卡的所述第一侧面平行的第一线以及与卡的所述第二侧面平行的第二线所限定的部分中。被连接到内部接触片(43)的天线线圈的内端部(45)全部位于所述部分中，以使得在卡承受弯曲应力或/和扭曲应力时模块和天线之间的连接不会被折断。所述连接接触片是通过在支承层上印制重叠的至少两层(43‑1，43‑2)导电墨而实现的，第一层墨包括未涂覆墨的空间以便使第二层透过这些空间更好连接到支承层。

Description

带有加固性电子模块的接触-非接触混合型集成电路卡
技术领域
本发明涉及一种非接触型射频识别设备(RFID)，并且尤其涉及带有加固性集成电路模块的接触-非接触混合型集成电路卡及其制造方法。
背景技术
非接触型RFID设备为由天线和被连接到天线端子的集成电路构成的设备。集成电路通常不被供电并且通过在读取器天线和RFID设备的天线之间的电磁耦合接收它的能量，在RFID设备和读取器之间交换信息，并且更具体地，被存储于集成电路中的信息与对物品拥有者的识别有关，在物品上带有RFID设备和进入受控访问区域的许可。
接触-非接触混合型集成电路卡为非接触RFID设备，区别在于与读取器的数据交换还可通过被连接到集成电路的卡的平齐导电区上的触点而实现。因此集成电路被封装在模块中，模块的外表面具有平齐的接触区。集成电路还被连接到用于与卡的天线进行连接的模块的内表面上。因此，集成电路被连接到双面模块的两个面上，以便在封装后形成双面集成电路模块或双面电子模块。从而，相较于其中集成电路更经常被平齐卡主体的非接触型集成电路，在卡上的电子模块和因此集成电路的强度被弱化。因此接触-非接触混合型卡的主要问题是它们的脆弱性。事实上，模块为不弯曲的刚性元件。因此，应力被围绕模块集中，更具体地沿位于离卡的对称轴线最近的内部边缘及由此在卡的中央被集中。通常，接触-非接触混合型集成电路卡的制造方法包括如下步骤：
-在支承件上制造天线的步骤，
-将卡主体层压到天线支承件上的步骤，包括在支承件的各个侧上焊接一片或多片塑料材料，通过热压成型构成卡主体，
-腔体铣削步骤，包括在卡主体上钻出腔体，该腔体允许容纳由集成电路和双面电路构成的模块，该腔体包括用于接纳集成电路的较小内部部分和用于接纳双面模块的较长外部部分，铣削允许释放天线的连接接触片，以及
-模块的插入步骤，包括使用允许固定模块的粘胶和允许将模块连接到连接接触片的导电胶，以及将模块定位在为此目的所提供的腔体中。
根据现行标准定义的准则对接触-非接触混合型集成电路卡进行弯曲和扭曲测试。第一类型的接触-非接触混合型集成电路卡为单体式卡，其中塑料材料的天线支承件被插入在塑料材料的两个层之间，这两个层构成卡主体的上面和下面并在热压下通过层压热封。通过导电胶或允许建立欧姆接触的等效部件将模块连接到天线。
该类型的卡拥有更大的整体刚度。因此，当该类型的卡承受弯曲和/或扭曲机械应力时，应力不在卡上留下痕迹，但是卡沿应力表现最明显的轴线、即沿模块断裂。
另一种类型的卡具有防止断裂的纸制天线支承件。该类型的卡呈现的缺点是提供的电子模块在卡上的脆弱强度。事实上，纤维材料(如纸)的天线支承件的优点是保留对卡弯折的“记忆”，但是在胶缝(胶缝把模块保持在卡上并因此垂直于卡主体较薄部分)之下的纸张分层产生多个褶皱之后，致使卡缺乏有利的内部粘结力，因此引起电子模块和天线的连接断开。通常，与天线断开连接的模块的第一触点位于更接近卡中央的地方。
发明内容
本发明的目的是提供一种接触-非接触混合型集成电路卡，其改进了这些缺点，也就是说，能够抵抗弯曲测试而不会使卡主体破损或使模块和天线之间的连接或天线断裂。
本发明的另一目的是提供一种制造这样的设备的方法。
因此本发明的目的是提供一种接触非接触混合型智能卡，包括由多个层构成的卡主体，其中称为支承层的一个层支承由至少一个线圈构成的印制天线并且支承集成电路模块，该集成电路模块通过分别位于天线线圈的内端部和外端部的延长部分上的两个内部和外部连接接触片连接至所述印制天线，所述模块位于卡上的由卡的第一侧面、卡的与所述第一侧面垂直的第二侧面、与卡的所述第一侧面平行的第一线以及与卡的所述第二侧面平行的第二线所限定的部分中。根据本发明的主要特征，被连接到所述内部接触片的天线线圈的内端部全部位于所述部分中，以使得在卡承受弯曲应力或/和扭曲应力时模块和天线之间的连接不会被折断。此外，所述连接接触片是通过在所述支承层上印制至少两层导电墨而实现的，第一层墨包括未涂覆墨的空间。
附图说明
参照附图，通过对接下来的描述的阅读，本发明的目的、目标和特性将会变得更加清楚，在附图中：
图1为接触-非接触混合型集成电路卡的俯视图，
图2表示根据现有技术的双面电子模块的剖面，
图3表示从集成电路侧看到的根据现有技术的双面电子模块，
图4是根据本发明的带有接触-非接触混合型集成电路的卡的天线支承件的俯视图，
图5为根据本发明的卡的不同构成层的剖面，
图6表示提供有模块的根据本明的卡的剖面，
图7表示根据本发明的模块和天线接触片的透视俯视图。
具体实施方式
总体而言，在接下来的描述中，比起通过“外部”指示的同一元件的相对边缘或侧面，通过“内部”侧面或边缘指示的元件的边缘和侧面在几何上更接近于位于卡的中央。
根据图1的图示，接触非接触混合型集成电路卡1具有模块10。卡的外部尺寸对应于在ISO7810标准中所定义的“信用卡”的格式。卡包括垂直于两个较长侧面7和8的两个较短侧面5和6。模块10包括两个较短边缘23和24以及两个较长边缘25和27。在机械测试时、更具体地在卡的弯曲测试时，最受激励(sollicités)的卡的轴线、即应力最大的地方用虚线3和4表示。沿着模块的内部边缘23和25定位的线3和4分别平行于卡的侧面6和8。卡的断裂区位于这些线3和4上并且在沿着模块的内部边缘的连续线处。模块位于卡上的由卡的第一侧面6、垂直于第一侧面6的卡的第二侧面8、线3和第二线4限定的部分中。
根据图2，根据本发明的设备包括由不导电支承件19构成的电子模块10，支承件19在其第一表面上载有适于与读取设备的读取头部的触点相连的平齐的接触面12，并且在另一表面上载有适于被连接到卡的天线的触点13和14。接下来使集成电路15既通过为此提供的开孔11借助穿过支承件的焊金线16连接到平齐的接触面12，又连接到触点13和14，触点13和14还适于通过焊金线17连接到天线的触点13和14。然后通过从上面浇铸的树脂18保护和密封集成电路15以及线16和17。当树脂变硬时，集成电路和线就被封装，仅仅是用于与天线的接触片相连的触点13和14的一部分被显露，如图3所示。模块10的触点13和14位于树脂18的两侧并且分别与模块10的较短边缘23和24平行。这样的模块被称为双面集成电路模块，这是因为在其两个表面上包括有触点，与在接触型集成电路卡的实施中使用的仅由平齐的接触区组成的单面集成电路模块相反。模块是刚性的以使得它在卡受到弯曲或扭曲应力时不会弯曲。在集成电路15与触点12、13和14之间的连接因此受到保护而不被损坏。
根据图4，天线41被实施于支承层40上。天线41由多个导电材料线圈形成。形状基本上为长方形的线圈包括多个平直部分以便沿卡的边缘伸展。天线的线圈在绝缘桥48的位置处交叉。线圈通过两个端部45和46终止，端部45和46分别通过用于与模块的两个触点13和14电连接的两个连接接触片43和44形成天线的延长的两个平直部分。天线线圈的两个端部45和46分别被称为内端部和外端部。天线的线圈和连接接触片是通过丝网印制、苯胺印制、照相凹印、胶版印制和喷墨类型的印制而实施的，喷墨类型的印制使用填充有导电颗粒(如银或金)的环氧墨类型的导电墨或使用导电聚合物。支承层40优选为如纸或合成纸(Teslin类型)这样不流动的的材料(也就是说在温度的影响下不变形)。
天线线圈的内端部45位于支承件上以便不会切割线3。因此，使端部45延伸的线圈部分49在尽可能远离模块的内部边缘23的同时切割线3。该配置使端部45尽可能远离断裂区域。因此考虑其它天线线圈的位置，线圈部分49和线3的交叉点位于最接近卡边缘的地方。在围绕卡的横向对称轴线对卡进行弯曲测试时，位于最接近卡中央的内部连接接触片43是在机械上最受力的。位于卡的边缘6附近的外部连接接触片44几乎不承受机械应力。根据本发明，通过将至少两个墨层印制到天线支承件40上制造两个连接接触片43和44。构成外部连接接触片44的墨层彼此重叠并且全部具相同的形状和相同的尺寸。接触片44的尺寸使得其内表面充分包含摸块10的接触表面14。更确切地，接触片44的表面至少相当于模块10的接触表面14的两倍。由层43-1和43-2指示的构成接触片43的墨层相互重叠并且它们不具有相同的尺寸。所述接触片43的第一墨层43-1的表面大于相继的墨层的表面。构成所述接触片43的第一层43-1之后的第二层和后续的层与构成连接接触片44的层的表面具有相同的面积。连接接触片43的第一墨层43-1被打孔。根据本发明的优选实施方式，墨层43-1以网格形式实施，网格的网眼中具有其中没有墨的空间47。在不超出本发明范围的情况下，这些空间可以为不同的形状。通过将第二层的一部分墨穿过第一层的空间47直接粘贴到天线支承件上，第一层的该配置允许更好地将第二层接合到支承件上，以便避免连接接触片的导电墨层脱离。第二墨层43-2的表面积小于墨层43-1的表面积并且等于接触片44的墨层表面积。一旦将所有的墨层重叠，天线接触片的墨厚度被包括在50μm和80μm之间。
根据本发明的卡包括图5中的以剖面示意的多个层。该图不是按比例的，仅示出了两个连接接触片43和44。在天线的支承层40上并且更准确地在其上实施天线的层40的表面上依次设置聚氯乙烯(PVC)层61、聚酯(PET)层63和覆盖层65。在天线支承层40的另一表面上依次设置有PET层72和覆盖层64。
层压步骤包括将层40、61、63、65、62和64一起堆叠并且在约150℃温度和约20巴的压力下对其进行热处理。在该压力和温度的作用下，PVC层61开始软化并且将覆盖天线线圈和天线接触片43和44。两个PET层使整体硬化、，更具体地是未穿有其中容置模块的腔体的PET层62。构成卡的层的该配置的优点是同时给予卡强度和柔韧性，以使卡在弯曲和/或扭曲的测试过程中不会断裂。
接下来的步骤包括铣削用于接纳模块10的腔体并将模块粘贴在腔体中。
通过图7上的透视，在模块10处于被连接到天线接触片的位置时可以见到模块10。接触片43和44重叠在模块10的触点13和14上。天线线圈的端部45和46与模块的较短侧面23和24平行并且垂直于模块的较长侧面25和27。因此，天线线圈的端部45和46不切割卡的断裂区域，也就是说弯曲应力最大的区域。如果将天线线圈的端部45延长到线圈的轴线上(根据附图和所描述的实施方式，该轴线是直线)，该端部45将穿过由模块限定的表面。端部45的轴线和连接接触片43被配置为使得其与模块10相交叉并切割其较长外部边缘27。
天线线圈的端部的该配置允许使天线远离沿模块的边缘23定位的断裂区域。而且，端部45位于在模块内定位的内部连接接触片43部分的延长线上。通过这种方式，天线线圈的端部45不会有在卡承受弯曲机械应力时被切割的风险。
接触片44从模块的较短外边缘24一侧超出模块。第一墨层43-1的表面从模块的内边缘23和较长外边缘27侧超出模块。

Claims (8)

1.一种接触非接触混合型智能卡(1)，包括由多个层构成的卡主体，其中称为支承层(40)的一个层支承由至少一个线圈构成的印制天线(41)并且支承集成电路模块(10)，该集成电路模块(10)通过分别位于天线线圈的内端部(45)和外端部(46)的延长部分上的两个内部和外部连接接触片(43，44)连接至所述印制天线，所述模块位于卡上的由卡的第一侧面(6)、卡的与所述第一侧面垂直的第二侧面(8)、与卡的所述第一侧面(6)平行的第一线(3)以及与卡的所述第二侧面平行的第二线(4)所限定的部分中，
其特征在于，被连接到所述内部连接接触片(43)的天线线圈的所述内端部(45)全部位于所述部分中，以使得在卡承受弯曲应力或/和扭曲应力时模块和天线之间的连接不会被折断，以及所述内部连接接触片(43)是通过在所述支承层(40)上印制至少两层导电墨而实现的，第一层墨(43-1)包括未涂覆墨的空间(47)。
2.根据权利要求1所述的卡，其中，所述内端部(45)的延长部分(49)与所述第一线(3)相交叉，以及它们的交叉点位于卡上离所述模块(10)的内边缘(23)尽可能远处。
3.根据权利要求1或2所述的卡，其中，所述内端部(45)位于被定位在模块内部的所述内部连接接触片(43)部分的延长线上。
4.根据权利要求1或2所述的卡，其中，构成所述内部连接接触片(43)的第一层(43-1)后面的第二层和其它层具有与构成所述外部连接接触片(44)的层相同的表面积。
5.根据权利要求1或2所述的卡，其中，所述内部和外部连接接触片(43，44)的厚度被包括在50μm和80μm之间。
6.根据权利要求1或2所述的卡，其中，所述天线(41)和所述模块(10)被嵌入卡主体的位于所述支承层(40)的第一表面上的聚氯乙烯PVC层(61)中，所述第一表面是上面印制有所述天线的表面。
7.根据权利要求6所述的卡，其中，支承层(40)的第二表面被涂覆有聚酯(PET)层(62)。
8.根据权利要求6所述的卡，其中，所述PVC层(61)被涂覆有PET层(63)。
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