GB2380068B - Low Conductive Ink Composition - Google Patents

Low Conductive Ink Composition

Info

Publication number
GB2380068B
GB2380068B GB0221437A GB0221437A GB2380068B GB 2380068 B GB2380068 B GB 2380068B GB 0221437 A GB0221437 A GB 0221437A GB 0221437 A GB0221437 A GB 0221437A GB 2380068 B GB2380068 B GB 2380068B
Authority
GB
United Kingdom
Prior art keywords
ink composition
conductive ink
low conductive
low
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0221437A
Other versions
GB2380068A (en
GB0221437D0 (en
Inventor
James Colin Burridge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JAYBEE GRAPHICS
SILCON TECHNOLOGIES
Original Assignee
JAYBEE GRAPHICS
SILCON TECHNOLOGIES
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB0122351A external-priority patent/GB0122351D0/en
Application filed by JAYBEE GRAPHICS, SILCON TECHNOLOGIES filed Critical JAYBEE GRAPHICS
Priority to GB0221437A priority Critical patent/GB2380068B/en
Publication of GB0221437D0 publication Critical patent/GB0221437D0/en
Publication of GB2380068A publication Critical patent/GB2380068A/en
Application granted granted Critical
Publication of GB2380068B publication Critical patent/GB2380068B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB0221437A 2001-09-15 2002-09-16 Low Conductive Ink Composition Expired - Fee Related GB2380068B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0221437A GB2380068B (en) 2001-09-15 2002-09-16 Low Conductive Ink Composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0122351A GB0122351D0 (en) 2001-09-15 2001-09-15 "Printing method"
GB0221437A GB2380068B (en) 2001-09-15 2002-09-16 Low Conductive Ink Composition

Publications (3)

Publication Number Publication Date
GB0221437D0 GB0221437D0 (en) 2002-10-23
GB2380068A GB2380068A (en) 2003-03-26
GB2380068B true GB2380068B (en) 2005-08-03

Family

ID=26246552

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0221437A Expired - Fee Related GB2380068B (en) 2001-09-15 2002-09-16 Low Conductive Ink Composition

Country Status (1)

Country Link
GB (1) GB2380068B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0228308D0 (en) * 2002-12-04 2003-01-08 Sensopad Technologies Ltd Construction of aerials with low magnetic field distortion
EP1855514A1 (en) * 2006-05-10 2007-11-14 AMC Centurion AB Production of antenna devices
EP1914832A1 (en) * 2006-10-17 2008-04-23 Laird Technologies AB A method of production of an antenna pattern
FR2977958A1 (en) * 2011-07-12 2013-01-18 Ask Sa CONTACT-CONTACTLESS HYBRID INTEGRATED CIRCUIT BOARD WITH REINFORCED HOLDING OF THE ELECTRONIC MODULE
CN115635765B (en) * 2022-12-26 2023-03-07 西北电子装备技术研究所(中国电子科技集团公司第二研究所) Ceramic packaging tube shell pore wall metallization die and screen printing equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2050702A (en) * 1976-07-21 1981-01-07 Shipley Co Printed circuits
US4517227A (en) * 1981-11-17 1985-05-14 Rhone-Poulenc Specialites Chimiques Forming of thick-layer, hybrid electronic printed circuits
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4871583A (en) * 1984-12-21 1989-10-03 U.S. Philips Corporation Housing for an electronic device
WO1996034360A1 (en) * 1995-04-25 1996-10-31 Interprint Formularios Ltda. Memory card and method of producing same
EP1099564A1 (en) * 1999-11-10 2001-05-16 Oriel Technologicas, S.A. Emblem with luminous motifs

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2050702A (en) * 1976-07-21 1981-01-07 Shipley Co Printed circuits
US4517227A (en) * 1981-11-17 1985-05-14 Rhone-Poulenc Specialites Chimiques Forming of thick-layer, hybrid electronic printed circuits
US4640981A (en) * 1984-10-04 1987-02-03 Amp Incorporated Electrical interconnection means
US4871583A (en) * 1984-12-21 1989-10-03 U.S. Philips Corporation Housing for an electronic device
WO1996034360A1 (en) * 1995-04-25 1996-10-31 Interprint Formularios Ltda. Memory card and method of producing same
EP1099564A1 (en) * 1999-11-10 2001-05-16 Oriel Technologicas, S.A. Emblem with luminous motifs

Also Published As

Publication number Publication date
GB2380068A (en) 2003-03-26
GB0221437D0 (en) 2002-10-23

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080916