CN103117353B - A kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs - Google Patents
A kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs Download PDFInfo
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- CN103117353B CN103117353B CN201310040296.5A CN201310040296A CN103117353B CN 103117353 B CN103117353 B CN 103117353B CN 201310040296 A CN201310040296 A CN 201310040296A CN 103117353 B CN103117353 B CN 103117353B
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Abstract
The present invention relates to a kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs, the component of this fluorescent glue includes silica gel, fluorescent material and nanometer antisolvent precipitation powder, described silica gel includes A agent and B agent, and the weight of described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.075～0.3:0.045～0.15.The present invention adds nanometer antisolvent precipitation powder in fluorescent glue, compared to traditional fluorescent glue, can effectively control the settling velocity of fluorescent material, improve the output of LED white light, improve the brightness of LED, thus improve product quality.
Description
Technical field
The present invention relates to a kind of fluorescent glue and use the technique of fluorescent glue encapsulation white light LEDs, particularly relating to a kind of fluorescent glue improving LED white light output and the technique using fluorescent glue encapsulation white light LEDs.
Background technology
Light emitting diode is a kind of solid-state semiconductor device, directly electric energy can be converted into luminous energy, has the advantages such as luminous efficiency is high, power consumption is low, response speed is fast, volume is little, life-span length, vibration resistance, applicable volume production.Along with the development of science and technology, LED technology is increasingly widely used in daily life, the most various LED lamp and LED display etc..
The technique of encapsulation LED is typically necessary through die bond, bonding wire, the some step such as glue, baking, the fluorescent glue used in the technique of existing encapsulation white light LEDs is addition fluorescent material in silica gel, such packaging technology is the fastest due to fluorescent material precipitation, thus affect the white light output of LED, affect the brightness of LED.
Summary of the invention
It is an object of the invention to the defect overcoming prior art to exist, it is provided that a kind of fluorescent glue improving LED white light output and the technique using fluorescent glue encapsulation white light LEDs.
The technical scheme realizing the object of the invention is: a kind of fluorescent glue, its component includes silica gel, fluorescent material and nanometer antisolvent precipitation powder, and described silica gel includes A agent and B agent.
Preferably, the weight of described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.075～0.3:0.045～0.15.
Preferably, the weight of described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.15:0.075.
A kind of technique using fluorescent glue encapsulation white light LEDs, comprises the steps:
A, LED chip is arranged on support, then toasts；
B, carry out bonding wire；
C, choose fluorescent glue according to weight, fluorescent glue is stirred, then puts fluorescent glue；
D, the LED putting fluorescent glue is toasted；
E, until LED cool down after, carry out spectrophotometric test, adhesive label.
Preferably, the baking temperature in described step a is 130 DEG C～150 DEG C, and baking time is 0.5 hour.
Preferably, in described step c, stirring is two stages, and the mixing speed of first stage is 1300～1500 revolutions per seconds, and mixing time is 200 seconds；The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds.
Preferably, in described step d, baking is three phases, and the baking temperature of first stage is 50 DEG C～60 DEG C, and baking time is 0.5 hour；The baking temperature of second stage is 90 DEG C～100 DEG C, and baking time is 0.5 hour, and three grades of baking temperatures are 150 DEG C～160 DEG C, and baking time is 4 hours.
The present invention has positive effect: add nanometer antisolvent precipitation powder in fluorescent glue, compared to traditional fluorescent glue, can effectively control the settling velocity of fluorescent material, improve the output of LED white light, improve the brightness of LED, thus improve product quality.
Detailed description of the invention
Embodiment 1
A kind of technique using fluorescent glue encapsulation white light LEDs, comprises the steps:
A, LED chip being arranged on support, then toast, baking temperature is 130 DEG C, and baking time is 0.5 hour；
B, carry out bonding wire；
C, according to weight A agent 1:B agent 0.5: fluorescent material 0.075: nanometer antisolvent precipitation powder 0.045 chooses fluorescent glue, is stirred by fluorescent glue, stirring is two stages, and the mixing speed of first stage is 1300 revolutions per seconds, and mixing time is 200 seconds；The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds, then puts fluorescent glue；
D, being toasted by the LED putting fluorescent glue, toast as three phases, the baking temperature of first stage is 50 DEG C, and baking time is 0.5 hour；The baking temperature of second stage is 100 DEG C, and baking time is 0.5 hour, and three grades of baking temperatures are 160 DEG C, and baking time is 4 hours；
E, until LED cool down after, carry out spectrophotometric test, adhesive label.
In above-described embodiment 1, fluorescent glue adds nanometer antisolvent precipitation powder, compared to traditional fluorescent glue, can effectively control the settling velocity of fluorescent material, improve the output of LED white light, improve the brightness of LED, thus improve product quality.
Embodiment 2
Preferably, the weight of described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.15:0.075.
A kind of technique using fluorescent glue encapsulation white light LEDs, comprises the steps:
A, LED chip being arranged on support, then toast, baking temperature is 140 DEG C, and baking time is 0.5 hour；
B, carry out bonding wire；
C, according to weight A agent 1:B agent 0.5: fluorescent material 0.15: nanometer antisolvent precipitation powder 0.075 chooses fluorescent glue, is stirred by fluorescent glue, stirring is two stages, and the mixing speed of first stage is 1500 revolutions per seconds, and mixing time is 200 seconds；The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds, then puts fluorescent glue；
D, being toasted by the LED putting fluorescent glue, toast as three phases, the baking temperature of first stage is 60 DEG C, and baking time is 0.5 hour；The baking temperature of second stage is 90 DEG C, and baking time is 0.5 hour, and three grades of baking temperatures are 150 DEG C, and baking time is 4 hours；
E, until LED cool down after, carry out spectrophotometric test, adhesive label.
Embodiment 3
A kind of technique using fluorescent glue encapsulation white light LEDs, comprises the steps:
A, LED chip being arranged on support, then toast, baking temperature is 150 DEG C, and baking time is 0.5 hour；
B, carry out bonding wire；
C, according to weight A agent 1:B agent 0.5: fluorescent material 0.3: nanometer antisolvent precipitation powder 0.15 chooses fluorescent glue, is stirred by fluorescent glue, stirring is two stages, and the mixing speed of first stage is 1400 revolutions per seconds, and mixing time is 200 seconds；The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds, then puts fluorescent glue；
D, being toasted by the LED putting fluorescent glue, toast as three phases, the baking temperature of first stage is 55 DEG C, and baking time is 0.5 hour；The baking temperature of second stage is 95 DEG C, and baking time is 0.5 hour, and three grades of baking temperatures are 155 DEG C, and baking time is 4 hours；
E, until LED cool down after, carry out spectrophotometric test, adhesive label.
Particular embodiments described above; the purpose of the present invention, technical scheme and beneficial effect are further described; it is it should be understood that; the foregoing is only the specific embodiment of the present invention; it is not limited to the present invention; all within the spirit and principles in the present invention, any modification, equivalent substitution and improvement etc. done, should be included within the scope of the present invention.
Claims (3)
1. the technique using fluorescent glue encapsulation white light LEDs, it is characterised in that comprise the steps:
A, LED chip is arranged on support, then toasts；
B, carry out bonding wire；
C, choose fluorescent glue according to weight, fluorescent glue is stirred, then puts fluorescent glue；The group of described fluorescent glue
Dividing and include silica gel, fluorescent material and nanometer antisolvent precipitation powder, described silica gel includes A agent and B agent；Described A agent, B agent, fluorescence
The weight of powder and nanometer antisolvent precipitation powder is 1:0.5:0.075～0.3:0.045～0.15；Stirring is two stages,
The mixing speed of first stage is 1300～1500 revolutions per seconds, and mixing time is 200 seconds；The mixing speed of second stage is 700
Revolutions per second, mixing time is 250 seconds；
D, the LED putting fluorescent glue is toasted, toasts as three phases, the baking temperature of first stage be 50 DEG C～
60 DEG C, baking time is 0.5 hour；The baking temperature of second stage is 90 DEG C～100 DEG C, and baking time is 0.5 hour,
The baking temperature of phase III is 150 DEG C～160 DEG C, and baking time is 4 hours；
E, until LED cool down after, carry out spectrophotometric test, adhesive label.
The technique of use fluorescent glue the most according to claim 1 encapsulation white light LEDs, it is characterised in that described A agent, B
The weight of agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.15:0.075.
The technique of use fluorescent glue the most according to claim 1 encapsulation white light LEDs, it is characterised in that described step a
In baking temperature be 130 DEG C～150 DEG C, baking time is 0.5 hour.
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| CN201310040296.5A CN103117353B (en) | 2013-02-01 | 2013-02-01 | A kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs |
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| CN201310040296.5A CN103117353B (en) | 2013-02-01 | 2013-02-01 | A kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs |
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| CN103117353B true CN103117353B (en) | 2016-08-10 |
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| CN103343904A (en) * | 2013-07-11 | 2013-10-09 | 王珏越 | Integrated photoelectric engine module |
| CN104465952A (en) * | 2014-12-16 | 2015-03-25 | 常熟卓辉光电科技股份有限公司 | LED packaging method |
| CN105938867A (en) * | 2016-06-13 | 2016-09-14 | 深圳市玲涛光电科技有限公司 | Rubber mixing process and LED lamp bead |
| CN108022919A (en) * | 2017-11-02 | 2018-05-11 | 江苏稳润光电科技有限公司 | A kind of raising white light LEDs enter BIN rate methods |
| CN108611045A (en) * | 2018-04-19 | 2018-10-02 | 武汉华星光电技术有限公司 | Fluorescent glue and preparation method thereof, backlight module |
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| CN102544327A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN202712264U (en) * | 2012-07-10 | 2013-01-30 | 深圳市聚飞光电股份有限公司 | Light emitting diode |
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| KR100902988B1 (en) * | 2002-08-26 | 2009-06-15 | 라이트온 테크놀러지 코포레이션 | Method for manufacturing white light emitting diode |
| CN102324453A (en) * | 2011-09-30 | 2012-01-18 | 深圳市灏天光电有限公司 | High-power LED (Light Emitting Diode) packaging process of double-layer lens |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544327A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN202712264U (en) * | 2012-07-10 | 2013-01-30 | 深圳市聚飞光电股份有限公司 | Light emitting diode |
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Effective date of registration: 20161226 Address after: 200000 Shanghai city Songjiang District Yang Shi Road No. 88 Patentee after: Shanghai Advanced Silicon Technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215000 Suzhou Industrial Park trichosanthis turnip Zhen Dong Fu Road No. 15 Venture Industrial District No. 9 factory Patentee before: Suzhou Jointec Co., Ltd. |
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Address after: 200000 No. 88, Yangshi Road, Songjiang District, Shanghai Patentee after: Shanghai Chaosi Semiconductor Co.,Ltd. Address before: 200000 No. 88, Yangshi Road, Songjiang District, Shanghai Patentee before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. |