JP2014521164A - 強化された電子モジュールを備えるハイブリッド接触−非接触型スマートカード - Google Patents
強化された電子モジュールを備えるハイブリッド接触−非接触型スマートカード Download PDFInfo
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- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
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- G—PHYSICS
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- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/4805—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H01—ELECTRIC ELEMENTS
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- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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Abstract
【解決手段】アンテナ(41)と集積回路モジュール(10)とを支持する支持層(40)を有する複数の層から構成されたカード本体を備えており、そのモジュールが、カードの第1の側面(6)及び第2の側面(8)と、第1のライン(3)及び第2のライン(4)とにより定まる部分内に位置するハイブリッド接触−非接触型スマートカード(1)において、カードが曲げ応力やねじれ応力を受けたときにモジュール(10)とアンテナ(41)との間の接続が破壊されることがないように、内側端部(45)は部分内の全域に位置するとともに、接点(43、44)は、インクにより覆われていないスペース(47)を含む支持層(40)上の電導性インクの印刷から形成される。
【選択図】図1
Description
・ホットプレス成形法によって、1枚以上のプラスチック材料のシートを支持体のそれぞれの面で溶接し、カード本体を形成することにより、アンテナ支持体上にカード本体を積層する工程、
・カード本体、集積回路によって形成されたモジュールを収容するように設計された空洞、及び両面回路のうちの1つを穿孔することによる切削工程であって、空洞が集積回路を収容する比較的小さな内側部分、及び両面モジュールを収容する比較的大きな外側部分を含み、切削工程によってアンテナの接点を切削及び除去することができる切削工程、
・接着剤を使用し、モジュールと導電性接着剤とを固定して、モジュールを接点に接続し、この目的用の空洞にモジュールを配置することによる、モジュール挿入工程。
3、4 ライン
6、8 側面
10 集積回路モジュール
40 支持層
41 アンテナ
43 内側接点
44 外側接点
45 内側端部
46 外側端部
Claims (8)
- 支持層(40)と呼ばれる1つの層が、少なくとも1巻回からなる印刷されたアンテナ(41)と、前記アンテナに、そのアンテナの巻回の内側先端及び外側先端(45、46)の延長にそれぞれ位置する2つの内側接点及び外側接点(43、44)により接続された集積回路モジュール(10)と、を支持する複数の層から構成されたカード本体を備え、
前記モジュールが、カードの第1の側面(6)及びその第1の側面と垂直なカードの第2の側面(8)と、カードの前記第1の側面(6)と平行な第1のライン(3)及びカードの前記第2の側面と平行な第2のライン(4)と、により定まる部分内でカード上に位置するハイブリッド接触−非接触型スマートカード(1)において、
前記内側接点(43)に接続されたアンテナの巻回の前記内側端部(45)は、カードが曲げ応力及び/又はねじれ応力を受けたときにモジュールとアンテナとの間の接続が破壊されることがないように、前記部分内の全域に位置し、
前記接点(43、44)は、前記支持層(40)上の少なくとも2つの層の電導性インクの印刷から形成されるとともに、そのインクの第1の層(43−1)が、インクにより覆われていないスペース(47)を含むことを特徴とするカード。 - 前記端部(45)の延長(49)が前記ライン(3)と交差するとともに、前記端部(45)が前記ライン(3)と交差し、かつそれらの交点が前記モジュール(10)の前記内側エッジ部(23)のカード上において可能な限り遠く離れて位置する請求項1に記載のカード。
- 前記端部(45)が、モジュール内に位置する前記内側接点(43)の部分の延長内に位置する請求項1又は2に記載のカード。
- 前記接点(43)の第1構成層(43−1)の第2層及びそれに続く層が、前記接点(44)の構成層と同じ表面積を有する請求項1〜3のいずれか1項に記載のカード。
- 前記接点(43、44)の厚さが50〜80μmである請求項1〜4のいずれか1項に記載のカード。
- 前記アンテナ(41)と前記モジュール(10)とが、カード本体の層であって、前記アンテナが印刷された前記支持層(40)の第1の面上に位置するポリ塩化ビニル(PVC)(61)に包まれている請求項1〜5のいずれか1項に記載のカード。
- 支持層(40)の第2の面がポリエステル(PET)からなる層により覆われている請求項6に記載のカード。
- 前記PVCからなる層(61)がPETからなる層により覆われている請求項1〜7のいずれか1項に記載のカード。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1102195 | 2011-07-12 | ||
FR1102195A FR2977958A1 (fr) | 2011-07-12 | 2011-07-12 | Carte a circuit integre hybride contact-sans contact a tenue renforcee du module electronique |
PCT/FR2012/000287 WO2013007897A2 (fr) | 2011-07-12 | 2012-07-12 | Carte à circuit intégré hybride contact - sans contact a tenue renforcée du module électronique |
Publications (1)
Publication Number | Publication Date |
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JP2014521164A true JP2014521164A (ja) | 2014-08-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014519598A Pending JP2014521164A (ja) | 2011-07-12 | 2012-07-12 | 強化された電子モジュールを備えるハイブリッド接触−非接触型スマートカード |
Country Status (11)
Country | Link |
---|---|
US (1) | US20130026238A1 (ja) |
EP (1) | EP2732406B1 (ja) |
JP (1) | JP2014521164A (ja) |
KR (1) | KR20140053116A (ja) |
CN (1) | CN103765447B (ja) |
BR (1) | BR112014000667A2 (ja) |
CA (1) | CA2841742C (ja) |
FR (1) | FR2977958A1 (ja) |
MX (1) | MX2014000449A (ja) |
TW (1) | TWI608423B (ja) |
WO (1) | WO2013007897A2 (ja) |
Cited By (1)
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JP2021117813A (ja) * | 2020-01-28 | 2021-08-10 | 凸版印刷株式会社 | デュアルicカード |
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Publication number | Priority date | Publication date | Assignee | Title |
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FR2996944B1 (fr) * | 2012-10-15 | 2018-05-04 | Smart Packaging Solutions Sps | Module electronique simplifie pour carte a puce a double interface de communication |
FR3002108A1 (fr) * | 2013-02-14 | 2014-08-15 | Ask Sa | Procede de fabrication d'une antenne pour dispositif radiofrequence sur support mince et dispositif comprenant une antenne ainsi obtenue |
US9536188B2 (en) | 2014-04-01 | 2017-01-03 | Nxp B.V. | Dual-interface IC card components and method for manufacturing the dual-interface IC card components |
US9424507B2 (en) | 2014-04-01 | 2016-08-23 | Nxp B.V. | Dual interface IC card components and method for manufacturing the dual-interface IC card components |
GB2525869A (en) * | 2014-05-06 | 2015-11-11 | Johnson Electric Sa | Smart card module |
US10984304B2 (en) | 2017-02-02 | 2021-04-20 | Jonny B. Vu | Methods for placing an EMV chip onto a metal card |
USD877739S1 (en) * | 2017-09-15 | 2020-03-10 | uQontrol, Inc. | Smartcard with Q-shaped contact pad |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
USD956760S1 (en) * | 2018-07-30 | 2022-07-05 | Lion Credit Card Inc. | Multi EMV chip card |
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- 2012-07-12 CA CA2841742A patent/CA2841742C/fr not_active Expired - Fee Related
- 2012-07-12 TW TW101125231A patent/TWI608423B/zh not_active IP Right Cessation
- 2012-07-12 US US13/547,827 patent/US20130026238A1/en not_active Abandoned
- 2012-07-12 EP EP12758516.4A patent/EP2732406B1/fr not_active Not-in-force
- 2012-07-12 JP JP2014519598A patent/JP2014521164A/ja active Pending
- 2012-07-12 WO PCT/FR2012/000287 patent/WO2013007897A2/fr active Application Filing
- 2012-07-12 KR KR1020147001585A patent/KR20140053116A/ko not_active Application Discontinuation
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- 2012-07-12 CN CN201280042198.9A patent/CN103765447B/zh not_active Expired - Fee Related
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JP2021117813A (ja) * | 2020-01-28 | 2021-08-10 | 凸版印刷株式会社 | デュアルicカード |
JP7424073B2 (ja) | 2020-01-28 | 2024-01-30 | Toppanホールディングス株式会社 | デュアルicカード |
Also Published As
Publication number | Publication date |
---|---|
WO2013007897A3 (fr) | 2013-03-28 |
BR112014000667A2 (pt) | 2017-02-14 |
FR2977958A1 (fr) | 2013-01-18 |
TW201319951A (zh) | 2013-05-16 |
CN103765447B (zh) | 2017-02-15 |
MX2014000449A (es) | 2014-04-10 |
WO2013007897A2 (fr) | 2013-01-17 |
CA2841742A1 (fr) | 2013-01-17 |
KR20140053116A (ko) | 2014-05-07 |
EP2732406A2 (fr) | 2014-05-21 |
US20130026238A1 (en) | 2013-01-31 |
CA2841742C (fr) | 2019-10-22 |
TWI608423B (zh) | 2017-12-11 |
CN103765447A (zh) | 2014-04-30 |
EP2732406B1 (fr) | 2016-01-13 |
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