CN103460813B - 用于安装多个发光元件的基板 - Google Patents

用于安装多个发光元件的基板 Download PDF

Info

Publication number
CN103460813B
CN103460813B CN201280014288.7A CN201280014288A CN103460813B CN 103460813 B CN103460813 B CN 103460813B CN 201280014288 A CN201280014288 A CN 201280014288A CN 103460813 B CN103460813 B CN 103460813B
Authority
CN
China
Prior art keywords
substrate
light
emitting element
light emitting
output device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280014288.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103460813A (zh
Inventor
H·库伊杰曼斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Signify Holding BV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of CN103460813A publication Critical patent/CN103460813A/zh
Application granted granted Critical
Publication of CN103460813B publication Critical patent/CN103460813B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
CN201280014288.7A 2011-03-22 2012-03-12 用于安装多个发光元件的基板 Expired - Fee Related CN103460813B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11159132.7 2011-03-22
EP11159132 2011-03-22
PCT/IB2012/051148 WO2012127355A1 (en) 2011-03-22 2012-03-12 Substrate for mounting a plurality of light emitting elements

Publications (2)

Publication Number Publication Date
CN103460813A CN103460813A (zh) 2013-12-18
CN103460813B true CN103460813B (zh) 2017-07-11

Family

ID=45876831

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280014288.7A Expired - Fee Related CN103460813B (zh) 2011-03-22 2012-03-12 用于安装多个发光元件的基板

Country Status (6)

Country Link
US (1) US9337404B2 (enExample)
EP (1) EP2689642B1 (enExample)
JP (1) JP5851017B2 (enExample)
CN (1) CN103460813B (enExample)
RU (1) RU2615149C2 (enExample)
WO (1) WO2012127355A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3071983B2 (ja) 1993-08-18 2000-07-31 ポリプラスチックス株式会社 ポリエステルの製造方法
CN103791441A (zh) * 2012-10-30 2014-05-14 欧司朗股份有限公司 透镜模块和包括该透镜模块的发光装置
DE102012220977A1 (de) * 2012-11-16 2014-05-22 Osram Gmbh Reflektoranordnung
JP6079159B2 (ja) 2012-11-16 2017-02-15 日亜化学工業株式会社 発光装置
AT513910B1 (de) * 2013-02-07 2014-12-15 Zizala Lichtsysteme Gmbh Verfahren zum Herstellen einer Leuchteinheit sowie Leuchteinheit
AT513747B1 (de) * 2013-02-28 2014-07-15 Mikroelektronik Ges Mit Beschränkter Haftung Ab Bestückungsverfahren für Schaltungsträger und Schaltungsträger
WO2014155347A1 (en) * 2013-03-29 2014-10-02 Koninklijke Philips N.V. Printed circuit board for a light emitting diode module
DE102013103600A1 (de) * 2013-04-10 2014-10-30 Osram Opto Semiconductors Gmbh Modul mit wenigstens zwei Halbleiterchips
EP2808912B1 (en) * 2013-05-27 2021-06-30 Rockwell Automation Switzerland GmbH Method for assembling a circuit carrier with a housing component, and an optical unit
DE102014101783B4 (de) * 2014-02-13 2021-08-19 HELLA GmbH & Co. KGaA Verfahren zum Aufbau eines LED- Lichtmoduls
US9674412B2 (en) * 2014-08-01 2017-06-06 Flir Commercial Systems, Inc. Multi-sensor camera with apertured circuit-carrying substrate
JP6507942B2 (ja) * 2014-08-29 2019-05-08 日亜化学工業株式会社 半導体発光装置用の保持部材、光源装置及びその製造方法
DE102015206324B4 (de) * 2015-04-09 2019-06-06 H4X E.U. Anordnung mit einem auf einem Trägerblech angeordneten flächigen Leuchtmittelträger, Verfahren zum Herstellen eines eine vorbestimmte Biegung aufweisenden flächigen Leuchtmittelträgers sowie Beleuchtungsvorrichtung
CN205048218U (zh) * 2015-06-08 2016-02-24 亮锐控股有限公司 照明带和照明装置
EP3430310B1 (en) 2016-03-15 2022-11-02 Signify Holding B.V. An elongated lead frame and a method of manufacturing an elongated lead frame
EP3294046B1 (en) * 2016-09-09 2023-08-02 TE Connectivity Germany GmbH Solid state lighting module and method of fabricating same
JP6769795B2 (ja) * 2016-09-12 2020-10-14 矢崎総業株式会社 電子回路基板
WO2018070987A1 (en) * 2016-10-10 2018-04-19 Hewlett-Packard Development Company, L.P. Boards with pliable regions
US10194495B2 (en) * 2016-12-21 2019-01-29 Lumileds Llc Method for addressing misalignment of LEDs on a printed circuit board
US10765009B2 (en) 2016-12-21 2020-09-01 Lumileds Llc Method for addressing misalignment of LEDs on a printed circuit board
US10495278B2 (en) * 2017-03-30 2019-12-03 Valeo North America, Inc. Vehicle lighting device with adjustable alignment frame for an optical element and method for assembling a lighting device with an adjustable frame for an optical element
EP3383146B8 (en) * 2017-03-31 2023-08-30 Inventronics GmbH Lighting device with ip protection and multidirectional bending capability, and method for manufacturing the same
EP3454312B1 (de) * 2017-09-11 2019-08-07 Siemens Schweiz AG Optischer rauchmelder mit einem aufschwenkbaren leiterplattenabschnitt mit einem darauf angeordneten lichtsender und/oder lichtempfänger
US10880995B2 (en) * 2017-12-15 2020-12-29 2449049 Ontario Inc. Printed circuit board with stress relief zones for component and solder joint protection
AT520857A1 (de) * 2018-02-08 2019-08-15 Friedrich Eibensteiner Dr Verfahren zum Platzieren und Löten von Elementen auf Bauteilträger
WO2019224901A1 (ja) * 2018-05-22 2019-11-28 株式会社メイコーテクノ フレキシブル部を有するリジッドプリント配線基板
GB2585350A (en) * 2019-05-03 2021-01-13 Universal Science Uk Ltd Modular printed circuit board
DE102019214050A1 (de) * 2019-09-16 2021-03-18 Carl Zeiss Smt Gmbh Steckeranordnung, system und lithographieanlage
EP4194758B1 (en) * 2021-12-10 2025-06-04 E.G.O. Elektro-Gerätebau GmbH Electrical domestic appliance with an operating device
DE202023105865U1 (de) * 2023-10-11 2025-01-14 Zumtobel Lighting Gmbh Leiterplatte mit variablem Abstand ihrer Abschnitte

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9000279A (nl) * 1990-02-05 1991-09-02 Ericsson Telecommunicatie Bv Buigzame gedrukte bedradingskaart met een substraat van stijf materiaal.
US5811874A (en) * 1996-07-18 1998-09-22 Samsung Electronics Co., Ltd. Semiconductor chip package device having a rounded or chamfered metal layer guard ring
CN1917741A (zh) * 2005-08-18 2007-02-21 Tdk株式会社 柔性基板、安装结构、显示单元和便携式电子设备

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767172A (en) * 1983-01-28 1988-08-30 Xerox Corporation Collector for an LED array
EP0117606A1 (en) 1983-01-28 1984-09-05 Xerox Corporation Collector for a LED array
EP1022787B2 (de) * 1989-05-31 2012-07-11 OSRAM Opto Semiconductors GmbH Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
JPH0595074U (ja) * 1992-05-29 1993-12-24 株式会社村田製作所 回路基板
IL111219A0 (en) * 1993-10-18 1994-12-29 Hughes Aircraft Co Microelement assembly
FI109075B (fi) * 1998-10-05 2002-05-15 Nokia Corp Akustisen muuntimen alustan kiinnitysmenetelmä
JP2000123978A (ja) * 1998-10-20 2000-04-28 Chisso Corp 有機ｅｌ素子およびその製造方法
ITMI20012579A1 (it) * 2001-12-06 2003-06-06 Fraen Corp Srl Modulo illuminante ad elevata dissipazione di calore
US6846094B2 (en) * 2002-08-26 2005-01-25 Altman Stage Lighting, Co., Inc. Flexible LED lighting strip
US7142420B2 (en) * 2004-09-20 2006-11-28 Qualcomm, Incorporated Devices and methods for controlling relative movement between layers of an electronic device
DE102004056252A1 (de) * 2004-10-29 2006-05-04 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung, Kfz-Scheinwerfer und Verfahren zur Herstellung einer Beleuchtungseinrichtung
JP2006162654A (ja) * 2004-12-02 2006-06-22 Olympus Corp 光学デバイス及び照明装置
EP1891671B1 (en) 2005-05-20 2020-08-19 Signify Holding B.V. Light-emitting module
TWI280332B (en) 2005-10-31 2007-05-01 Guei-Fang Chen LED lighting device
US20080239716A1 (en) * 2007-03-30 2008-10-02 Yuan Lin Light strip
RU2011105026A (ru) 2008-07-11 2012-08-20 Конинклейке Филипс Электроникс Н.В. (Nl) Устройство вывода света и способ сборки
JP4447644B2 (ja) * 2008-07-15 2010-04-07 シーシーエス株式会社 光照射装置
US8629353B2 (en) * 2009-03-05 2014-01-14 The Board Of Trustees Of The Leland Stanford Junior University Apparatus and method using patterned array with separated islands

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL9000279A (nl) * 1990-02-05 1991-09-02 Ericsson Telecommunicatie Bv Buigzame gedrukte bedradingskaart met een substraat van stijf materiaal.
US5811874A (en) * 1996-07-18 1998-09-22 Samsung Electronics Co., Ltd. Semiconductor chip package device having a rounded or chamfered metal layer guard ring
CN1917741A (zh) * 2005-08-18 2007-02-21 Tdk株式会社 柔性基板、安装结构、显示单元和便携式电子设备

Also Published As

Publication number Publication date
US20140001498A1 (en) 2014-01-02
WO2012127355A1 (en) 2012-09-27
RU2013146958A (ru) 2015-04-27
RU2615149C2 (ru) 2017-04-04
JP2014512093A (ja) 2014-05-19
JP5851017B2 (ja) 2016-02-03
EP2689642B1 (en) 2018-02-28
US9337404B2 (en) 2016-05-10
EP2689642A1 (en) 2014-01-29
CN103460813A (zh) 2013-12-18

Similar Documents

Publication Publication Date Title
CN103460813B (zh) 用于安装多个发光元件的基板
CN101803049B (zh) Led封装、使用led封装的灯以及用于制造led封装的方法
US8456768B2 (en) Lens-holding-and-aligning seat and LED light panel thereof
US20140233245A1 (en) LED-Based Lighting With Reflector Mounted On PCB
JP2012069673A (ja) フレキシブル基板、フレキシブル基板の実装方法及び照明装置
JP6352638B2 (ja) 回路基板及び回路基板を含むフラットパネルディスプレイ
EP3305040B1 (en) Lighting strip
JP2010528435A (ja) 発熱体及び電源用のヒートシンク
JP2011249534A (ja) 折り曲げ可能配線基板、発光モジュール、発光モジュールの製造方法、折り曲げ可能配線基板の製造方法
JP6519123B2 (ja) 発光素子搭載用基板及び該基板の固定方法
EP2722589B1 (en) Angled emitter channel letter lighting
CN100454054C (zh) 用于装配表面发光系统的方法以及表面发光系统
KR101999554B1 (ko) 베이스 절곡형 메탈피시비 제조방법
KR20100044632A (ko) 엘이디 조명장치용 회로모듈 및 그를 포함하는 엘이디 조명장치
TW201304081A (zh) 用以安裝複數個發光元件之基板
TWI627798B (zh) 具有照明發光二極體之電路
EP2951486B1 (en) Lighting arrangement having a resilient element
US9086210B2 (en) Lighting module and corresponding integrated lighting device
CN113167463A (zh) 电路基板及车辆用灯具
EP2587133B1 (en) Lighting component with led reflector strip
CN106152071A (zh) 灯具的制造方法和灯具
JP6506042B2 (ja) 光源モジュールおよび発光装置
JP2020123429A (ja) Ｌｅｄ発光装置
CN214700385U (zh) 照明装置
JP6758446B2 (ja) 光源モジュールおよび発光装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20170315

Address after: The city of Eindhoven in Holland

Applicant after: PHILIPS LIGHTING HOLDING B.V.

Address before: The city of Eindhoven in Holland

Applicant before: KONINKLIJKE PHILIPS N.V.

GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Eindhoven

Patentee after: Signify Holdings Ltd.

Address before: The city of Eindhoven in Holland

Patentee before: PHILIPS LIGHTING HOLDING B.V.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170711