CN206820019U - A kind of red-light LED lamp bead - Google Patents

A kind of red-light LED lamp bead Download PDF

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Publication number
CN206820019U
CN206820019U CN201720736954.8U CN201720736954U CN206820019U CN 206820019 U CN206820019 U CN 206820019U CN 201720736954 U CN201720736954 U CN 201720736954U CN 206820019 U CN206820019 U CN 206820019U
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China
Prior art keywords
red
support
chip
lamp bead
light
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CN201720736954.8U
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Chinese (zh)
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苏利雄
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Shenzhen Destar Opto-Electronics Technology Co Ltd
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Shenzhen Destar Opto-Electronics Technology Co Ltd
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Abstract

The utility model discloses a kind of red-light LED lamp bead, including support, the blue chip being arranged on support, connection blue chip to cause the bonding wire of circuit communication and the phosphor powder layer of red with support;Wherein, it is transmitted to by the connection of bonding wire, the electric energy of power supply by support on blue chip, excites PN junction to light, blue chip is luminous to excite red light fluorescent powder layer, so as to send feux rouges.The utility model adds Red phosphor layer using blue chip, so as to realize feux rouges, possess the function as traditional red light chips, cost ratio is low using red light chips, and due to voltage and blue green light lamp bead voltage always, in circuit design, also obvious more traditional feux rouges designs well.

Description

A kind of red-light LED lamp bead
Technical field
The present invention relates to LED technical field, more particularly to a kind of red-light LED lamp bead.
Background technology
LED is the abbreviation of English lightemittingdiode (light emitting diode), and its basic structure is one piece electroluminescent Luminous semi-conducting material, it is placed on a leaded shelf, then surrounding is sealed with epoxy resin, plays protection inner core The effect of line.
Since 21st century, light source technology is quickly grown, constantly have new technology, new product release, LED light into For the market mainstream.Compared with traditional CCFL backlight, LED light have high colour gamut, high brightness, the long-life, energy-conserving and environment-protective, in real time Many advantages, such as color is controllable, the LED backlight of particularly high colour gamut make using electronics such as its TVs, mobile phone, tablet personal computer Product screen has more chromatic colour, color rendition Du Genggao.
LED luminescence chips, are the core component of LED, that is, the P-N junction referred to.Its major function is that electric energy is converted For luminous energy, at present because red light chips are complicated and much smaller compared with for blue chip in manufacturing process and production yields, cause Red light chips hold at high price.
Therefore the problem of existing for currently available technology, it is necessary to carry out developmental research, to provide a kind of scheme, protecting In the case of demonstrate,proving properties of product, the cost of red-light LED product is reduced.
The content of the invention
In view of this, present invention aims at a kind of red-light LED lamp bead is provided, in the case where ensureing properties of product, drop The cost of low red-light LED product;The technical scheme is as follows:
A kind of red-light LED lamp bead, including support, the blue chip being arranged on support, connection blue chip and support make Obtain the bonding wire of circuit communication and the phosphor powder layer of red;Wherein, passed by the connection of bonding wire, the electric energy of power supply by support Lead on blue chip, excite PN junction to light, blue chip is luminous with excitated red phosphor powder layer, so as to send feux rouges.
Further, the support is used for fixed chip and carrying fluorescent material, and electric current is imported into chip top, core Heat derives caused by piece are come.
Further, the bonding wire is used for the weld pad and support for connecting chip so that circuit can turn on.
Further, the bonding wire is gold thread, a diameter of 0.8mil or 1.0mil.
The beneficial effect of technical scheme provided in an embodiment of the present invention is:
The present invention adds Red phosphor layer using blue chip, so as to realize feux rouges, possesses and traditional red light chips one The function of sample, cost ratio is low using red light chips, and, it is also bright in circuit design. due to voltage and blue light lamp bead voltage always Show more traditional red light chips to design well.
For the above and other objects, features and advantages of the present invention can be become apparent, preferred embodiment cited below particularly, And coordinate institute's accompanying drawings, it is described in detail below.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, make required in being described below to embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings Accompanying drawing.
Fig. 1 is the structural diagrams of red-light LED lamp bead of the present invention.
Fig. 2 is that another angled arrangement of red-light LED lamp bead of the present invention illustrates.
Fig. 3 is that the flow of red-light LED lamp bead manufacture method of the present invention illustrates.
Embodiment
To enable the object of the invention, feature, advantage more obvious and understandable, below in conjunction with the embodiment of the present invention In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that implementation disclosed below Example is only part of the embodiment of the present invention, and not all embodiments.Based on the embodiment in the present invention, those skilled in the art The every other embodiment that member is obtained, belongs to the scope of protection of the invention.
Term " first ", " second " in description and claims of this specification and above-mentioned accompanying drawing etc. are to be used to distinguish Similar object, without for describing specific order or precedence.It should be appreciated that the term so used is in appropriate feelings It can be exchanged under condition, this is only to describe object used differentiation in description in embodiments of the invention to same alike result Mode.In addition, term " comprising " and " having " and their any deformation, it is intended that cover it is non-exclusive include, so as to Process, method, system, product or equipment comprising a series of units are not necessarily limited to those units, but may include unclear Other units that ground is listed or for these processes, method, product or equipment inherently.
The embodiment of the present invention provides a kind of red-light LED lamp bead and its manufacture method and adds red fluorescence powder using blue chip It is packaged, so as to realize feux rouges, possesses the function as traditional red light chips, cost ratio is low using red light chips, and Due to voltage and blue green light lamp bead voltage always, in circuit design, also obvious more traditional feux rouges designs well.
Refering to shown in Fig. 1, Fig. 2, red-light LED lamp bead of the embodiment of the present invention includes support 1, the indigo plant being arranged on support 1 Optical chip 10, connection blue chip 10 cause the bonding wire 12 of circuit communication and the phosphor powder layer 11 of red with support 1.
Wherein, support 1 is used for fixed chip 10 and carrying fluorescent material 11, and electric current is imported into chip top, chip Caused heat derives are come.In the present embodiment, the support is formed by support material by plating, and support is element from inside to outside Material, copper, nickel, copper, this five layers of silver are formed.The support can be band cup support or flat-headed support.
Blue chip 10 is mainly used for lighting, and is made up of luminous semi-conducting material.Such as can use gallium phosphide (GaP), the material such as gallium aluminum arsenide (GaAlAs) or GaAs (GaAs), gallium nitride (GaN) is formed, and its internal structure, which has, unidirectionally to be led Electrically.Chip includes weld pad, and in the embodiment of the present invention, the weld pad is gold pad or aluminium pad, pad shapes for it is circular, square, Cross or other shapes.
Bonding wire 12 is used for the weld pad and support for connecting chip so that circuit can turn on;In the embodiment of the present invention, the weldering Line is gold thread, a diameter of 0.8mil or 1.0mil.Heat is transmitted to up in time by gold thread by support, can be radiated in time. And the tensility of gold thread can be stronger, it is not easy to because the fracture of gold thread causes the phenomenon of dead lamp.
Bonding wire excites PN junction to light, blue light core by allowing the electric energy of power supply to be transmitted to by support on blue chip Piece is lighted to excite red light fluorescent powder layer 11, and feux rouges is sent so as to allow.Specifically, after blue chip is powered, the PN in chip Knot just changes into electric energy 450-460NM luminous energy, allows the red phosphor powder layer of the light-transmissive of this wave band, so as to realize The feux rouges needed.
As shown in fig.3, the manufacture method flow that Fig. 3 is red-light LED lamp bead of the embodiment of the present invention illustrates.The present invention includes Following steps:
Step 1: support is dehumidified inside high temperature roaster, condition is 170 DEG C/2H., can under the baking condition The harmful chemical remained with effectively removing in support.
The support is used for fixed chip and carrying fluorescent material, and electric current is imported into chip top, caused by chip Heat derives are come.In the present embodiment, the support by support material by plating and formed, support be from inside to outside material, copper, Nickel, copper, this five layers of silver are formed.The support can be band cup support or flat-headed support.
Step 2: die bond and bonding wire
Blue chip is adhered on support with high heat conduction primer, then toasted, baking condition is 170 DEG C/1.5H, Under this baking condition, it can allow between primer and chip and support and preferably be combined together, baked material is used Gold thread is welded.
Step 3: point powder
By in cup of the deployed red fluorescent glue coated in support, then toasted, baking condition is:100℃/1H To 150 DEG C/3H;Under this baking condition, glue can be allowed to possess the performances such as more excellent performance, such as sulfuration resistant, moisture resistance.
Specifically, it is then the red glimmering of 630nm by wave band first from moistureproof anti-vulcanization, resistant to elevated temperatures phenyl glue Light powder is added in glue, is stirred by mixer, and mixing time is 30 minutes, that is, allows glue and fluorescent material sufficiently to melt It is combined;Wherein, the ratio of phenyl glue and red fluorescence powder is:1 part of phenyl glue, red fluorescence powder 0.5-1 parts.Then Mixed glue is injected into a powder machine, adjusts the glue amount of better powder machine, carries out dispensing.Glue amount according to the cup type of support and Depending on the proportioning of fluorescent glue, general glue amount will put down a glass nick, ensure the progress of follow-up MOding techniques.
Step 4: cleaning and encapsulation
Material baked in step 3 is subjected to plasma cleaning, Moding encapsulation is carried out after cleaned, then dries again Roasting, baking condition is 150 DEG C/3H.
Step 5: blanking and packaging
Material baked in step 4 is subjected to blanking, light splitting braid is carried out after blanking is good, then carries out labelling bag Dress.
The embodiment of the present invention provides a kind of red-light LED lamp bead and its manufacture method and adds red fluorescence powder using blue chip It is packaged, so as to realize feux rouges, possesses the function as traditional red light chips, cost ratio is low using red light chips, and Due to voltage and blue green light lamp bead voltage always, in circuit design, also obvious more traditional feux rouges designs well.
It is somebody's turn to do above, is only presently preferred embodiments of the present invention, any formal limitation not is made to the present invention, although The present invention is disclosed as above with preferred embodiment, but is not limited to the present invention, any those skilled in the art, is not being taken off In the range of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent variations Equivalent embodiment, as long as being without departing from technical solution of the present invention content, the technical spirit according to the present invention is to above example Any brief introduction modification, equivalent variations and the modification made, in the range of still falling within technical solution of the present invention.

Claims (4)

  1. A kind of 1. red-light LED lamp bead, it is characterised in that:Including support, the blue chip being arranged on support, connection blue chip With support so that the bonding wire of circuit communication and the phosphor powder layer of red;Wherein, led to by the connection of bonding wire, the electric energy of power supply Cross support to be transmitted on blue chip, excite PN junction to light, blue chip is luminous with excitated red phosphor powder layer, so as to send Feux rouges.
  2. 2. red-light LED lamp bead as claimed in claim 1, it is characterised in that:The support is used for fixed chip and carrying fluorescent material, And electric current is imported into chip top, heat derives caused by chip are come.
  3. 3. red-light LED lamp bead as claimed in claim 2, it is characterised in that:The bonding wire is used for the weld pad and support for connecting chip, Circuit is turned on.
  4. 4. red-light LED lamp bead as claimed in claim 3, it is characterised in that:The bonding wire is gold thread, a diameter of 0.8mil or 1.0mil。
CN201720736954.8U 2017-06-23 2017-06-23 A kind of red-light LED lamp bead Active CN206820019U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720736954.8U CN206820019U (en) 2017-06-23 2017-06-23 A kind of red-light LED lamp bead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720736954.8U CN206820019U (en) 2017-06-23 2017-06-23 A kind of red-light LED lamp bead

Publications (1)

Publication Number Publication Date
CN206820019U true CN206820019U (en) 2017-12-29

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107086264A (en) * 2017-06-23 2017-08-22 深圳市德辰光电科技有限公司 A kind of red-light LED lamp bead and its manufacture method
TWI648878B (en) * 2018-05-15 2019-01-21 東貝光電科技股份有限公司 Led light source, manufacturing method of led light source and direct display thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107086264A (en) * 2017-06-23 2017-08-22 深圳市德辰光电科技有限公司 A kind of red-light LED lamp bead and its manufacture method
TWI648878B (en) * 2018-05-15 2019-01-21 東貝光電科技股份有限公司 Led light source, manufacturing method of led light source and direct display thereof

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