CN103517558A - 封装基板、其制作方法及封装结构 - Google Patents
封装基板、其制作方法及封装结构 Download PDFInfo
- Publication number
- CN103517558A CN103517558A CN201210204790.6A CN201210204790A CN103517558A CN 103517558 A CN103517558 A CN 103517558A CN 201210204790 A CN201210204790 A CN 201210204790A CN 103517558 A CN103517558 A CN 103517558A
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- base plate
- insulating layer
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 title abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 164
- 229910052802 copper Inorganic materials 0.000 claims abstract description 119
- 239000010949 copper Substances 0.000 claims abstract description 119
- 238000003466 welding Methods 0.000 claims abstract description 46
- 239000011889 copper foil Substances 0.000 claims abstract description 45
- 239000010410 layer Substances 0.000 claims description 195
- 238000012856 packing Methods 0.000 claims description 87
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 42
- 239000010931 gold Substances 0.000 claims description 42
- 229910052737 gold Inorganic materials 0.000 claims description 42
- 238000004806 packaging method and process Methods 0.000 claims description 40
- 239000004020 conductor Substances 0.000 claims description 25
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 238000012545 processing Methods 0.000 description 10
- 238000007639 printing Methods 0.000 description 9
- 238000005096 rolling process Methods 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000000875 corresponding effect Effects 0.000 description 7
- 238000004804 winding Methods 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- -1 PI) Polymers 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 3
- 239000011112 polyethylene naphthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000002893 slag Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910001074 Lay pewter Inorganic materials 0.000 description 1
- 241001124569 Lycaenidae Species 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
片状的柔性单面线路板 | 10 |
柔性绝缘层 | 11 |
导电线路图形 | 12 |
第一表面 | 111 |
第二表面 | 112 |
切口 | 13 |
第一铜垫 | 121 |
卷带式的柔性单面线路板 | 10b |
柔性单面覆铜基板 | 10a |
卷轮 | 40 |
加工装置 | 30 |
铜箔层 | 14 |
第一干膜 | 113 |
第二干膜 | 114 |
防焊层 | 15 |
第二铜垫 | 16 |
第三铜垫 | 17 |
第一金垫 | 161 |
第二金垫 | 171 |
薄铜层 | 18 |
第三干膜 | 115 |
导电材料 | 131 |
柔性封装基板 | 20 |
支撑板 | 19 |
承载板 | 191 |
胶粘层 | 192 |
具有背衬的柔性封装基板 | 21 |
封装结构 | 22 |
导电金属垫 | 132 |
IC元件 | 133 |
引脚 | 134 |
线路板 | 23 |
绝缘基底 | 231 |
导电线路层 | 232 |
覆盖膜层 | 233 |
第三金垫 | 234 |
锡球 | 235 |
Claims (11)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210204790.6A CN103517558B (zh) | 2012-06-20 | 2012-06-20 | 封装基板制作方法 |
TW101123558A TWI506748B (zh) | 2012-06-20 | 2012-06-29 | 封裝基板、其製作方法及封裝結構 |
US13/864,278 US20130341073A1 (en) | 2012-06-20 | 2013-04-17 | Packaging substrate and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210204790.6A CN103517558B (zh) | 2012-06-20 | 2012-06-20 | 封装基板制作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103517558A true CN103517558A (zh) | 2014-01-15 |
CN103517558B CN103517558B (zh) | 2017-03-22 |
Family
ID=49773462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210204790.6A Active CN103517558B (zh) | 2012-06-20 | 2012-06-20 | 封装基板制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130341073A1 (zh) |
CN (1) | CN103517558B (zh) |
TW (1) | TWI506748B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105307405A (zh) * | 2014-05-29 | 2016-02-03 | 景硕科技股份有限公司 | 利用聚亚酰胺蚀刻的线路板制作方法 |
CN106413269A (zh) * | 2015-07-29 | 2017-02-15 | 印可得株式会社 | 印刷电路板的制造方法 |
CN106658965A (zh) * | 2015-10-30 | 2017-05-10 | 碁鼎科技秦皇岛有限公司 | 载板及其制作方法 |
CN111383999A (zh) * | 2020-03-24 | 2020-07-07 | 青岛歌尔智能传感器有限公司 | 传感器制作方法和传感器 |
CN114286538A (zh) * | 2020-09-28 | 2022-04-05 | 鹏鼎控股(深圳)股份有限公司 | 具有插接手指的多层线路板及其制作方法 |
CN116867167A (zh) * | 2023-06-13 | 2023-10-10 | 太仓神连科技有限公司 | 铝制柔性印刷线路板组件及其制备方法 |
CN117082728A (zh) * | 2023-09-04 | 2023-11-17 | 江西省鑫聚能科技有限公司 | 单面fcob线路载板叠构及制作工艺 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9872399B1 (en) | 2016-07-22 | 2018-01-16 | International Business Machines Corporation | Implementing backdrilling elimination utilizing anti-electroplate coating |
US11437333B2 (en) * | 2016-12-30 | 2022-09-06 | Texas Instruments Incorporated | Packaged semiconductor device with a reflow wall |
JP7245071B2 (ja) * | 2019-02-21 | 2023-03-23 | 株式会社ジェイテクトサーモシステム | 基板支持装置 |
CN111918490B (zh) * | 2020-08-30 | 2024-05-07 | 深圳市实锐泰科技有限公司 | 一种刚挠结合板的制作方法及刚挠结合板 |
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CN117082728B (zh) * | 2023-09-04 | 2024-03-19 | 江西省鑫聚能科技有限公司 | 单面fcob线路载板叠构及制作工艺 |
Also Published As
Publication number | Publication date |
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US20130341073A1 (en) | 2013-12-26 |
TW201401464A (zh) | 2014-01-01 |
CN103517558B (zh) | 2017-03-22 |
TWI506748B (zh) | 2015-11-01 |
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