CN103567110B - 处理液供给装置的运转方法和处理液供给装置 - Google Patents

处理液供给装置的运转方法和处理液供给装置 Download PDF

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Publication number
CN103567110B
CN103567110B CN201310334130.4A CN201310334130A CN103567110B CN 103567110 B CN103567110 B CN 103567110B CN 201310334130 A CN201310334130 A CN 201310334130A CN 103567110 B CN103567110 B CN 103567110B
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China
Prior art keywords
filter portion
treatment fluid
filter
supplying device
liquid supplying
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Chinese (zh)
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CN103567110A (zh
Inventor
丸本洋
高柳康治
安达健二
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0031—Degasification of liquids by filtration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0036—Flash degasification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D36/00—Filter circuits or combinations of filters with other separating devices
    • B01D36/001—Filters in combination with devices for the removal of gas, air purge systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical & Material Sciences (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
CN201310334130.4A 2012-08-03 2013-08-02 处理液供给装置的运转方法和处理液供给装置 Active CN103567110B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012173299A JP5910401B2 (ja) 2012-08-03 2012-08-03 処理液供給装置の運転方法、処理液供給装置及び記憶媒体
JP2012-173299 2012-08-03

Publications (2)

Publication Number Publication Date
CN103567110A CN103567110A (zh) 2014-02-12
CN103567110B true CN103567110B (zh) 2017-08-11

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CN201310334130.4A Active CN103567110B (zh) 2012-08-03 2013-08-02 处理液供给装置的运转方法和处理液供给装置

Country Status (5)

Country Link
US (2) US9508574B2 (enExample)
JP (1) JP5910401B2 (enExample)
KR (1) KR101788352B1 (enExample)
CN (1) CN103567110B (enExample)
TW (1) TWI544971B (enExample)

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JP6010457B2 (ja) * 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
CN104979236B (zh) * 2014-04-11 2017-09-26 沈阳芯源微电子设备有限公司 一种化学液供给装置及其供给方法
PT3137768T (pt) * 2014-04-30 2021-01-19 Anthony George Hurter Aparelho e processo de purificação com água supercrítica de óleo combustível usado
CN106463357B (zh) 2014-05-15 2019-06-28 东京毅力科创株式会社 增加光致抗蚀剂分配系统中再循环和过滤的方法和设备
KR102320180B1 (ko) * 2014-05-30 2021-11-03 세메스 주식회사 필터 유닛 및 그것을 갖는 약액 공급 장치
JP6330624B2 (ja) * 2014-11-04 2018-05-30 東京エレクトロン株式会社 処理液供給装置及び処理液供給装置の洗浄方法
JP6222118B2 (ja) * 2015-01-09 2017-11-01 東京エレクトロン株式会社 処理液濾過装置、薬液供給装置及び処理液濾過方法並びに記憶媒体
JP6319117B2 (ja) * 2015-01-26 2018-05-09 東京エレクトロン株式会社 処理液供給装置、処理液供給方法及び記憶媒体
JP6425669B2 (ja) * 2015-03-31 2018-11-21 東京エレクトロン株式会社 処理液供給方法、読み取り可能なコンピュータ記憶媒体及び処理液供給装置
US10121685B2 (en) * 2015-03-31 2018-11-06 Tokyo Electron Limited Treatment solution supply method, non-transitory computer-readable storage medium, and treatment solution supply apparatus
JP5991403B2 (ja) * 2015-04-21 2016-09-14 東京エレクトロン株式会社 フィルタウエッティング方法、フィルタウエッティング装置及び記憶媒体
KR20170010454A (ko) 2015-06-30 2017-02-01 세메스 주식회사 기포 제거 유닛 및 이를 포함하는 기판 처리 장치
JP6252926B1 (ja) * 2016-07-29 2017-12-27 パナソニックＩｐマネジメント株式会社 微細気泡洗浄装置及び微細気泡洗浄方法
CN109564861B (zh) * 2016-07-29 2019-12-13 松下知识产权经营株式会社 微气泡清洗装置和微气泡清洗方法
JP6803701B2 (ja) * 2016-08-23 2020-12-23 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP6966260B2 (ja) * 2017-08-30 2021-11-10 株式会社Ｓｃｒｅｅｎホールディングス ポンプ装置、処理液供給装置および基板処理装置
US11273396B2 (en) * 2018-08-31 2022-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Liquid supply system with improved bubble venting capacity
KR20200126552A (ko) * 2019-04-30 2020-11-09 삼성전자주식회사 다중 필터들을 가진 레지스트 필터링 시스템 및 레지스트 코팅 설비
CN112999701B (zh) * 2019-12-20 2023-08-11 台湾积体电路制造股份有限公司 用于从粘性流体去除气泡的设备
TW202135914A (zh) * 2020-02-05 2021-10-01 日商東京威力科創股份有限公司 過濾器洗淨系統及過濾器洗淨方法
US20210245077A1 (en) 2020-02-12 2021-08-12 Tokyo Electron Limited Vacuum Assisted Filtration
KR102548294B1 (ko) * 2020-04-24 2023-06-28 세메스 주식회사 액 공급 유닛, 기판 처리 장치 및 액 처리 방법
US11446585B2 (en) * 2020-06-08 2022-09-20 Hamilton Sundstrand Corporation Grooved porous media gas trap for terrestrial and microgravity environment
US12194394B2 (en) 2020-10-23 2025-01-14 Lg Energy Solution, Ltd. Electrode insulation liquid supply apparatus and electrode insulation liquid supply method
KR102798399B1 (ko) * 2020-10-23 2025-04-23 주식회사 엘지에너지솔루션 전극 절연액 공급장치 및 전극 절연액 공급방법
JP7510334B2 (ja) * 2020-10-30 2024-07-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7628450B2 (ja) * 2021-03-24 2025-02-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および配管着脱パーツ洗浄方法
CN118391236A (zh) * 2024-06-28 2024-07-26 宁波润华全芯微电子设备有限公司 一种光刻胶恒压泵

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US6418942B1 (en) * 2000-03-10 2002-07-16 Donald Gray Solvent and aqueous decompression processing system

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Also Published As

Publication number Publication date
US9508574B2 (en) 2016-11-29
KR20140018130A (ko) 2014-02-12
JP5910401B2 (ja) 2016-04-27
US9576829B1 (en) 2017-02-21
JP2014033111A (ja) 2014-02-20
CN103567110A (zh) 2014-02-12
TW201420209A (zh) 2014-06-01
KR101788352B1 (ko) 2017-10-19
TWI544971B (zh) 2016-08-11
US20170043287A1 (en) 2017-02-16
US20140034584A1 (en) 2014-02-06

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