CN103219262A - 衬底表面处理系统以及方法 - Google Patents

衬底表面处理系统以及方法 Download PDF

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Publication number
CN103219262A
CN103219262A CN2012103709896A CN201210370989A CN103219262A CN 103219262 A CN103219262 A CN 103219262A CN 2012103709896 A CN2012103709896 A CN 2012103709896A CN 201210370989 A CN201210370989 A CN 201210370989A CN 103219262 A CN103219262 A CN 103219262A
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CN
China
Prior art keywords
substrate
process chamber
wet processed
liquid
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012103709896A
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English (en)
Chinese (zh)
Inventor
张承逸
安吉秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MMTECH CO Ltd
Original Assignee
MMTECH CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MMTECH CO Ltd filed Critical MMTECH CO Ltd
Publication of CN103219262A publication Critical patent/CN103219262A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/06—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane
CN2012103709896A 2012-01-20 2012-09-28 衬底表面处理系统以及方法 Pending CN103219262A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0006810 2012-01-20
KR1020120006810A KR101298220B1 (ko) 2012-01-20 2012-01-20 콤팩트한 기판 표면처리 시스템 및 기판 표면처리 방법

Publications (1)

Publication Number Publication Date
CN103219262A true CN103219262A (zh) 2013-07-24

Family

ID=48816946

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012103709896A Pending CN103219262A (zh) 2012-01-20 2012-09-28 衬底表面处理系统以及方法

Country Status (4)

Country Link
JP (1) JP5544000B2 (ja)
KR (1) KR101298220B1 (ja)
CN (1) CN103219262A (ja)
TW (1) TW201332038A (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5878787B2 (ja) * 2012-02-21 2016-03-08 シャープ株式会社 薬液処理装置及び薬液処理方法
CN103681244B (zh) * 2013-12-25 2016-09-14 深圳市华星光电技术有限公司 低温多晶硅薄膜的制备方法及其制作系统
CN105428283B (zh) * 2015-12-31 2018-01-12 上海新阳半导体材料股份有限公司 引线框架浸泡设备
JP6157694B1 (ja) * 2016-06-28 2017-07-05 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
JP6088099B1 (ja) * 2016-07-06 2017-03-01 株式会社荏原製作所 洗浄装置、これを備えためっき装置、及び洗浄方法
TWI629116B (zh) * 2016-06-28 2018-07-11 荏原製作所股份有限公司 清洗裝置、具備該清洗裝置之鍍覆裝置、以及清洗方法
JP6536830B2 (ja) * 2016-08-30 2019-07-03 株式会社Ｎｓｃ スプレイエッチング装置
JP6924614B2 (ja) 2017-05-18 2021-08-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102351253B1 (ko) * 2020-05-08 2022-01-14 (주)에이피텍 클리닝 공정 모듈화 인라인 시스템

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184749A (ja) * 2000-12-12 2002-06-28 Sumitomo Precision Prod Co Ltd 基板処理装置
CN1992152A (zh) * 2005-12-29 2007-07-04 Lg.菲利浦Lcd株式会社 用于制造平板显示装置的蚀刻设备及使用其的制造方法
CN100479092C (zh) * 2002-08-19 2009-04-15 住友精密工业株式会社 升降式基板处理装置及具有该装置的基板处理系统

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831795A (ja) * 1994-07-19 1996-02-02 Nippon Steel Corp 半導体ウェハの処理装置
JP3592077B2 (ja) * 1998-04-20 2004-11-24 大日本スクリーン製造株式会社 基板処理装置
JP2000058624A (ja) * 1998-08-07 2000-02-25 Ribaaberu:Kk 半導体製造装置
KR100766247B1 (ko) * 1999-12-30 2007-10-15 엘지.필립스 엘시디 주식회사 일체형 스트립 및 세정 장치
JP2001230299A (ja) * 2000-02-18 2001-08-24 Sumitomo Precision Prod Co Ltd 基板処理設備
JP3587788B2 (ja) * 2001-02-27 2004-11-10 住友精密工業株式会社 昇降式基板処理装置及びこれを備えた基板処理システム
JP4136826B2 (ja) * 2002-08-19 2008-08-20 住友精密工業株式会社 昇降式基板処理装置及びこれを備えた基板処理システム
JP4627992B2 (ja) * 2004-01-08 2011-02-09 住友精密工業株式会社 基板処理システム
JP2009195838A (ja) 2008-02-22 2009-09-03 Seiko Epson Corp 基板の処理方法及び基板の処理装置
JP2010073849A (ja) * 2008-09-18 2010-04-02 Shibaura Mechatronics Corp 基板処理装置および基板処理方法
KR101005888B1 (ko) * 2008-12-02 2011-01-06 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 이송 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184749A (ja) * 2000-12-12 2002-06-28 Sumitomo Precision Prod Co Ltd 基板処理装置
CN100479092C (zh) * 2002-08-19 2009-04-15 住友精密工业株式会社 升降式基板处理装置及具有该装置的基板处理系统
CN1992152A (zh) * 2005-12-29 2007-07-04 Lg.菲利浦Lcd株式会社 用于制造平板显示装置的蚀刻设备及使用其的制造方法

Also Published As

Publication number Publication date
TW201332038A (zh) 2013-08-01
JP2013149942A (ja) 2013-08-01
KR101298220B1 (ko) 2013-08-22
KR20130085764A (ko) 2013-07-30
JP5544000B2 (ja) 2014-07-09

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Application publication date: 20130724