TWI571948B - 基板冷凍乾燥設備及方法 - Google Patents

基板冷凍乾燥設備及方法 Download PDF

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Publication number
TWI571948B
TWI571948B TW101119160A TW101119160A TWI571948B TW I571948 B TWI571948 B TW I571948B TW 101119160 A TW101119160 A TW 101119160A TW 101119160 A TW101119160 A TW 101119160A TW I571948 B TWI571948 B TW I571948B
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TW
Taiwan
Prior art keywords
drying
substrate
freeze
chamber
electrostatic chuck
Prior art date
Application number
TW101119160A
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English (en)
Chinese (zh)
Other versions
TW201308486A (zh
Inventor
史帝芬Ｍ 席拉德
黛安 海門斯
亞倫Ｍ 休普
Original Assignee
蘭姆研究公司
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Filing date
Publication date
Application filed by 蘭姆研究公司 filed Critical 蘭姆研究公司
Publication of TW201308486A publication Critical patent/TW201308486A/zh
Application granted granted Critical
Publication of TWI571948B publication Critical patent/TWI571948B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW101119160A 2011-05-31 2012-05-29 基板冷凍乾燥設備及方法 TWI571948B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161491727P 2011-05-31 2011-05-31
US13/273,090 US9673037B2 (en) 2011-05-31 2011-10-13 Substrate freeze dry apparatus and method

Publications (2)

Publication Number Publication Date
TW201308486A TW201308486A (zh) 2013-02-16
TWI571948B true TWI571948B (zh) 2017-02-21

Family

ID=47260252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101119160A TWI571948B (zh) 2011-05-31 2012-05-29 基板冷凍乾燥設備及方法

Country Status (5)

Country Link
US (1) US9673037B2 (https=)
JP (1) JP2014523636A (https=)
CN (1) CN103650116B (https=)
TW (1) TWI571948B (https=)
WO (1) WO2012166727A2 (https=)

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US9970708B2 (en) 2012-02-01 2018-05-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
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US9644891B2 (en) 2012-02-01 2017-05-09 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
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US12276454B2 (en) 2020-04-21 2025-04-15 Revive Electronics, LLC Methods and apparatuses for drying electronic devices
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Also Published As

Publication number Publication date
US20120304483A1 (en) 2012-12-06
US9673037B2 (en) 2017-06-06
JP2014523636A (ja) 2014-09-11
TW201308486A (zh) 2013-02-16
WO2012166727A2 (en) 2012-12-06
CN103650116B (zh) 2017-05-03
WO2012166727A3 (en) 2013-05-10
CN103650116A (zh) 2014-03-19

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