CN103548430B - 电子部件安装方法、电子部件搭载装置以及电子部件安装系统 - Google Patents
电子部件安装方法、电子部件搭载装置以及电子部件安装系统 Download PDFInfo
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- CN103548430B CN103548430B CN201280025158.3A CN201280025158A CN103548430B CN 103548430 B CN103548430 B CN 103548430B CN 201280025158 A CN201280025158 A CN 201280025158A CN 103548430 B CN103548430 B CN 103548430B
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- H—ELECTRICITY
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- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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Abstract
一种电子部件安装方法,包括:准备具有设置有多个凸块的主面的第一电子部件的工序;准备具有设置有与多个凸块对应的多个第一电极的搭载区域的基板的工序;在多个凸块上涂覆助熔剂的工序;在与搭载区域的周边缘部所设定的至少一个加强位置相邻接的第一电极上涂覆助熔剂的工序;在加强位置上涂覆热硬化性树脂,将与加强位置相邻接的第一电极的至少一部分由热硬化性树脂覆盖的工序;以多个凸块分别降落到对应的第一电极上的方式,将第一电子部件搭载到基板上,并且使热硬化性树脂与第一电子部件的周边缘部接触的工序;以及对搭载了第一电子部件的基板进行加热的工序。
Description
技术领域
本发明涉及将具有多个凸块的电子部件搭载或者安装到基板上的方法以及装置。
背景技术
在电子设备中设置有各种电子部件,这些电子部件在与具有多个电极、导线框架的基板的规定位置接合的状态下,作为安装构造体而内置于设备中。随着近年来的电子设备的小型化,设备中所设置的电子部件的小型化发展,因此倒装芯片、芯片尺寸封装(CSP)等小型的电子部件被搭载到基板上的情况增多。
倒装芯片、CSP等电子部件,具有规则地排列有多个端子的主面,在各端子上形成有焊锡制的凸块。在将这种电子部件向基板安装时,使凸块降落到称为焊盘的基板的电极上并加热,在使其熔融(回流焊)之后,通过冷却,进行电子部件与基板之间的相互连接。由此,电子部件的各端子与基板的电极电导通,并且电子部件通过焊锡接合部保持在基板上。
在安装构造体中,除了倒装芯片、CSP等电子部件以外,较多情况下还安装有称为芯片电阻、芯片LED、芯片电容器等的电子部件。这种电子部件为,通过丝网印刷(screenprinting)等方法,在向基板的电极上涂覆了含有金属粒子的浆料(例如膏状焊锡)之后,搭载到涂覆了浆料的电极上。然后,通过回流焊,使金属粒子熔融,并进行冷却,由此电子部件与基板接合。含有金属粒子的浆料向基板的电极的涂覆,一般在将倒装芯片、CSP等电子部件搭载在基板上之前进行。
当对于通过上述那样的安装工序而得到的由基板和电子部件构成的安装构造体,施加基于热循环的热应力、外力时,在通过凸块而与基板接合的电子部件中,有时焊锡接合部的强度不足。因此,通过加强用树脂,将电子部件接合在基板上,而对焊锡接合部进行加强。
作为通过加强用树脂对焊锡接合部进行加强的方法,存在使底层填料向电子部件的设置有多个凸块的主面与基板之间的间隙的整体中侵入的方法。
此外,提出有在将电子部件搭载到基板上之前,预先仅在与电子部件的周边缘部对应的基板的位置上供给加强用树脂的方法(参照专利文献1)。该方法与使用底层填料的情况相比,在安装构造体的修理变得容易这一点上较优良。
现有技术文献
专利文献
专利文献1:日本特开2003-218508号公报
发明内容
发明要解决的课题
在专利文献1中,首先,在与电子部件的周边缘部对应的基板上的位置上涂覆加强用树脂。接下来,具有预先涂覆了助熔剂的多个凸块的电子部件,以多个凸块分别降落到对应的电极上的方式被搭载到基板上。此时,使加强用树脂与电子部件的周边缘部接触,由此加强用树脂在回流焊工序之前的期间,作为将电子部件固定在基板上的粘合剂起作用。此外,在回流焊后,加强用树脂成为对于焊锡接合部的加强部。
但是,在将加强用树脂涂覆到基板上时,如图1(a)所示那样,有时一部分电极102a被加强用树脂105覆盖。随着电子部件200变得小型,与电子部件200的周边缘部201x对应的基板101上的位置接近电极102a,因此避开与电极102a的接触而将加强用树脂105向基板101进行涂覆变得困难。当使电子部件200的凸块204降落到由加强用树脂105覆盖的电极102a上时,如图1(b)所示那样,凸块204上所涂覆的助熔剂206不能够充分地浸润扩展到电极102a,而电极102a的绝大部分保持被加强用树脂105浸润的状态。当在这种状态下进行回流焊时,熔融的凸块不能够浸润扩展到电极102a,而如图1(c)所示那样,在冷却后的凸块204与电极102a之间夹有树脂加强部105a,成为焊锡接合部的接合不良(导通不良以及接合强度不足)。
另一方面,还通过分配方式等,如图2(a)所示那样,预先在电极102a上涂覆助熔剂206,然后将加强用树脂105涂覆到基板101上。在这种情况下,当使电子部件200的凸块204降落到由加强用树脂105覆盖的电极102a上时,如图2(b)所示那样,电极102a上所涂覆的助熔剂206不能够充分浸润扩展到凸块204,而凸块204的绝大部分保持被加强用树脂105浸润的状态。由此,在回流焊时熔融的凸块不能够浸润扩展到电极102a,而如图2(c)所示那样,在冷却后的凸块204与电极102a之间夹有树脂加强部105a。
用于解决课题的手段
鉴于上述情况,本发明的目的在于,提供能够避免电子部件与基板之间的接合不良的电子部件安装方法、电子部件搭载装置以及电子部件安装系统。
即,本发明的一个方案涉及一种电子部件安装方法,将具有设置有多个凸块的主面的第一电子部件安装到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的搭载区域,该电子部件安装方法包括:
准备上述第一电子部件的工序;
准备上述基板的工序;
在上述多个凸块上涂覆助熔剂的工序;
在与上述搭载区域的周边缘部所设定的至少一个加强位置相邻接的上述第一电极上涂覆助熔剂的工序;
在上述加强位置上涂覆热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖的工序;
以涂覆有上述助熔剂的多个凸块分别降落到对应的上述第一电极上的方式,将上述第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触的工序;以及
对搭载了上述第一电子部件的上述基板进行加热,而使上述凸块熔融,并且使上述热硬化性树脂硬化、冷却,由此将上述第一电子部件与上述基板接合的工序。
在第一电极上涂覆助熔剂的工序,例如包括:(a)使涂覆有上述助熔剂的多个凸块分别降落到对应的上述第一电极上,由此将上述助熔剂转印到上述第一电极的工序;以及(b)在上述助熔剂向上述第一电极转印后,使上述第一电子部件从上述基板退避的工序。在该情况下,将第一电子部件搭载到上述基板的工序,成为将上述退避的第一电子部件搭载到上述基板的工序。
在第一电极上涂覆助熔剂的工序或者也可以包括:(a)在具有与上述加强位置所邻接的第一电极相对应的转印面的转印工具的上述转印面上涂覆上述助熔剂的工序;(b)使涂覆有上述助熔剂的转印面降落到上述对应的第一电极上,由此将上述助熔剂转印到上述第一电极上的工序;以及(c)在上述助熔剂向上述第一电极转印后,使上述转印工具从上述基板退避的工序。
本发明的其他方案涉及一种电子部件搭载装置,将具有设置有多个凸块的主面的第一电子部件搭载到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的搭载区域,该电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块上转移上述助熔剂,
(ii)使转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上,由此将上述助熔剂向上述第一电极转印,
(iii)在上述助熔剂向上述第一电极转印后,使上述第一电子部件从上述基板退避,
在上述第一电子部件从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)以上述多个凸块分别降落到对应的上述第一电极上的方式,将上述退避的第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
本发明的另一个其他方案涉及一种电子部件搭载装置,将具有设置有多个凸块的主面的第一电子部件搭载到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的搭载区域,该电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;
转印工具,具有与上述加强位置所邻接的上述第一电极相对应的转印面;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述转印工具的上述转印面转印上述助熔剂,
(ii)使上述转印工具的转印有上述助熔剂的转印面降落到上述对应的第一电极上,由此将上述助熔剂转印到上述第一电极上,
(iii)在上述助熔剂向上述第一电极转印后,使上述转印工具从上述基板退避,
在上述转印工具从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块转印上述助熔剂,
(vi)以转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上的方式,将上述第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
本发明的另一个其他方案涉及一种电子部件安装系统,将具有设置有多个凸块的主面的第一电子部件以及具有连接用端子的第二电子部件安装到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的第一搭载区域、以及设置有与上述连接用端子对应的第二电极的第二搭载区域,该电子部件安装系统具备:
基板供给装置,供给上述基板;
丝网印刷装置,在从上述基板供给装置搬出的上述基板的上述第二电极上,通过丝网印刷涂覆含有金属粒子的浆料;
电子部件搭载装置,在从上述丝网印刷装置搬出的上述基板的上述第一搭载区域上搭载上述第一电子部件,并且在上述第二搭载区域上搭载上述第二电子部件;以及
回流焊装置,对从上述电子部件搭载装置搬出的上述基板进行加热,使上述凸块以及金属粒子熔融,并且使上述热硬化性树脂硬化,
上述电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
第二部件供给部,供给上述第二电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件以及第二电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述第一搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
以上述连接用端子经由含有上述金属粒子的浆料降落到上述第二电极上的方式,将上述第二电子部件搭载到上述基板上,并且,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块转印上述助熔剂,
(ii)使转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上,由此将上述助熔剂转印到上述第一电极上,
(iii)在上述助熔剂向上述第一电极转印后,使上述第一电子部件从上述基板退避,
在上述第一电子部件从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)以上述多个凸块分别降落到对应的上述第一电极上的方式,将上述退避的第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
本发明的另一个其他方案涉及一种电子部件安装系统,将具有设置有多个凸块的主面的第一电子部件以及具有连接用端子的第二电子部件安装到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的第一搭载区域以及设置有与上述连接用端子对应的第二电极的第二搭载区域,该电子部件安装系统具备:
基板供给装置,供给上述基板;
丝网印刷装置,在从上述基板供给装置搬出的上述基板的上述第二电极上,通过丝网印刷涂覆含有金属粒子的浆料;
电子部件搭载装置,在从上述丝网印刷装置搬出的上述基板的上述第一搭载区域上搭载上述第一电子部件,并且在上述第二搭载区域上搭载上述第二电子部件;以及
回流焊装置,对从上述电子部件搭载装置搬出的上述基板进行加热,使上述凸块以及金属粒子熔融,并且使上述热硬化性树脂硬化,
上述电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
第二部件供给部,供给上述第二电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件以及第二电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述第一搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;
转印工具,具有与上述加强位置所邻接的上述第一电极相对应的转印面;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
以上述连接用端子经由含有上述金属粒子的浆料降落到上述第二电极上的方式,将上述第二电子部件搭载到上述基板上,并且,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述转印工具的上述转印面转印上述助熔剂,
(ii)使上述转印工具的转印有上述助熔剂的转印面降落到上述对应的第一电极上,由此将上述助熔剂转印到上述第一电极上,
(iii)在上述助熔剂向上述第一电极转印后,使上述转印工具从上述基板退避,
在上述转印工具从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块转印上述助熔剂,
(vi)以转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上的方式,将上述第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
发明的效果
根据本发明的电子部件安装方法、电子部件搭载装置以及电子部件安装系统,即使在作为加强用树脂而供给的热硬化性树脂覆盖基板上所设置的电极的情况下,在回流焊时,通过熔融的凸块充分浸润电极,避免焊锡接合部的接合不良。
后附的请求范围中记载了本发明的新的特征,但本发明的构成以及内容的双方,与本申请的其他目的以及特征一起,通过与附图进行比较的以下的详细说明能够更好地被理解。
附图说明
图1是概念地表示使电子部件的预先涂覆有助熔剂的凸块降落到由加强用树脂覆盖的电极上的安装工序中的焊锡接合部的状态的图。
图2是概念地表示使电子部件的凸块降落到由加强用树脂覆盖的预先涂覆有助熔剂的电极上的安装工序中的焊锡接合部的状态的图。
图3A是具有多个凸块的第一电子部件的一个例子的纵截面图。
图3B是该第一电子部件的仰视图。
图4是芯片型的第二电子部件的一个例子的立体图。
图5是表示在具有与第一电子部件的多个凸块对应的第一电极以及与第二电子部件的连接用端子对应的第二电极的基板的第二电极上涂覆含有金属粒子的浆料的工序的说明图。
图6是表示利用具有多个凸块的第一电子部件、在基板的第一电极上通过转印方式涂覆助熔剂的工序的说明图。
图7是表示在基板的加强位置上涂覆了加强用树脂之后、搭载第一电子部件的工序的说明图。
图8在概念地表示使第一电子部件的预先涂覆有助熔剂的凸块降落到由加强用树脂覆盖的预先涂覆有助熔剂的电极上的安装工序中的焊锡接合部的状态的图。
图9是表示对搭载了第一电子部件以及第二电子部件的基板进行加热的回流焊工序的说明图。
图10A是具有与第一电极对应的转印面的转印工具的一个例子的主视图。
图10B是表示通过该转印工具在基板的第一电极上通过转印方式涂覆助熔剂的工序的说明图。
图11是表示本发明一个实施方式的电子部件安装系统的整体像的图。
图12是从上方观察本发明一个实施方式的电子部件搭载装置的构成图。
图13是转印单元的俯视图。
图14是该转印单元的X-X线截面图。
图15是表示利用具有多个凸块的第一电子部件,通过转印方式在基板的第一电极上涂覆助熔剂,并且将第一电子部件以及第二电子部件搭载到基板上的顺序的流程图。
图16是表示利用具有与第一电极对应的转印面的转印工具,通过转印方式在基板的第一电极上涂覆助熔剂,并且将第一电子部件以及第二电子部件搭载到基板上的顺序的流程图。
图17是本发明一个实施方式的电子部件搭载装置的控制系统图。
图18A是在4个位置的加强位置上涂覆有加强用树脂的矩形的第一电子部件的俯视图。
图18B是该第一电子部件的仰视图。
图19是例示加强用树脂的涂覆图案的图。
具体实施方式
首先,对本发明的电子部件安装方法的一个实施方式进行说明。
在此,基于除了通过多个凸块与基板的电极(焊盘)连接的球栅阵列(BGA)型的电子部件(第一电子部件)以外、还包括通过膏状焊锡等含有金属粒子的浆料与基板的电极连接的电子部件(第二电子部件)的一般的安装构造体进行说明。
首先,准备基板、第一电子部件以及第二电子部件。
图3A是第一电子部件200的一个例子的纵截面图,图3B是其仰视图。
第一电子部件200是具备较薄的基板(部件内基板)201、安装在其上表面上的半导体元件202以及覆盖半导体元件202的密封树脂203的封装。部件内基板201的下表面构成第一电子部件的主面201s,在主面201s上多个端子规则地排列为矩阵状,在各个端子上设置有凸块204。此外,第一电子部件的构造不限定于图3A以及图3B所示的构造。例如,各种形态的倒装芯片、芯片尺寸封装(CSP)等部件包含于第一电子部件。
图4是与第一电子部件200一起搭载到基板上的第二电子部件210的一个例子的立体图。第二电子部件是具有至少一个连接用端子211的芯片部件,例如芯片电阻、芯片LED、芯片电容器等。
如图5(a)所示那样,基板101具备设置有与第一电子部件200的多个凸块204连接的多个第一电极102a的第一搭载区域以及设置有与第二电子部件210的端子211连接的第二电极102b的第二搭载区域。此外,在用于第一电子部件200的第一搭载区域的周边缘部、即与第一电子部件200的周边缘部201x对应的区域中,设定有至少一个加强位置104。
在基板101的第一搭载区域的周边缘部通常设定有多个加强位置104。在此,基板101的第一搭载区域的周边缘部,是沿着第一电子部件200的具有多个凸块的主面201s的外形、在基板上设定的框状区域。加强位置104被设定在该框状区域的规定位置。一般的BGA型的第一电子部件200的主面201s的形状为矩形。在矩形的第一电子部件中优选为,以至少与其四角或者其附近对应的方式设定多个加强位置。
在安装工序中,首先,如图5(b)所示那样,在基板101的第二电极102b上通过丝网印刷,涂覆含有金属粒子的浆料103(例如膏状焊锡)。含有金属粒子的浆料103的涂覆,通过掩膜遮挡第一电极102a等方式进行。
在含有金属粒子的浆料103具有助熔剂的功能的情况下,还能够在第一电极102a和第二电极102b的双方上,通过一次丝网印刷来涂覆相同的浆料。但是,能够进行这种方法的情况有限,第一电极102a和第二电极102b的高度不同的情况、第一电子部件200和第二电子部件210所需要的浆料的涂膜厚度不同的情况较多。
另一方面,如图6(a)所示那样,在第一电子部件200的凸块204上涂覆助熔剂206。在凸块204上涂覆助熔剂的方法不特别限定,例如,在规定的转印台上形成助熔剂206的涂膜,使第一电子部件200的凸块204与该涂膜接触,使助熔剂206附着(转印)在凸块204上即可。由此,助熔剂206被均匀地涂覆到第一电子部件200的凸块204上。助熔剂的涂膜厚度考虑凸块204的大小、每个凸块的涂覆量而适当地调整即可。
接下来,如图6(b)以及图6(c)所示那样,使第一电子部件200的涂覆有助熔剂206的凸块204分别降落到对应的第一电极102a上。由此,助熔剂206通过转印被涂覆到包括与加强位置104相邻接的第一电极的全部第一电极102a上。然后,如图6(d)所示那样,将第一电子部件200从第一电极102a提起,使第一电子部件200暂时从基板101退避。
上述那样的第一电子部件200的移动,利用在规定的电子部件搭载装置上所设置的能够向各种方向移动的搭载头来进行即可。
接下来,如图7(a)所示那样,在用于第一电子部件200的第一搭载区域的周边缘部所设定的多个加强位置104上,涂覆加强用树脂105。在涂覆加强用树脂105时,涂覆有助熔剂206的多个第一电极102a中的、至少与加强位置104相邻接的第一电极102a的至少一部分被加强用树脂105覆盖。
加强用树脂105的涂覆,利用在规定的电子部件搭载装置上所设置的能够向各种方向移动的涂覆头来进行即可。
在安装矩形的第一电子部件的情况下,以至少与其四角或者其附近对应的方式涂覆加强用树脂。通过按照这种配置来设定加强位置,由此即使使用少量的加强用树脂,也能够得到较大的加强效果。此外,加强的平衡良好,因此在第一电子部件受到冲击时,容易减少对焊锡接合部产生的应力。
此外,加强用树脂105优选为,仅第一电子部件200的周边缘部201x附近的第一电极102a、即规则地配置的第一电极102a中最外周的第一电极102a由加强用树脂105覆盖。此外,优选为,不是一个第一电极102a的整体,而是如果可能、是该电极的一部分(例如边缘部)由加强用树脂105覆盖的程度。由此,在需要修理的情况下修理的麻烦减少,并且加强用树脂105的使用量也成为少量,因此是更经济的。
在加强用树脂105向加强位置104供给之后,使之前退避的第一电子部件200再次移动到基板101的第一电极102a的上方,如图7(b)所示那样,以多个凸块204分别降落到对应的第一电极102a上的方式,将第一电子部件200搭载到基板101上。此时,加强用树脂105与第一电子部件200的周边缘部201x接触。由此,加强用树脂105在回流焊工序之前的期间,作为将第一电子部件固定在基板101上的粘合剂起作用,在回流焊后,加强用树脂105硬化而成为树脂加强部。
在退避的第一电子部件200的凸块204上所附着的助熔剂206的量较少的情况下,也可以在向基板101搭载之前,再次通过转印使助熔剂206附着在凸块204上。
在图7中表示加强用树脂105仅覆盖第一电极102a的边缘部的情况,但电子部件越小型,则如图1、2所示那样,第一电极102a的整体越容易由加强用树脂105覆盖。在这种情况下,在本发明的电子部件安装方法中,如图8(a)所示那样,使涂覆有助熔剂206的凸块204降落到预先涂覆有助熔剂206的第一电极102a上,因此能够防止图1、2所示那种接合不良。其原因可以认为是,在将第一电子部件200搭载到基板101上时、或者在之后的回流焊工序中,随着加强用树脂105的粘度降低,如图8(b)所示那样,预先在第一电极102a上涂覆的助熔剂206与凸块204上所附着的助熔剂206相连,促进熔融的凸块向电极的浸润。由此,可以认为,在回流焊时熔融的凸块能够将加强用树脂105推开并且浸润扩展到电极上。
为了使熔融的凸块浸润扩展到第一电极,第一,需要将凸块的表面上存在的氧化物的膜充分地除去,第二,需要将第一电极的表面上存在的氧化物的膜充分地除去。为了满足这些条件,需要使足够量的助熔剂附着在凸块和第一电极上。但是,在图1(b)的情况下,第一电极102a的大部分被加强用树脂105覆盖,因此助熔剂206仅能够附着在第一电极102a的一部分,在第一电极102a的表面上残存较多氧化物。在图2(b)的情况下,助熔剂206仅附着在凸块204的前端,因此仅能够除去前端存在的氧化物,而在凸块204的表面上残存较多氧化物。如此残存的氧化物,阻碍熔融的凸块将加强用树脂105推开而浸润扩展到第一电极102a。其结果,在焊锡接合部的中途形成极端的缩颈,容易成为接合不良。
由此,为了使熔融的凸块浸润扩展到第一电极,作为第三个条件,如图8(b)所示那样,重要的是第一电极102a上所涂覆的助熔剂206与凸块204上所附着的助熔剂206相连。在以这种状态进行回流焊的情况下,熔融的凸块容易将加强用树脂105推开。因此,熔融的凸块充分浸润扩展到第一电极102a,不会在焊锡接合部形成极端的缩颈,避免接合不良。
在回流焊工序之前,进行第二电子部件210向基板101的搭载(图7(c))。具体地说,以连接用端子211经由含有金属粒子的浆料103降落到第二电极上的方式,第二电子部件210被搭载到基板101上。此外,第二电子部件210的搭载可以在第一电子部件200搭载之前之后的任一情况下进行,如果可能、也可以与第一电子部件200的搭载同时进行。
但是,本发明的电子部件安装方法不限于将第一电子部件200以及第二电子部件210安装到基板101上的情况。第二电子部件210根据需要安装到基板101上即可,将第二电子部件210安装到基板101上的工序,在本发明的电子部件安装方法中不是必须的。即,基板101不需要一定具有第二电极102b。因此,将含有金属粒子的浆料103向第二电极102b进行涂覆的工序也不是必须的。
在回流焊工序中,如图9(a)所示那样,搭载了第一电子部件200以及第二电子部件210的基板101通过回流焊装置加热。在回流焊装置内,熔融的凸块将加强用树脂105推开并且浸润扩展到电极,由此冷却后的凸块与电极的接触面积变大。由此,确保焊锡接合部的足够强度(图8(c))。当焊锡接合结束时,如图9(b)所示那样,凸块204的形状稍微变形,第一电子部件200与第一电极102a的距离缩短。
在回流焊时,在第一电子部件200与基板101之间存在位置偏移的情况下,在加强用树脂105硬化之前,通过自对准的效果而消除位置偏移。在本发明中,熔融的凸块与第一电极102a之间的浸润性较高,因此自对准的效果也提高。当焊锡被冷却而硬化时,第一电子部件200以及第二电子部件210各自的端子与基板101的对应的电极接合。
加强用树脂105在凸块204以及金属粒子熔融之后硬化而成为树脂加强部105a。由此,能够实现焊锡接合部的加强。此外,在作为助熔剂206而使用热硬化性助熔剂的情况下,形成助熔剂的硬化物206a。在该情况下,也可以省略助熔剂的清洗工序。
此外,在上述实施方式中,对将加强用树脂105仅涂覆到第一搭载区域的周边缘部的加强位置104上的情况进行了说明,但涂覆加强用树脂105的区域不特别限定。例如,也可以与底层填料同样,在第一电子部件200的部件内基板201与基板101之间的整个区域上涂覆加强用树脂105。在该情况下,在各第一电极102a与各凸块204之间,也实现如图8(b)所示那样的状态,因此与上述同样地确保焊锡接合部的强度。
此外,在第一电极102a上涂覆助熔剂206的方法,不限定于利用第一电子部件200的凸块204的方法。例如,也可以通过使用多点喷嘴的分配方式、使用具有与第一电极102a对应的转印面的转印工具的转印方式,在第一电极102a上涂覆助熔剂206。此时,在搭载第一电子部件200之前,不需要在与全部凸块204对应的第一电极102a上涂覆助熔剂206,例如,也可以仅在具有至少一部分被加强用树脂105覆盖的可能性的第一电极102a上涂覆助熔剂206。此外,在第一电极102a上涂覆的助熔剂与在第一电子部件200的凸块204上涂覆的助熔剂不需要为相同的材料。
接下来,作为上述实施方式的变形例,对使用具有与加强位置104所邻接的第一电极102a相对应的转印面的转印工具的情况进行说明。
此外,转印工具具有与加强位置104所邻接的第一电极102a相对应的转印面即可,但也可以具有与其他第一电极102a对应的转印面。即,可以使用能够在加强位置104所邻接的第一电极102a或者包含其的一部分第一电极102a上有选择地涂覆助熔剂的转印工具,也可以使用能够在全部第一电极102a上涂覆助熔剂206的转印工具。
图10A是转印工具的一个例子的主视图。图10B表示通过该转印工具220在基板101的第一电极102a上转印助熔剂206的工序。在转印工具220的底面上按照规定的图案形成有凸部222。凸部222的形成图案根据基板101上所设定的加强位置104的图案来适当地选择即可。例如,也可以具有与第一电极102a相同数量的凸部222。凸部222的顶面成为附着助熔剂206的转印面223。此外,转印面既可以是平坦面也可以是曲面。
在转印工具220的转印面223上涂覆助熔剂206,然后,使转印面223降落到对应的第一电极102a上,由此助熔剂被涂覆到第一电极102a上。在助熔剂向第一电极102a涂覆后,转印工具220从第一电极102a退避。此外,在转印面223上涂覆助熔剂206的方法不特别限定,但例如与在第一电子部件200的凸块204上涂覆助熔剂206的情况同样,形成助熔剂206的涂膜,使转印面223与该涂膜接触,使助熔剂206附着(转印)在转印面223上即可。
本变形例为,除了使用转印工具220在第一电极102a上涂覆(转印)助熔剂以外,与使用第一电子部件200在第一电极102a上涂覆(转印)助熔剂的实施方式同样。即,在第一电极102a上涂覆了助熔剂之后,将加强用树脂105涂覆到加强位置104,然后,将预先在凸块上涂覆了助熔剂206的第一电子部件200搭载到基板101上即可。
接下来,图11表示用于实施本发明的电子部件安装方法的电子部件安装系统的一个例子的整体像。
电子部件安装系统300具备:基板供给装置301,供给用于安装电子部件的基板;丝网印刷装置302,在从基板供给装置301搬出的基板的规定的电极(第二电极102b)上,通过丝网印刷涂覆含有金属粒子的浆料;电子部件搭载装置303,在从丝网印刷装置302搬出的基板的、与上述规定的电极不同的电极(第一电极102a)上,搭载第一电子部件并且在涂覆有含有金属粒子的浆料的电极上搭载第二电子部件;以及回流焊装置304,对从电子部件搭载装置303搬出的基板进行加热,将第一电子部件以及第二电子部件与基板接合。从回流焊装置304搬出的基板、即安装构造体由基板回收装置305回收。
图12是从上方观察构成电子部件安装系统300的电子部件搭载装置303的构成图。电子部件搭载装置303具备:基台303a;供给第一电子部件200的第一部件供给部307;供给第二电子部件210的第二部件供给部308;对基板101进行保持并定位的基板保持部309;供给助熔剂的涂膜的转印单元310;将所供给的第一电子部件200以及第二电子部件210搭载到基板101上的能够移动的搭载头311;作为加强用树脂105而供给热硬化性树脂的能够移动的涂覆头312;以及控制搭载头311和涂覆头312的移动及动作的控制部313。在基台303a上配置有第一部件供给部307、第二部件供给部308、基板保持部309以及转印单元310。此外,搭载头311和涂覆头312由专用的XY移动机构(未图示)支撑,通过控制部313对XY移动机构的控制,在基台303a的上方空间中移动。此外,在电子部件搭载装置303中也可以设置具有用于转印助熔剂的涂膜的转印面的转印工具220。
第一部件供给部307的构造不特别限定,但例如具备托盘供给部,该托盘供给部将承载了配置为格子状的多个第一电子部件200的托盘供给到搭载头311的拾取位置。
第一电子部件200是具有如图3A、图3B所示那样的设置有多个凸块204的主面201s的BGA型的比较小型的电子部件。
第二部件供给部308的构造也不特别限定,但例如具备带供给部,该带供给部将按照规定间隔保持多个第二电子部件210的带按照规定的间距向搭载头311的拾取位置送出。第二电子部件210不特别限定,但可以是如图4所示那样的具有连接用端子的芯片部件等。
对基板101进行保持并定位的基板保持部309,可以是任意的构造,但例如图12所示那样,由对保持基板101的载体314进行搬送的基板搬送输送机315构成。基板搬送输送机315将基板101搬送到各电子部件被进行搭载的位置而进行定位,因此作为基板保持部309起作用。
搭载头311具备通过内置的升降机构来进行升降动作的吸引喷嘴311a,通过吸引喷嘴311a的升降动作和吸引,从第一部件供给部307、第二部件供给部308拾取第一电子部件200、第二电子部件210,在基板101的规定位置通过升降动作和吸引解除(真空破坏)将电子部件搭载到基板101上。
用于供给作为加强用树脂105的热硬化性树脂的能够移动的涂覆头312,内置有分配器和升降机构,该分配器具有排出加强用树脂105的涂覆喷嘴312a,该升降机构使涂覆喷嘴312a升降。此外,搭载头以及涂覆头也可以构成为,分别由专用的XY移动机构支撑,在包括基板上方的规定空间中移动,也可以构成为将搭载头以及涂覆头一体化、通过共用的XY移动机构在规定空间中移动。
根据来自控制部313的指令来控制搭载头311的移动以及搭载头311对电子部件的拾取、搭载等动作。同样,根据来自控制部313的指令来控制涂覆头312的移动以及从涂覆头312排出加强用树脂105等动作。控制部313包括存储对搭载头311以及涂覆头312的移动以及动作进行限制的程序的硬盘、存储器等存储装置313a、CPU或者MPU等中央计算装置313b、各种接口、以及个人计算机等。
供给助熔剂的涂膜的转印单元310为,具有能够供给适合于向第一电子部件200的凸块204或者转印工具220的转印面进行转印的厚度的助熔剂的涂膜的机构即可,不特别限定。例如,如图13所示那样,具备设置在下方的基台320、设置在基台320的上表面的转印台321、以及配置在转印台321上方的刮板单元323。刮板单元323具备具有与转印台321的Y轴方向的宽度几乎相等的长度的第一刮板部件323a和第二刮板部件323b,这些刮板部件分别隔开一定的间隔与Y轴方向平行地配置。各刮板部件能够通过刮板单元323中内置的升降机构来升降,即能够相对于转印台321上所形成的涂膜进退。
如图14所示那样,在向第一刮板部件323a和第二刮板部件323b之间供给了助熔剂206之后,使刮板单元323向箭头方向移动,并且在规定的定时使第一刮板部件323a和第二刮板部件323b升降,由此供给助熔剂的涂膜。
接下来,对将第一电子部件200以及第二电子部件210向基板101搭载的工序进行说明。
搭载头311根据控制部313的指令,(i)从由转印单元310供给的助熔剂的涂膜,向第一电子部件200的多个凸块204转印助熔剂206,(ii)使转印了助熔剂206的多个凸块204分别降落到对应的第一电极102a上,由此将助熔剂206向第一电极102a进行转印,(iii)在助熔剂206向第一电极102a转印后,使第一电子部件200从基板101退避。然后,在从第一电子部件200的退避开始经过规定时间后,搭载头311为,(iv)以多个凸块204分别降落到对应的第一电极102a上的方式,将退避的第一电子部件200搭载到基板101上,并且根据需要,(v)以连接用端子211经由含有金属粒子的浆料103降落到第二电极102b上的方式,将第二电子部件210搭载到基板101上。
另一方面,涂覆头312根据控制部313的指令,在上述的规定时间中,向加强位置104供给作为加强用树脂105的热硬化性树脂。此时,与加强位置104相邻接的涂覆有助熔剂206的第一电极102a被热硬化性树脂覆盖。加强位置104上所涂覆的加强用树脂105的量被设定为,在经过上述的规定时间之后,在退避的第一电子部件200被搭载到了基板101上时,该树脂与第一电子部件的周边缘部接触。
以下,沿着图15的流程图来说明具体流程。
控制部313为,当识别到基板101被定位到基板保持部309的情况时(SP0),开始以下那样的搭载头311的移动以及动作的控制。首先,搭载头311为,通过第一部件供给部307拾取第一电子部件200(SP1),使第一电子部件200向转印单元310移动(SP2)。接下来,搭载头311使第一电子部件200的凸块204与转印单元310的转印台上所形成的助熔剂的涂膜接触,向凸块204转印助熔剂(SP3)。由此,如图6(a)所示那样,助熔剂206被涂覆到第一电子部件200的凸块204上。助熔剂的涂膜的厚度为,考虑凸块204的大小、每一个凸块的涂覆量而适当地调整。此外,在向凸块204上转印助熔剂206时,优选以第一电子部件200降落到助熔剂的涂膜的规定位置上的方式,进行对位的控制。
接下来,搭载头311使第一电子部件200移动到基板101的第一电极102a的上方(SP4),使多个凸块204分别降落到对应的第一电极102a上,由此将助熔剂206转印到第一电极102a上(SP5)。然后,搭载头311使第一电子部件200从基板101退避(SP6)。使第一电子部件200退避的位置不特别限定,但退避到接下来涂覆头312在基板101的上方进行动作时不成为其障碍的位置即可。
接下来,控制部313实施以下那样的涂覆头312的移动以及动作的控制。首先,涂覆头312移动到基板101的上方,进行相对于预先设定的加强位置104的对位(SP7)。接下来,涂覆头312为,如图7(a)所示那样,经由涂覆喷嘴312a向基板101的加强位置104供给加强用树脂105(SP8)。此时,与加强位置104相邻接的第一电极102a的至少一部分被加强用树脂105覆盖。
此外,当要避免第一电极102a与加强用树脂105的接触时,需要极其高度地控制加强用树脂105的性状、涂覆量、供给位置等。第一电子部件200越小型,则这种控制越困难,越阻碍生产率。
涂覆头312为,如图7(a)所示那样,具有小直径的涂覆喷嘴312a。加强用树脂105从涂覆喷嘴312a通过分配方式,以线状或者点状地供给到加强位置104。此时,通过对所供给的加强用树脂105的量进行调整,在规定时间经过后、第一电子部件200被搭载到基板101上时,能够使加强用树脂105与第一电子部件200的周边缘部201x充分接触。此外,加强用树脂105的量被调整为不会过多,由此实现生产率的提高,修理也变得更容易。此外,抑制加强用树脂105的挤出等不良。
然后,根据控制部313的指令,搭载头311使第一电子部件200再次移动到基板101的第一电极102a的上方,以使多个凸块204分别降落到对应的第一电极102a上的方式,将第一电子部件200搭载到基板101上(SP9)。
如上述那样,第一电子部件200向基板101的搭载,是在使第一电子部件200暂时从基板101退避开始经过规定时间后进行。该时间被设定为,与从使第一电子部件200从基板101退避开始、到涂覆头312结束向基板101上所设定的加强位置104供给加强用树脂105的动作为止的时间相同、或者比其更长。
当第一电子部件200向基板101的搭载结束时,接下来,搭载头311根据控制部313的控制,通过第二部件供给部308拾取第二电子部件210(SP10),使第二电子部件210移动到基板101的第二电极102b的上方(SP11),以连接用端子降落到第二电极102b上的浆料103上的方式,将第二电子部件210搭载到基板101上(SP12)。然后,进行搭载了第一电子部件200以及第二电子部件210的基板的回流焊(SP13),并回收基板。
此外,第一电子部件和第二电子部件的搭载顺序,不限定于上述顺序。例如,也可以最初将第二电子部件210搭载到基板上,之后将第一电子部件200搭载到基板上。即,也可以先进行SP10~SP12,然后进行SP1至SP9。此外,搭载头311如果具有多个吸引喷嘴,则也可以连续地或者同时拾取第一电子部件200和第二电子部件210。
在使第一电子部件200的凸块204降落到助熔剂的涂膜、第一电极102a上,或者使第二电子部件210的连接用端子211降落到第二电极102b上时,也可以利用图像识别系统,进行精密的对位。同样,为了涂覆头312的精密的对位,也可以利用图像识别系统。
接下来,沿着图16的流程图来说明使用转印工具的情况下的具体流程。
控制部313为,当识别出基板101被定位到基板保持部309时(SP0),开始以下那样的搭载头311的移动以及动作的控制。首先,搭载头311移动到转印工具220的设置场所,拾取转印工具220(SP1),使转印工具220移动到转印单元310(SP2)。转印工具220具有矩形的底面221,该矩形的底面221具有与第一电子部件200几乎相同的面积,在底面221上,以与加强位置104所邻接的第一电极102a相对应的方式形成有凸部222。此外,转印工具220也可以与规定的升降机构一起内置于搭载头311。在该情况下,上述那样的从设置场所拾取转印工具的动作能够省略。在该情况下,通过转印工具220将助熔剂206转印到第一电极102a的动作,通过所内置的升降机构的升降动作来进行。
通过转印单元310,搭载头311使转印工具220的凸部222的前端、即转印面223与转印台321上所形成的助熔剂206的涂膜接触,向转印面223上转印助熔剂206(SP3)。助熔剂206的涂膜的厚度为,考虑凸部222的高度等来适当地调整。
搭载头311使在转印面223上涂覆有助熔剂206的转印工具220移动到基板101的第一电极102a的上方(SP4),使转印面223分别降落到对应的第一电极102a上,由此将助熔剂206转印到第一电极102a上(SP5)。然后,搭载头311使转印工具220从第一电极102a退避(SP6)。关于使转印工具220退避的位置,可以与使第一电子部件200退避的情况同样。
接下来,控制部313与图15的流程图中的SP7~SP8同样地控制涂覆头312,在加强位置104上涂覆加强用树脂105。
在加强用树脂105的涂覆后,通过控制部313的控制,搭载头311通过第一部件供给部307拾取第一电子部件200(SP9),与图15的流程图中的SP2~SP3同样,在凸块204上涂覆助熔剂206(SP10)。接下来,搭载头311使第一电子部件200移动到基板101的第一电极102a的上方(SP11),以多个凸块204分别降落到对应的第一电极102a上的方式,将第一电子部件200搭载到基板101上(SP12)。
然后,与参照图15说明的同样,进行第二电子部件210的搭载,并且,进行搭载了第一电子部件200以及第二电子部件210的基板的回流焊,并回收基板。在此,第一电子部件和第二电子部件的搭载顺序也不限定于上述顺序。例如,也可以先进行第二电子部件210的搭载,然后进行SP1至SP12。
另外,电子部件搭载装置303的构成不限定于图12所示的构成。例如,供给第二电子部件210的第二部件供给部308,根据需要而组装在电子部件搭载装置303中,但在本发明的电子部件搭载装置中不是必须的。即,在本发明中,也可以不进行与第二电子部件210相关的搭载头311的移动以及动作。
并且,如图17所示那样,控制部313不仅控制搭载头311以及涂覆头312,还可以控制第一部件供给部307、第二部件供给部308、基板保持部309以及转印单元310的至少一个或者全部。例如,控制部313也可以控制基于转印单元310的涂膜形成的定时,以便在第一电子部件200或者转印工具220到达转印单元310之前,在转印台321形成助熔剂206的涂膜。
接下来,对加强用树脂105的涂覆图案进行具体说明。
图18A表示与矩形的第一电子部件200的周边缘部201x的四角对应而在4个位置的加强位置上涂覆了加强用树脂105时的、第一电子部件200的俯视图。图18B是相同的第一电子部件200的仰视图(具有多个凸块的主面201s)。虽然未图示,但加强用树脂105以仅覆盖最外周的第一电极102a的一部分的方式涂覆在加强位置上。但是,加强用树脂105的涂覆图案不特别限定。
图19例示5个种类的加强用树脂的涂覆图案。在4点涂覆的图案(a)、8点涂覆的图案(b)、12点涂覆的图案(c)以及L型涂覆的图案(d)中,在矩形的第一电子部件的周边缘部的四角或者其附近设定有多个加强位置。在U型涂覆的图案(e)中,也以包含四角以及其附近的方式设定有加强位置。按照涂覆图案(a)~(e)的顺序加强效果变大,但涂覆时间变长,加强用树脂的使用量也变多。另一方面,按照涂覆图案(e)~(a)的顺序,修理性(重做性)变得良好。涂覆图案根据第一电子部件的尺寸以及生产节拍,考虑加强效果来适当地选择即可。
此外,也可以在周边缘部的几乎整体涂覆加强用树脂。但是,在凸块的回流焊时,有时会从加强用树脂、助熔剂产生气体,因此优选设置用于排放气体的开口。
接下来,说明助熔剂。
助熔剂是具有如下作用的材料,即,在焊锡接合时,将第一电极的表面以及凸块的表面上存在的氧化物等除去、或使焊锡的表面张力减少。通过这些作用(以下称为活性作用),焊锡与第一电极之间的浸润性变大,能够进行可靠性较高的良好的焊锡接合。
助熔剂的组成不特别限定,但例如包括松脂那样的基剂、有机酸、氢卤酸盐等活性剂、溶剂以及触变性附加剂等。
在本发明中,假定助熔剂与作为加强用树脂的热硬化性树脂接触,而优选使用热硬化性助熔剂。在使用热硬化性助熔剂的情况下,即使在助熔剂与加强用树脂混合的情况下,也难以阻碍加强用树脂的正常的热硬化。其原因可以认为是助熔剂的有效成分向加强用树脂的移动被抑制。
热硬化性助熔剂能够通过使助熔剂含有热硬化性树脂来得到。作为助熔剂所含有的热硬化性树脂,根据耐热性优良的点等考虑,例如环氧树脂较适合。
接下来,说明加强用树脂。
加强用树脂使用热硬化性树脂。作为热硬化性树脂,能够例示环氧树脂、酚醛树脂、三聚氰酰胺甲醛树脂以及聚氨酯树脂等。热硬化性树脂也可以含有硬化剂、硬化促进剂等。作为硬化剂,优选使用酸酐、脂肪族或者芳香族胺、咪唑或者其衍生物等,作为硬化促进剂能够例示双氰胺等。
在加强用树脂中,优选含有具有将第一电极或者凸块的表面上存在的氧化物除去的作用的成分。例如,也可以使加强用树脂含有助熔剂所含有的活性剂等。由此,即使在加强用树脂与第一电极或者凸块接触的情况下,也能够更可靠地确保熔融的凸块与第一电极之间的浸润。
加强用树脂优选为如下配合:在回流焊时,在通过熔融的凸块而第一电极被充分浸润之后该树脂进行硬化。热硬化之前的加强用树脂的粘度,具有随着温度上升而降低的趋势。因此,通过使加强用树脂的硬化反应比凸块的熔融延迟,由此容易得到基于熔融的凸块的自对准的效果。例如,通过使加强用树脂的硬化温度比凸块的熔融温度(熔点)高,由此能够可靠地得到自对准的效果。加强用树脂的硬化温度,作为通过示差扫描量热测定(DSC)而得到的表示温度与热流之间的关系的曲线的峰值温度来求出。
此外,本发明不限于将1种第一电子部件向基板搭载的情况,也能够应用于将多种第一电子部件向基板搭载的情况。在该情况下,也可以根据需要,在电子部件搭载装置上,设置对用于向搭载头安装的多个吸引喷嘴进行保持的喷嘴储料器(nozzle stocker),并能够与多个第一电子部件分别对应地交换吸引喷嘴。此外,本发明不限于将1种第二电子部件向基板搭载的情况,也能够应用于将多种第二电子部件向基板搭载的情况。
工业上的利用可能性
根据本发明的电子部件安装方法、电子部件搭载装置以及电子部件安装系统,即使在基板上所设置的电极被加强用树脂覆盖的情况下,在回流焊时,由于通过熔融的凸块而电极被充分浸润,因此确保焊锡接合部的强度。因此,在BGA型电子部件等的表面安装领域中是有用的。
对于本发明的当前时刻的优选实施方式进行了说明,但不限定性地解释这种公开。通过阅读上述公开,本发明所属技术领域的本领域技术人员,能够无误地清楚各种的变形以及改变。因此,附加的请求的范围应解释为,包括不从本发明的真正的精神以及范围脱离的全部变形以及改变。
Claims (13)
1.一种电子部件安装方法,将具有设置有多个凸块的主面的第一电子部件安装到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的搭载区域,该电子部件安装方法包括:
准备上述第一电子部件的工序;
准备上述基板的工序;
在上述多个凸块上涂覆助熔剂的工序;
在与上述搭载区域的周边缘部上设定的至少一个加强位置相邻接的上述第一电极上涂覆助熔剂的工序;
在上述加强位置上涂覆热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖的工序;
以涂覆有上述助熔剂的多个凸块分别降落到对应的上述第一电极上的方式,将上述第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触的工序;以及
对搭载了上述第一电子部件的上述基板进行加热,而使上述凸块熔融,并且使上述热硬化性树脂硬化、冷却,由此将上述第一电子部件与上述基板接合的工序。
2.如权利要求1记载的电子部件安装方法,其中,
在上述第一电极上涂覆上述助熔剂的工序包括:
(a)使涂覆有上述助熔剂的多个凸块分别降落到对应的上述第一电极上,由此将上述助熔剂转印到上述第一电极的工序;以及
(b)在上述助熔剂向上述第一电极转印后,使上述第一电子部件从上述基板退避的工序;
将上述第一电子部件搭载到上述基板上的工序是将上述退避的第一电子部件搭载到上述基板上的工序。
3.如权利要求1记载的电子部件安装方法,其中,
在上述第一电极上涂覆上述助熔剂的工序包括:
(a)在具有与上述加强位置所邻接的第一电极相对应的转印面的转印工具的上述转印面上涂覆上述助熔剂的工序;
(b)使涂覆有上述助熔剂的转印面降落到上述对应的第一电极上,由此将上述助熔剂转印到上述第一电极上的工序;以及
(c)在上述助熔剂向上述第一电极转印后,使上述转印工具从上述基板退避的工序。
4.如权利要求1~3任一项记载的电子部件安装方法,其中,
在上述加强位置上涂覆上述热硬化性树脂时,仅将上述加强位置附近的上述第一电极用上述热硬化性树脂覆盖。
5.如权利要求1~3任一项记载的电子部件安装方法,其中,
上述热硬化性树脂含有具有将上述第一电极或者上述凸块的表面上存在的氧化物除去的作用的成分。
6.如权利要求1~3任一项记载的电子部件安装方法,其中,
上述助熔剂是热硬化性助熔剂。
7.如权利要求1~3任一项记载的电子部件安装方法,其中,
上述第一电子部件的上述主面的形状为矩形,至少在上述第一电子部件的四角或者与其附近对应的多个上述加强位置上,分别涂覆上述热硬化性树脂。
8.如权利要求1~3任一项记载的电子部件安装方法,其中,还包括:
准备具有连接用端子的第二电子部件的工序;
在上述第一电极上涂覆上述助熔剂之前,在上述基板上所设置的与上述连接用端子对应的第二电极上,通过丝网印刷涂覆含有金属粒子的浆料的工序;以及
以上述连接用端子经由含有上述金属粒子的浆料降落到上述第二电极上的方式,将上述第二电子部件搭载到上述基板上的工序。
9.一种电子部件搭载装置,将具有设置有多个凸块的主面的第一电子部件搭载到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的搭载区域,该电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块上转移上述助熔剂,
(ii)使转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上,由此将上述助熔剂向上述第一电极转印,
(iii)在上述助熔剂向上述第一电极转印后,使上述第一电子部件从上述基板退避,
在上述第一电子部件从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)以上述多个凸块分别降落到对应的上述第一电极上的方式,将上述退避的第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
10.一种电子部件搭载装置,将具有设置有多个凸块的主面的第一电子部件搭载到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的搭载区域,该电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;
转印工具,具有与上述加强位置所邻接的上述第一电极相对应的转印面;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述转印工具的上述转印面转印上述助熔剂,
(ii)使上述转印工具的转印有上述助熔剂的转印面降落到上述对应的第一电极上,由此将上述助熔剂转印到上述第一电极上,
(iii)在上述助熔剂向上述第一电极转印后,使上述转印工具从上述基板退避,
在上述转印工具从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块转印上述助熔剂,
(vi)以转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上的方式,将上述第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
11.如权利要求9或者10记载的电子部件搭载装置,其中,
还具备供给具有连接用端子的第二电子部件的第二部件供给部,
上述搭载头根据上述控制部的指令,以上述连接用端子降落到上述基板上所设置的与上述连接用端子相对应的第二电极上的方式,将上述第二电子部件搭载到上述基板上。
12.一种电子部件安装系统,将具有设置有多个凸块的主面的第一电子部件以及具有连接用端子的第二电子部件安装到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的第一搭载区域、以及设置有与上述连接用端子对应的第二电极的第二搭载区域,该电子部件安装系统具备:
基板供给装置,供给上述基板;
丝网印刷装置,在从上述基板供给装置搬出的上述基板的上述第二电极上,通过丝网印刷涂覆含有金属粒子的浆料;
电子部件搭载装置,在从上述丝网印刷装置搬出的上述基板的上述第一搭载区域上搭载上述第一电子部件,并且在上述第二搭载区域上搭载上述第二电子部件;以及
回流焊装置,对从上述电子部件搭载装置搬出的上述基板进行加热,使上述凸块以及金属粒子熔融,并且使热硬化性树脂硬化,
上述电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
第二部件供给部,供给上述第二电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件以及第二电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述第一搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
以上述连接用端子经由含有上述金属粒子的浆料降落到上述第二电极上的方式,将上述第二电子部件搭载到上述基板上,并且,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块转印上述助熔剂,
(ii)使转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上,由此将上述助熔剂转印到上述第一电极上,
(iii)在上述助熔剂向上述第一电极转印后,使上述第一电子部件从上述基板退避,
在上述第一电子部件从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)以上述多个凸块分别降落到对应的上述第一电极上的方式,将上述退避的第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
13.一种电子部件安装系统,将具有设置有多个凸块的主面的第一电子部件以及具有连接用端子的第二电子部件安装到基板上,该基板具有设置有与上述多个凸块对应的多个第一电极的第一搭载区域、以及设置有与上述连接用端子对应的第二电极的第二搭载区域,该电子部件安装系统具备:
基板供给装置,供给上述基板;
丝网印刷装置,在从上述基板供给装置搬出的上述基板的上述第二电极上,通过丝网印刷涂覆含有金属粒子的浆料;
电子部件搭载装置,在从上述丝网印刷装置搬出的上述基板的上述第一搭载区域上搭载上述第一电子部件,并且在上述第二搭载区域上搭载上述第二电子部件;以及
回流焊装置,对从上述电子部件搭载装置搬出的上述基板进行加热,使上述凸块以及金属粒子熔融,并且使热硬化性树脂硬化,
上述电子部件搭载装置具备:
第一部件供给部,供给上述第一电子部件;
第二部件供给部,供给上述第二电子部件;
基板保持部,对上述基板进行保持并定位;
转印单元,供给助熔剂的涂膜;
能够移动的搭载头,将上述供给的第一电子部件以及第二电子部件搭载到上述基板上;
能够移动的涂覆头,在上述基板的上述第一搭载区域的周边缘部上设定的至少一个加强位置上涂覆热硬化性树脂;
转印工具,具有与上述加强位置所邻接的上述第一电极相对应的转印面;以及
控制部,控制上述搭载头和上述涂覆头的移动以及动作,
根据上述控制部的指令,
上述搭载头,
以上述连接用端子经由含有上述金属粒子的浆料降落到上述第二电极上的方式,将上述第二电子部件搭载到上述基板上,并且,
上述搭载头,
(i)从由上述转印单元供给的上述助熔剂的涂膜,向上述转印工具的上述转印面转印上述助熔剂,
(ii)使上述转印工具的转印有上述助熔剂的转印面降落到上述对应的第一电极上,由此将上述助熔剂转印到上述第一电极上,
(iii)在上述助熔剂向上述第一电极转印后,使上述转印工具从上述基板退避,
在上述转印工具从上述基板退避后,
上述涂覆头,
(iv)在上述加强位置上涂覆上述热硬化性树脂,并且将与上述加强位置相邻接的涂覆有上述助熔剂的第一电极的至少一部分用上述热硬化性树脂覆盖,
在上述热硬化性树脂向上述加强位置涂覆后,
上述搭载头,
(v)从由上述转印单元供给的上述助熔剂的涂膜,向上述第一电子部件的上述多个凸块转印上述助熔剂,
(vi)以转印有上述助熔剂的多个凸块分别降落到对应的上述第一电极上的方式,将上述第一电子部件搭载到上述基板上,并且使涂覆到上述加强位置上的上述热硬化性树脂与上述第一电子部件的周边缘部接触。
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US20140096379A1 (en) | 2014-04-10 |
WO2012164957A1 (ja) | 2012-12-06 |
JPWO2012164957A1 (ja) | 2015-02-23 |
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