CN103650116B - 衬底冷冻干燥装置和方法 - Google Patents

衬底冷冻干燥装置和方法 Download PDF

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Publication number
CN103650116B
CN103650116B CN201280026928.6A CN201280026928A CN103650116B CN 103650116 B CN103650116 B CN 103650116B CN 201280026928 A CN201280026928 A CN 201280026928A CN 103650116 B CN103650116 B CN 103650116B
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Prior art keywords
chamber
electrostatic chuck
drying
wet substrate
dry chemistry
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CN201280026928.6A
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Chinese (zh)
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CN103650116A (zh
Inventor
史蒂芬·M·施瑞德
戴安·海姆斯
艾伦·M·舍普
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201280026928.6A 2011-05-31 2012-05-29 衬底冷冻干燥装置和方法 Active CN103650116B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161491727P 2011-05-31 2011-05-31
US61/491,727 2011-05-31
US13/273,090 US9673037B2 (en) 2011-05-31 2011-10-13 Substrate freeze dry apparatus and method
US13/273,090 2011-10-13
PCT/US2012/039855 WO2012166727A2 (en) 2011-05-31 2012-05-29 Substrate freeze dry apparatus and method

Publications (2)

Publication Number Publication Date
CN103650116A CN103650116A (zh) 2014-03-19
CN103650116B true CN103650116B (zh) 2017-05-03

Family

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Family Applications (1)

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CN201280026928.6A Active CN103650116B (zh) 2011-05-31 2012-05-29 衬底冷冻干燥装置和方法

Country Status (5)

Country Link
US (1) US9673037B2 (https=)
JP (1) JP2014523636A (https=)
CN (1) CN103650116B (https=)
TW (1) TWI571948B (https=)
WO (1) WO2012166727A2 (https=)

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US10690413B2 (en) 2012-02-01 2020-06-23 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
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US12276454B2 (en) 2020-04-21 2025-04-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
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JP7010629B2 (ja) * 2017-08-31 2022-01-26 株式会社Ｓｃｒｅｅｎホールディングス 基板乾燥方法および基板処理装置
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Also Published As

Publication number Publication date
US20120304483A1 (en) 2012-12-06
US9673037B2 (en) 2017-06-06
JP2014523636A (ja) 2014-09-11
TW201308486A (zh) 2013-02-16
TWI571948B (zh) 2017-02-21
WO2012166727A2 (en) 2012-12-06
WO2012166727A3 (en) 2013-05-10
CN103650116A (zh) 2014-03-19

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