CN103649158B - 绝缘制剂 - Google Patents

绝缘制剂 Download PDF

Info

Publication number
CN103649158B
CN103649158B CN201280034287.9A CN201280034287A CN103649158B CN 103649158 B CN103649158 B CN 103649158B CN 201280034287 A CN201280034287 A CN 201280034287A CN 103649158 B CN103649158 B CN 103649158B
Authority
CN
China
Prior art keywords
filler
epoxy resin
another embodiment
composition
formulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280034287.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN103649158A (zh
Inventor
M·埃塞格希尔
W·J·哈里斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
Original Assignee
Dow Global Technologies LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies LLC filed Critical Dow Global Technologies LLC
Publication of CN103649158A publication Critical patent/CN103649158A/zh
Application granted granted Critical
Publication of CN103649158B publication Critical patent/CN103649158B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/027—Polycondensates containing more than one epoxy group per molecule obtained by epoxidation of unsaturated precursor, e.g. polymer or monomer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
CN201280034287.9A 2011-05-13 2012-04-13 绝缘制剂 Active CN103649158B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161485841P 2011-05-13 2011-05-13
US61/485,841 2011-05-13
PCT/US2012/033417 WO2012158291A1 (en) 2011-05-13 2012-04-13 Insulation formulations

Publications (2)

Publication Number Publication Date
CN103649158A CN103649158A (zh) 2014-03-19
CN103649158B true CN103649158B (zh) 2016-04-06

Family

ID=46001815

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280034287.9A Active CN103649158B (zh) 2011-05-13 2012-04-13 绝缘制剂

Country Status (10)

Country Link
US (1) US20140079953A1 (https=)
EP (1) EP2707411B1 (https=)
JP (1) JP6030125B2 (https=)
KR (1) KR101901473B1 (https=)
CN (1) CN103649158B (https=)
BR (1) BR112013029224B1 (https=)
CA (1) CA2835651A1 (https=)
MX (1) MX349112B (https=)
TW (1) TWI540146B (https=)
WO (1) WO2012158291A1 (https=)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196412B2 (en) * 2011-05-13 2015-11-24 Dow Global Technologies Llc Insulation formulations
US9845387B2 (en) * 2012-10-19 2017-12-19 Blue Cube Ip Llc Toughened epoxy thermosets containing core shell rubbers and polyols
DE102013205117A1 (de) * 2013-03-22 2014-09-25 Siemens Aktiengesellschaft Vergussmasse, Verwendung der Vergussmasse, thermisch gehärteter Komposit erhältlich aus der Vergussmasse und elektrische Maschine mit der Vergussmasse
JP6321934B2 (ja) * 2013-09-30 2018-05-09 マツダ株式会社 エンジン燃焼室に臨む部材表面の断熱層の製造方法
EP3170868B1 (en) * 2014-07-18 2019-04-24 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg, metal foil-clad laminate and printed wiring board
CN104200876A (zh) * 2014-08-09 2014-12-10 张传良 一种防火电缆用氧化镁填充料的制备方法
KR101808176B1 (ko) * 2016-04-07 2018-01-18 (주)창성 연자성몰딩액을 이용한 코일매립형인덕터의 제조방법 및 이를 이용하여 제조된 코일매립형인덕터
JP6748032B2 (ja) * 2017-06-06 2020-08-26 三菱電機株式会社 静止誘導器
KR102094296B1 (ko) * 2018-07-05 2020-03-27 (주)제니스월드 정전척용 흑색 세라믹 페이스트 조성물 및 이를 이용한 정전척
EP3843166A4 (en) * 2018-09-03 2021-10-27 LG Chem, Ltd. Encapsulation film
CN109401200A (zh) * 2018-10-29 2019-03-01 江苏宏鹏电气科技有限公司 一种用于母线槽内绝缘衬垫材料的制备配方
CN109687360B (zh) * 2018-11-27 2021-05-25 广东中讯通讯设备实业有限公司 一种绝缘性能好的硅芯管及其制备方法
EP3958305B1 (en) * 2020-08-17 2023-09-27 Infineon Technologies AG Power semiconductor module arrangement and method for producing the same
KR102876018B1 (ko) * 2024-04-03 2025-10-23 김주영 고강도 물성을 갖는 저점도의 진공함침 절연용 에폭시 수지조성물

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2924580A (en) 1957-08-08 1960-02-09 Union Carbide Corp Divinyl benzene dioxide compositions
US2982752A (en) * 1958-04-25 1961-05-02 Union Carbide Corp Composition comprising a polyepoxide and divinylbenzene dioxide
GB855025A (en) * 1958-10-11 1960-11-30 Union Carbide Corp Improvements in and relating to polymerisable epoxide compositions
NL259331A (https=) * 1959-12-24
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
US5189080A (en) * 1989-04-25 1993-02-23 Robert Bosch Gmbh Epoxy resin composition for encapsulating electric circuit components
JP2524011B2 (ja) * 1991-05-23 1996-08-14 株式会社日立製作所 高圧コイル注型用熱硬化性樹脂組成物、該組成物で注型、硬化してなるモ―ルドコイル、パネル
US5340890A (en) * 1993-01-28 1994-08-23 Shell Oil Company Cyclobutene anhydride-cured epoxy resin composition
US5898991A (en) * 1997-01-16 1999-05-04 International Business Machines Corporation Methods of fabrication of coaxial vias and magnetic devices
AU711786B2 (en) * 1997-05-16 1999-10-21 National Starch And Chemical Investment Holding Corporation Reactive radiation- or thermally-initiated cationically- curable epoxide monomers and compositions made from those monomers
DE19828248A1 (de) 1998-06-25 1999-12-30 Abb Corporate Research Ltd Bad Bei niedriger Temperatur härtende Epoxidharzsysteme aus Aminoglycidylverbindungen und cyclischen Carbonsäureanhydriden
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6500529B1 (en) * 2001-09-14 2002-12-31 Tonoga, Ltd. Low signal loss bonding ply for multilayer circuit boards
EP1331234B1 (de) 2002-01-28 2004-09-22 ABB Research Ltd. Vergussmasse auf der Basis duroplastischer Epoxidharze
US7311972B2 (en) * 2004-10-14 2007-12-25 Yazaki Corporation Filled epoxy resin compositions
US20060275608A1 (en) * 2005-06-07 2006-12-07 General Electric Company B-stageable film, electronic device, and associated process
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
EP2044138A1 (en) 2006-07-20 2009-04-08 ABB Research Ltd Hardenable epoxy resin composition
EP2064268A4 (en) * 2006-09-12 2013-05-01 Henkel Ag & Co Kgaa METHOD FOR CHANGING THE RHEOLOGY IN FILLED RESIN SYSTEMS BY MEANS OF CAVITATION
KR101440762B1 (ko) * 2007-02-06 2014-09-17 칼 짜이스 에스엠테 게엠베하 마이크로리소그래피 투영 노광 장치의 조명 시스템 내의 다수의 미러 어레이들을 감시하는 방법 및 장치
WO2009119513A1 (ja) * 2008-03-27 2009-10-01 新日鐵化学株式会社 エポキシ樹脂組成物及び硬化物
BRPI0918349A2 (pt) 2008-12-30 2015-08-11 Dow Global Technologies Llc Processo para preparar dióxido de divinilareno
JP5478603B2 (ja) * 2009-03-05 2014-04-23 新日鉄住金化学株式会社 エポキシ樹脂組成物
KR101716634B1 (ko) * 2009-03-31 2017-03-14 신닛테츠 수미킨 가가쿠 가부시키가이샤 에폭시수지, 에폭시수지 조성물 및 경화물
JP5698500B2 (ja) * 2009-11-23 2015-04-08 ダウ グローバル テクノロジーズ エルエルシー アンダーフィル用途のためのエポキシ樹脂配合物
KR20120114295A (ko) * 2009-12-09 2012-10-16 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지 조성물
JP5390444B2 (ja) * 2010-03-23 2014-01-15 新日鉄住金化学株式会社 耐アンモニア性エポキシ樹脂組成物およびその成形硬化物
WO2011163154A2 (en) * 2010-06-25 2011-12-29 Dow Global Technologies Llc Polymer concrete composition
EP2585512A2 (en) * 2010-06-25 2013-05-01 Dow Global Technologies LLC Curable epoxy resin compositions and composites made therefrom
US9196412B2 (en) * 2011-05-13 2015-11-24 Dow Global Technologies Llc Insulation formulations
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge

Also Published As

Publication number Publication date
EP2707411A1 (en) 2014-03-19
WO2012158291A1 (en) 2012-11-22
JP6030125B2 (ja) 2016-11-24
MX2013013272A (es) 2014-07-09
CN103649158A (zh) 2014-03-19
US20140079953A1 (en) 2014-03-20
TWI540146B (zh) 2016-07-01
CA2835651A1 (en) 2012-11-22
BR112013029224A2 (pt) 2017-03-14
KR20140040150A (ko) 2014-04-02
MX349112B (es) 2017-07-12
EP2707411B1 (en) 2015-09-30
KR101901473B1 (ko) 2018-09-21
TW201307421A (zh) 2013-02-16
BR112013029224B1 (pt) 2021-03-09
JP2014520172A (ja) 2014-08-21

Similar Documents

Publication Publication Date Title
CN103649158B (zh) 绝缘制剂
CN103649160B (zh) 绝缘制剂
EP2230267B1 (en) Method of producing a curable epoxy resin composition
CN102725802A (zh) 电绝缘体系
TW201206982A (en) Curable compositions
JP2002518567A5 (https=)
CN102159614A (zh) 环氧树脂组合物
JP4322047B2 (ja) 電気絶縁用注型エポキシ樹脂組成物及び硬化物
EP3765567B1 (en) Storage stable and curable resin compositions
JP3872038B2 (ja) 注形用エポキシ樹脂組成物、その硬化方法及び電気・電子部品装置
JP2013194094A (ja) 樹脂組成物、樹脂フィルム、及び硬化物
JPH10310685A (ja) エポキシ注形用樹脂組成物
JPH0741543A (ja) 積層板用難燃性エポキシ樹脂組成物

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant