CN103117353A - Fluorescent glue and process of packaging white light LED (light-emitting diode) by same - Google Patents
Fluorescent glue and process of packaging white light LED (light-emitting diode) by same Download PDFInfo
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- CN103117353A CN103117353A CN2013100402965A CN201310040296A CN103117353A CN 103117353 A CN103117353 A CN 103117353A CN 2013100402965 A CN2013100402965 A CN 2013100402965A CN 201310040296 A CN201310040296 A CN 201310040296A CN 103117353 A CN103117353 A CN 103117353A
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Abstract
The invention relates to fluorescent glue and a process of packaging a white light LED (light-emitting diode) by the same. The fluorescent glue comprises silica gel, fluorescent powder and nano anti-precipitating powder. The silica gel includes agent A and agent B. The weight ratio among the agent A, the agent B, the fluorescent powder and the nano anti-precipitating powder is 1: 0.5: (0.075-0.3): (0.045-0.15). Since the nano anti-precipitating powder is added into the fluorescent powder, precipitation speed of the fluorescent powder can be effectively controlled, output of white light of an LED can be increased, luminance of the LED can be improved, and product quality of the LED can be improved, as compared with those of traditional fluorescent glue.
Description
Technical field
The present invention relates to a kind of fluorescent glue and use fluorescent glue to encapsulate the technique of white light LEDs, relate in particular to a kind of fluorescent glue of the LED of raising white light output and use fluorescent glue to encapsulate the technique of white light LEDs.
Background technology
Light-emitting diode is a kind of solid-state semiconductor device, can be electric energy conversion directly luminous energy, has the advantages such as luminous efficiency is high, power consumption is low, reaction speed is fast, volume is little, the life-span is long, vibration resistance, suitable volume production.Along with the development of science and technology, the LED technology more and more is widely used in daily life, such as various LED light fixtures and LED display etc.
The technique of packaged LED generally all needs through steps such as die bond, bonding wire, some glue, bakings, the fluorescent glue that uses in the technique of existing encapsulation white light LEDs is to add fluorescent material in silica gel, such packaging technology is because the fluorescent material precipitation is too fast, thereby affect the white light output of LED, affect the brightness of LED lamp.
Summary of the invention
The objective of the invention is to overcome the defective that prior art exists, a kind of fluorescent glue of the LED of raising white light output is provided and uses fluorescent glue to encapsulate the technique of white light LEDs.
The technical scheme that realizes the object of the invention is: a kind of fluorescent glue, its component comprise silica gel, fluorescent material and nanometer antisolvent precipitation powder, and described silica gel comprises A agent and B agent.
The weight portion proportioning of preferably, described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.075～0.3:0.045～0.15.
The weight portion proportioning of preferably, described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.15:0.075.
A kind of technique of using fluorescent glue encapsulation white light LEDs comprises the steps:
A, LED chip is arranged on support, then toasts;
B, carry out bonding wire;
C, choose fluorescent glue according to the weight portion proportioning, fluorescent glue is stirred, then put fluorescent glue;
D, the LED that will put fluorescent glue toast;
E, after LED is cooling, carry out spectrophotometric test, adhesive label.
Preferably, the baking temperature in described step a is 130 ℃～150 ℃, and stoving time is 0.5 hour.
Preferably, stirring in described step c is two stages, and the mixing speed of phase I is 1300～1500 revolutions per seconds, and mixing time is 200 seconds; The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds.
Preferably, in described steps d, baking is three phases, and the baking temperature of phase I is 50 ℃～60 ℃, and stoving time is 0.5 hour; The baking temperature of second stage is 90 ℃～100 ℃, and stoving time is 0.5 hour, and three grades of baking temperatures are 150 ℃～160 ℃, and stoving time is 4 hours.
The present invention has positive effect: add nanometer antisolvent precipitation powder in fluorescent glue, compared to traditional fluorescent glue, can effectively control the settling velocity of fluorescent material, improve the output of LED white light, improve the brightness of LED, thereby improve the quality of products.
Embodiment
Embodiment 1
A kind of technique of using fluorescent glue encapsulation white light LEDs comprises the steps:
A, LED chip is arranged on support, then toasts, baking temperature is 130 ℃, and stoving time is 0.5 hour;
B, carry out bonding wire;
C, according to weight portion proportioning A agent 1:B agent 0.5: fluorescent material 0.075: nanometer antisolvent precipitation powder 0.045 is chosen fluorescent glue, and fluorescent glue is stirred, and stirring is two stages, and the mixing speed of phase I is 1300 revolutions per seconds, and mixing time is 200 seconds; The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds, then puts fluorescent glue;
D, the LED that will put fluorescent glue toast, and toast to be that three phases, the baking temperature of phase I are 50 ℃, and stoving time is 0.5 hour; The baking temperature of second stage is 100 ℃, and stoving time is 0.5 hour, and three grades of baking temperatures are 160 ℃, and stoving time is 4 hours;
E, after LED is cooling, carry out spectrophotometric test, adhesive label.
In above-described embodiment 1, add nanometer antisolvent precipitation powder in fluorescent glue, compared to traditional fluorescent glue, can effectively control the settling velocity of fluorescent material, improve the output of LED white light, improve the brightness of LED, thereby improve the quality of products.
Embodiment 2
The weight portion proportioning of preferably, described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.15:0.075.
A kind of technique of using fluorescent glue encapsulation white light LEDs comprises the steps:
A, LED chip is arranged on support, then toasts, baking temperature is 140 ℃, and stoving time is 0.5 hour;
B, carry out bonding wire;
C, according to weight portion proportioning A agent 1:B agent 0.5: fluorescent material 0.15: nanometer antisolvent precipitation powder 0.075 is chosen fluorescent glue, and fluorescent glue is stirred, and stirring is two stages, and the mixing speed of phase I is 1500 revolutions per seconds, and mixing time is 200 seconds; The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds, then puts fluorescent glue;
D, the LED that will put fluorescent glue toast, and toast to be that three phases, the baking temperature of phase I are 60 ℃, and stoving time is 0.5 hour; The baking temperature of second stage is 90 ℃, and stoving time is 0.5 hour, and three grades of baking temperatures are 150 ℃, and stoving time is 4 hours;
E, after LED is cooling, carry out spectrophotometric test, adhesive label.
Embodiment 3
A kind of technique of using fluorescent glue encapsulation white light LEDs comprises the steps:
A, LED chip is arranged on support, then toasts, baking temperature is 150 ℃, and stoving time is 0.5 hour;
B, carry out bonding wire;
C, according to weight portion proportioning A agent 1:B agent 0.5: fluorescent material 0.3: nanometer antisolvent precipitation powder 0.15 is chosen fluorescent glue, and fluorescent glue is stirred, and stirring is two stages, and the mixing speed of phase I is 1400 revolutions per seconds, and mixing time is 200 seconds; The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds, then puts fluorescent glue;
D, the LED that will put fluorescent glue toast, and toast to be that three phases, the baking temperature of phase I are 55 ℃, and stoving time is 0.5 hour; The baking temperature of second stage is 95 ℃, and stoving time is 0.5 hour, and three grades of baking temperatures are 155 ℃, and stoving time is 4 hours;
E, after LED is cooling, carry out spectrophotometric test, adhesive label.
Above-described specific embodiment; purpose of the present invention, technical scheme and beneficial effect are further described; institute is understood that; the above is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any modification of making, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (7)
1. a fluorescent glue, is characterized in that, its component comprises silica gel, fluorescent material and nanometer antisolvent precipitation powder, and described silica gel comprises A agent and B agent.
2. fluorescent glue according to claim 1, is characterized in that, the weight portion proportioning of described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.075～0.3:0.045～0.15.
3. fluorescent glue according to claim 2, is characterized in that, the weight portion proportioning of described A agent, B agent, fluorescent material and nanometer antisolvent precipitation powder is 1:0.5:0.15:0.075.
4. the technique of a described use fluorescent glue encapsulation white light LEDs as arbitrary in claim 1-3, is characterized in that, comprises the steps:
A, LED chip is arranged on support, then toasts;
B, carry out bonding wire;
C, choose fluorescent glue according to the weight portion proportioning, fluorescent glue is stirred, then put fluorescent glue;
D, the LED that will put fluorescent glue toast;
E, after LED is cooling, carry out spectrophotometric test, adhesive label.
5. the technique of use fluorescent glue encapsulation white light LEDs according to claim 4, is characterized in that, the baking temperature in described step a is 130 ℃～150 ℃, and stoving time is 0.5 hour.
6. the technique of use fluorescent glue encapsulation white light LEDs according to claim 4, is characterized in that, stirring in described step c is two stages, and the mixing speed of phase I is 1300～1500 revolutions per seconds, and mixing time is 200 seconds; The mixing speed of second stage is 700 revolutions per seconds, and mixing time is 250 seconds.
7. the technique of use fluorescent glue encapsulation white light LEDs according to claim 4, is characterized in that, in described steps d, baking is three phases, and the baking temperature of phase I is 50 ℃～60 ℃, and stoving time is 0.5 hour; The baking temperature of second stage is 90 ℃～100 ℃, and stoving time is 0.5 hour, and three grades of baking temperatures are 150 ℃～160 ℃, and stoving time is 4 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310040296.5A CN103117353B (en) | 2013-02-01 | 2013-02-01 | A kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310040296.5A CN103117353B (en) | 2013-02-01 | 2013-02-01 | A kind of fluorescent glue and the technique using fluorescent glue encapsulation white light LEDs |
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| CN103117353A true CN103117353A (en) | 2013-05-22 |
| CN103117353B CN103117353B (en) | 2016-08-10 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103343904A (en) * | 2013-07-11 | 2013-10-09 | 王珏越 | Integrated photoelectric engine module |
| CN104465952A (en) * | 2014-12-16 | 2015-03-25 | 常熟卓辉光电科技股份有限公司 | LED packaging method |
| CN105938867A (en) * | 2016-06-13 | 2016-09-14 | 深圳市玲涛光电科技有限公司 | Rubber mixing process and LED lamp bead |
| CN108022919A (en) * | 2017-11-02 | 2018-05-11 | 江苏稳润光电科技有限公司 | A kind of raising white light LEDs enter BIN rate methods |
| CN108611045A (en) * | 2018-04-19 | 2018-10-02 | 武汉华星光电技术有限公司 | Fluorescent glue and preparation method thereof, backlight module |
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| KR100902988B1 (en) * | 2002-08-26 | 2009-06-15 | 라이트온 테크놀러지 코포레이션 | Method for manufacturing white light emitting diode |
| CN102324453A (en) * | 2011-09-30 | 2012-01-18 | 深圳市灏天光电有限公司 | High-power LED (Light Emitting Diode) packaging process of double-layer lens |
| CN102544327A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN202712264U (en) * | 2012-07-10 | 2013-01-30 | 深圳市聚飞光电股份有限公司 | Light emitting diode |
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2013
- 2013-02-01 CN CN201310040296.5A patent/CN103117353B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100902988B1 (en) * | 2002-08-26 | 2009-06-15 | 라이트온 테크놀러지 코포레이션 | Method for manufacturing white light emitting diode |
| CN102324453A (en) * | 2011-09-30 | 2012-01-18 | 深圳市灏天光电有限公司 | High-power LED (Light Emitting Diode) packaging process of double-layer lens |
| CN102544327A (en) * | 2012-01-13 | 2012-07-04 | 深圳市兆驰节能照明有限公司 | White light LED (light emitting diode) and packaging process thereof |
| CN202712264U (en) * | 2012-07-10 | 2013-01-30 | 深圳市聚飞光电股份有限公司 | Light emitting diode |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103343904A (en) * | 2013-07-11 | 2013-10-09 | 王珏越 | Integrated photoelectric engine module |
| CN104465952A (en) * | 2014-12-16 | 2015-03-25 | 常熟卓辉光电科技股份有限公司 | LED packaging method |
| CN105938867A (en) * | 2016-06-13 | 2016-09-14 | 深圳市玲涛光电科技有限公司 | Rubber mixing process and LED lamp bead |
| CN108022919A (en) * | 2017-11-02 | 2018-05-11 | 江苏稳润光电科技有限公司 | A kind of raising white light LEDs enter BIN rate methods |
| CN108611045A (en) * | 2018-04-19 | 2018-10-02 | 武汉华星光电技术有限公司 | Fluorescent glue and preparation method thereof, backlight module |
Also Published As
| Publication number | Publication date |
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| CN103117353B (en) | 2016-08-10 |
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Effective date of registration: 20161226 Address after: 200000 Shanghai city Songjiang District Yang Shi Road No. 88 Patentee after: Shanghai Advanced Silicon Technology Co., Ltd. Address before: Suzhou City, Jiangsu province 215000 Suzhou Industrial Park trichosanthis turnip Zhen Dong Fu Road No. 15 Venture Industrial District No. 9 factory Patentee before: Suzhou Jointec Co., Ltd. |
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Address after: 200000 No. 88, Yangshi Road, Songjiang District, Shanghai Patentee after: Shanghai Chaosi Semiconductor Co.,Ltd. Address before: 200000 No. 88, Yangshi Road, Songjiang District, Shanghai Patentee before: SHANGHAI ADVANCED SILICON TECHNOLOGY Co.,Ltd. |
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