CN104465952A - LED packaging method - Google Patents
LED packaging method Download PDFInfo
- Publication number
- CN104465952A CN104465952A CN201410774143.8A CN201410774143A CN104465952A CN 104465952 A CN104465952 A CN 104465952A CN 201410774143 A CN201410774143 A CN 201410774143A CN 104465952 A CN104465952 A CN 104465952A
- Authority
- CN
- China
- Prior art keywords
- support
- led
- glue
- mould
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 48
- 239000004593 Epoxy Substances 0.000 claims abstract description 14
- 241000218202 Coptis Species 0.000 claims abstract description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 8
- 239000004568 cement Substances 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000012296 anti-solvent Substances 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 238000001556 precipitation Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000005286 illumination Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000005086 pumping Methods 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
- 238000010411 cooking Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging method and belongs to the field of LED illumination. According to the method, an LED chip is fixed to insulation paste to be baked, one end of a gold thread is welded to the LED chip, and the other end of the gold thread is welded to a support; fluorescent glue is dispensed to the bottom of a reflection cup of the support to be baked; cover seal glue is placed and subjected to vacuum pumping, a die is preheated, and then the cover seal glue is poured into the die; the top of the support is inserted in the die, baked and naturally cooled, and an LED product is manufactured. The LED packaging method is simple in technology, the packaging cost is low, the requirement for mass production can be met, through the raw material components and the ratio of the fluorescent glue and the epoxy cover seal glue, the service life of an LED is greatly prolonged, stability is high, and the LED packaging method can be conveniently applied and popularized.
Description
Technical field
The present invention relates to a kind of LED encapsulation method, specifically go up the LED encapsulation method of a kind of long service life, good stability, belong to field of LED illumination.
Background technology
At present, due to LED (light-emitting diode) there is high security, operate steadily, low energy consumption, specular removal, life-span are long etc., and multiple advantage is applied to panel computer, notebook computer, liquid crystal display, large-size liquid crystal television and room lighting and outdoor lighting field more and more widely.
The application of encapsulation to LED of LED has very important effect, some current conventional method for packing encapsulate out LED useful life short, poor stability, cost is also relatively high, the development of restriction LED industry.
Summary of the invention
Technical problem to be solved by this invention is to overcome existing technological deficiency, provides the LED encapsulation method of a kind of finished product long service life, good stability.
In order to solve the problems of the technologies described above, LED encapsulation method provided by the invention, comprises the following steps:
1), provide LED chip, several gold thread, insulating cement, fluorescent glue, cap seal glue and support, the top of described support is formed with the reflector for placing LED chip;
2), by insulating cement point in the bottom of reflector, then LED chip is placed on this insulating cement and is fixed;
3), by the support being fixed with LED chip toast, baking temperature is 115 ~ 135 DEG C, and baking time is set to 200min ~ 300min;
4), be welded on LED chip by gold thread one end, the other end is welded on support, realizes LED chip and support is conducted;
5), fluorescent glue is clicked and entered the bottom of the reflector of described support, until the glue face of clicking and entering the fluorescent glue in reflector is concordant with the rim of a cup of described reflector;
6), by point have the support of fluorescent glue to toast, baking temperature is 145-155 DEG C, and baking time is set to 90min ~ 180min;
7), vacuumize 25 ~ 40 min in the case that cap seal glue is placed on 38 DEG C of-42 DEG C of constant temperature, according to the required shaping corresponding mould of LED shape preparation, this mould is placed on preheating 50 min ~ 60min in more than 100 DEG C baking ovens, cap seal glue is poured in mould;
8), by the top of support insert in mould, and toast, baking temperature is 140 ~ 155 DEG C, and baking time is set to 75min-95min, terminates rear cooling naturally, is taken out by support from mould, obtained LED product.
In the present invention, described fluorescent glue is made up of silica gel, fluorescent material and nanometer antisolvent precipitation powder, and the weight of described silica gel, fluorescent material and nanometer antisolvent precipitation powder is 1:1:1.
In the present invention, described cap seal glue is epoxy cap seal glue, and by A and B two kinds of components, the weight ratio of A, B component is A: B=2: 1; Component A weight proportion is: bisphenol A type epoxy resin 90, polystyrene 30, filler 80; B component weight proportion is: curing agent 50, filler 50.
Method for packing technique of the present invention is simple and easy, and packaging cost is low, can meet the requirement of mass production, and by material component and the proportioning of fluorescent glue and epoxy cap seal glue, greatly can extend LED useful life, stability is high, easy to utilize.
Embodiment
Below in conjunction with specific embodiment, the present invention is described in further detail.
embodiment 1
1) LED chip, several gold thread, insulating cement, fluorescent glue, epoxy cap seal glue and support, is prepared; Wherein, the top of support is formed with the reflector for placing LED chip; Fluorescent glue is made up of silica gel, fluorescent material and nanometer antisolvent precipitation powder, and the weight of silica gel, fluorescent material and nanometer antisolvent precipitation powder is 1:1:1; Epoxy cap seal glue, by A and B two kinds of components, the weight ratio of A, B component is A: B=2: 1; Component A weight proportion is: bisphenol A type epoxy resin 90, polystyrene 30, filler 80; B component weight proportion is: curing agent 50, filler 50.
2), by insulating cement point in the bottom of reflector, then LED chip is placed on this insulating cement and is fixed;
3), the support being fixed with LED chip is moved to baking box toast, baking temperature is 114 DEG C, and baking time is set to 250min;
4), be welded on LED chip by gold thread one end, the other end is welded on support, realizes LED chip and support is conducted;
5), fluorescent glue is clicked and entered the bottom of the reflector of described support, until the glue face of clicking and entering the fluorescent glue in reflector is concordant with the rim of a cup of described reflector;
6), by point have the support of fluorescent glue to move to baking box to toast, baking temperature is 150 DEG C, and baking time is set to 135min;
7), vacuumize 32min in the case that epoxy cap seal glue is placed on 40 DEG C of constant temperature, according to the required shaping corresponding mould of LED shape preparation, this mould is placed on preheating 55min in more than 100 DEG C baking ovens, epoxy cap seal glue is poured in mould;
8), by the top of support insert in mould, and move to oven cooking cycle, baking temperature is 145 DEG C, and baking time is set to 80min, terminates rear cooling naturally, is taken out by support from mould, obtained LED product.
embodiment 2
Step 1), 2), 4), 5) identical with embodiment 1, all the other:
3), the support being fixed with LED chip is moved to baking box toast, baking temperature is 135 DEG C, and baking time is set to 200mmin;
6), by point have the support of fluorescent glue to move to baking box to toast, baking temperature is 146 DEG C, and baking time is set to 91min;
7), vacuumize 26min in the case that epoxy cap seal glue is placed on 38 DEG C of constant temperature, according to the required shaping corresponding mould of LED shape preparation, this mould is placed on preheating 56min in more than 100 DEG C baking ovens, epoxy cap seal glue is poured in mould;
8), by the top of support insert in mould, and move to oven cooking cycle, baking temperature is 141 DEG C, and baking time is set to 75min, terminates rear cooling naturally, is taken out by support from mould, obtained LED product.
embodiment 3
Step 1), 2), 4), 5) identical with embodiment 1, all the other:
3), the support being fixed with LED chip is moved to baking box toast, baking temperature is 120 DEG C, and baking time is set to 300mmin;
6), by point have the support of fluorescent glue to move to baking box to toast, baking temperature is 155 DEG C, and baking time is set to 177min;
7), vacuumize 40min in the case that epoxy cap seal glue is placed on 42 DEG C of constant temperature, according to the required shaping corresponding mould of LED shape preparation, this mould is placed on preheating 60min in more than 100 DEG C baking ovens, epoxy cap seal glue is poured in mould;
8), by the top of support insert in mould, and move to oven cooking cycle, baking temperature is 155 DEG C, and baking time is set to 94min, terminates rear cooling naturally, is taken out by support from mould, obtained LED product.
embodiment 4
Step 1), 2), 4), 5) identical with embodiment 1, all the other:
3), the support being fixed with LED chip is moved to baking box toast, baking temperature is 126 DEG C, and baking time is set to 276mmin;
6), by point have the support of fluorescent glue to move to baking box to toast, baking temperature is 153 DEG C, and baking time is set to 161min;
7), vacuumize 35min in the case that epoxy cap seal glue is placed on 41 DEG C of constant temperature, according to the required shaping corresponding mould of LED shape preparation, this mould is placed on preheating 57min in more than 100 DEG C baking ovens, epoxy cap seal glue is poured in mould;
8), by the top of support insert in mould, and move to oven cooking cycle, baking temperature is 150 DEG C, and baking time is set to 875min, terminates rear cooling naturally, is taken out by support from mould, obtained LED product.
The above is only the preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, can also make some improvement under the premise without departing from the principles of the invention, and these improvement also should be considered as protection scope of the present invention.
Claims (3)
1. a LED encapsulation method, is characterized in that comprising the following steps:
1), provide LED chip, several gold thread, insulating cement, fluorescent glue, cap seal glue and support, the top of described support is formed with the reflector for placing LED chip;
2), by insulating cement point in the bottom of reflector, then LED chip is placed on this insulating cement and is fixed;
3), by the support being fixed with LED chip toast, baking temperature is 115 ~ 135 DEG C, and baking time is set to 200min ~ 300min;
4), be welded on LED chip by gold thread one end, the other end is welded on support, realizes LED chip and support is conducted;
5), fluorescent glue is clicked and entered the bottom of the reflector of described support, until the glue face of clicking and entering the fluorescent glue in reflector is concordant with the rim of a cup of described reflector;
6), by point have the support of fluorescent glue to toast, baking temperature is 145-155 DEG C, and baking time is set to 90min ~ 180min;
7), vacuumize 25 ~ 40 min in the case that cap seal glue is placed on 38 DEG C of-42 DEG C of constant temperature, according to the required shaping corresponding mould of LED shape preparation, this mould is placed on preheating 50 min ~ 60min in more than 100 DEG C baking ovens, cap seal glue is poured in mould;
8), by the top of support insert in mould, and toast, baking temperature is 140 ~ 155 DEG C, and baking time is set to 75min-95min, terminates rear cooling naturally, is taken out by support from mould, obtained LED product.
2. LED encapsulation method according to claim 1, is characterized in that: described fluorescent glue is made up of silica gel, fluorescent material and nanometer antisolvent precipitation powder, and the weight of described silica gel, fluorescent material and nanometer antisolvent precipitation powder is 1:1:1.
3. LED encapsulation method according to claim 1 and 2, is characterized in that: described cap seal glue is epoxy cap seal glue, and by A and B two kinds of components, the weight ratio of A, B component is A: B=2: 1; Component A weight proportion is: bisphenol A type epoxy resin 90, polystyrene 30, filler 80; B component weight proportion is: curing agent 50, filler 50.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410774143.8A CN104465952A (en) | 2014-12-16 | 2014-12-16 | LED packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410774143.8A CN104465952A (en) | 2014-12-16 | 2014-12-16 | LED packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104465952A true CN104465952A (en) | 2015-03-25 |
Family
ID=52911674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410774143.8A Pending CN104465952A (en) | 2014-12-16 | 2014-12-16 | LED packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104465952A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195760A (en) * | 2017-04-26 | 2017-09-22 | 安徽欧瑞特照明有限公司 | A kind of LED packaging technologies |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299447A (en) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | Package process for high-power LED |
| CN102832317A (en) * | 2012-08-16 | 2012-12-19 | 东莞市钜晶光电有限公司 | Red LED packaging method |
| CN103117353A (en) * | 2013-02-01 | 2013-05-22 | 苏州君耀光电有限公司 | Fluorescent glue and process of packaging white light LED (light-emitting diode) by same |
-
2014
- 2014-12-16 CN CN201410774143.8A patent/CN104465952A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101299447A (en) * | 2007-09-29 | 2008-11-05 | 鹤山丽得电子实业有限公司 | Package process for high-power LED |
| CN102832317A (en) * | 2012-08-16 | 2012-12-19 | 东莞市钜晶光电有限公司 | Red LED packaging method |
| CN103117353A (en) * | 2013-02-01 | 2013-05-22 | 苏州君耀光电有限公司 | Fluorescent glue and process of packaging white light LED (light-emitting diode) by same |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107195760A (en) * | 2017-04-26 | 2017-09-22 | 安徽欧瑞特照明有限公司 | A kind of LED packaging technologies |
| CN107195760B (en) * | 2017-04-26 | 2020-01-17 | 安徽欧瑞特照明有限公司 | LED packaging process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |
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| WD01 | Invention patent application deemed withdrawn after publication |