CN107086264A - A kind of red-light LED lamp bead and its manufacture method - Google Patents
A kind of red-light LED lamp bead and its manufacture method Download PDFInfo
- Publication number
- CN107086264A CN107086264A CN201710484441.7A CN201710484441A CN107086264A CN 107086264 A CN107086264 A CN 107086264A CN 201710484441 A CN201710484441 A CN 201710484441A CN 107086264 A CN107086264 A CN 107086264A
- Authority
- CN
- China
- Prior art keywords
- red
- support
- lamp bead
- chip
- led lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011324 bead Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000843 powder Substances 0.000 claims abstract description 25
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000004891 communication Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 19
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 238000002372 labelling Methods 0.000 claims description 3
- 238000004073 vulcanization Methods 0.000 claims description 3
- 241000218202 Coptis Species 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 3
- 244000247747 Coptis groenlandica Species 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention discloses a kind of red-light LED lamp bead, including support, the blue chip being arranged on support, connection blue chip and support are so that the bonding wire and the phosphor powder layer of red of circuit communication；Wherein, by the connection of bonding wire, the electric energy of power supply is transmitted on blue chip by support, excites PN junction to light, and blue chip is luminous with excitated red phosphor powder layer, so as to send feux rouges.The present invention is packaged using blue chip plus red fluorescence powder, so as to realize feux rouges, possess the function as traditional red light chips, cost ratio is low using red light chips, and due to voltage and blue green light lamp bead voltage always, in circuit design, also obvious more traditional feux rouges is designed well.
Description
Technical field
The present invention relates to LED technical field, more particularly to a kind of red-light LED lamp bead and its manufacture method.
Background technology
LED is the abbreviation of English light emitting diode (light emitting diode), and its basic structure is one block of electricity
The semi-conducting material of photoluminescence, is placed on a leaded shelf, then surrounding is sealed with epoxy resin, plays protection internal
The effect of cored wire.
Since 21st century, light source technology is quickly grown, constantly have new technology, new product release, LED light into
For the market mainstream.Compared with traditional CCFL backlight, LED light have high colour gamut, high brightness, the long-life, energy-conserving and environment-protective, in real time
Many advantages, such as color is controllable, the LED backlight of particularly high colour gamut makes using electronics such as its TV, mobile phone, tablet personal computers
Product screen has more chromatic colour, color rendition Du Genggao.
LED luminescence chips, are the core component of LED, that is, the P-N junction referred to.Its major function is that electric energy is converted
For luminous energy, at present due to red light chips for manufacturing process and production yields are compared with blue chip it is complicated and much smaller, cause
Red light chips hold at high price.
Therefore, the problem of existing for currently available technology, it is necessary to develop research, to provide a kind of scheme, is being protected
In the case of demonstrate,proving properties of product, the cost of red-light LED product is reduced.
The content of the invention
In view of this, present invention aims at a kind of red-light LED lamp bead and its manufacture method is provided, properties of product are being ensured
In the case of, reduce the cost of red-light LED product；The technical scheme is as follows：
On the one hand there is provided a kind of red-light LED lamp bead, including support, the blue chip being arranged on support, connection blue light
Chip causes the bonding wire of circuit communication and the phosphor powder layer of red with support；Wherein, by the connection of bonding wire, the electricity of power supply
It can be transmitted to by support on blue chip, excite PN junction to light, blue chip is luminous with excitated red phosphor powder layer, so that
Send feux rouges.
Further, the support is used for fixed chip and carrying fluorescent material, and electric current is imported into chip top, core
The heat derives that piece is produced are come.
Further, the bonding wire is used for the weld pad and support for connecting chip so that circuit can be turned on.
Further, the bonding wire is gold thread, a diameter of 0.8mil or 1.0mil.
Another technical scheme of the present invention is, there is provided a kind of manufacture method of red-light LED lamp bead, to comprise the following steps：
Step 1: support is dehumidified inside high temperature roaster, condition is 170 DEG C/2H；
Step 2: die bond and bonding wire：Blue chip is sticked on support with high heat conduction primer, then toasted, is dried
Roasting condition is 170 DEG C/1.5H；
Step 3: point powder：Deployed red fluorescent glue is coated in the cup of support, then toasted, bar is toasted
Part is：100 DEG C/1H to 150 DEG C/3H；
Step 4: cleaning and encapsulation：Material baked in step 3 is subjected to plasma cleaning, cleaned rear progress
Moding is encapsulated, and is then toasted again, and baking condition is 150 DEG C/3H.
Step 5: blanking and packaging：Material baked in step 4 is subjected to blanking, light splitting volume is carried out after blanking is good
Band, then carries out labelling packaging.
Further, in step 3, first from moistureproof anti-vulcanization, resistant to elevated temperatures phenyl glue, then it is by wave band
630nm red fluorescence powder is added in glue, is stirred by mixer, mixing time be 30 minutes, that is, allow glue and
Fluorescent material is sufficiently merged；Wherein, the ratio of phenyl glue and red fluorescence powder is：1 part of phenyl glue, red fluorescence
0.5-1 parts of powder.
The beneficial effect of technical scheme provided in an embodiment of the present invention is：
The present invention is packaged using blue chip plus red fluorescence powder, so as to realize feux rouges, is possessed and traditional feux rouges
The same function of chip, cost ratio is low using red light chips, and, is set in circuit due to voltage and blue green light lamp bead voltage always
Also obvious more traditional red light chips are designed well for timing.
For the above and other objects, features and advantages of the present invention can be become apparent, preferred embodiment cited below particularly,
And coordinate institute's accompanying drawings, it is described in detail below.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, makes required in being described below to embodiment
Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing.
Fig. 1 is the structural diagrams of red-light LED lamp bead of the present invention.
Fig. 2 illustrates for another angled arrangement of red-light LED lamp bead of the present invention.
Fig. 3 illustrates for the flow of red-light LED lamp bead manufacture method of the present invention.
Embodiment
To enable the object of the invention, feature, advantage more obvious and understandable, below in conjunction with the embodiment of the present invention
In accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that implementation disclosed below
Example is only a part of embodiment of the invention, and not all embodiments.Based on the embodiment in the present invention, those skilled in the art
The every other embodiment that member is obtained, belongs to the scope of protection of the invention.
Term " first ", " second " in description and claims of this specification and above-mentioned accompanying drawing etc. are to be used to distinguish
Similar object, without for describing specific order or precedence.It should be appreciated that the term so used is in appropriate feelings
It can be exchanged under condition, this is only the differentiation for describing to use the object of same alike result in description in embodiments of the invention
Mode.In addition, term " comprising " and " having " and their any deformation, it is intended that covering is non-exclusive to be included, so as to
Process, method, system, product or equipment comprising a series of units are not necessarily limited to those units, but may include unclear
Other units that ground is listed or for these processes, method, product or equipment inherently.
The embodiment of the present invention provides a kind of red-light LED lamp bead and its manufacture method and adds red fluorescence powder using blue chip
It is packaged, so as to realize feux rouges, possesses the function as traditional red light chips, cost ratio is low using red light chips, and
Due to voltage and blue green light lamp bead voltage always, in circuit design, also obvious more traditional feux rouges is designed well.
Refering to shown in Fig. 1, Fig. 2, red-light LED lamp bead of the embodiment of the present invention includes support 1, the indigo plant being arranged on support 1
Optical chip 10, connection blue chip 10 cause the bonding wire 12 of circuit communication and the phosphor powder layer 11 of red with support 1.
Wherein, support 1 is used for fixed chip 10 and carrying fluorescent material 11, and electric current is imported into chip top, chip
The heat derives of generation are come.In the present embodiment, the support is formed by support material by electroplating, and support is element from inside to outside
Material, copper, nickel, copper, this five layers of silver are constituted.The support can be band cup support or flat-headed support.
Blue chip 10 is mainly used for lighting, and is made up of luminous semi-conducting material.For example can be to use gallium phosphide
(GaP), the material such as gallium aluminum arsenide (GaAlAs) or GaAs (GaAs), gallium nitride (GaN) is constituted, and its internal structure, which has, unidirectionally to be led
Electrically.Chip includes in weld pad, the embodiment of the present invention, the weld pad be gold pad or aluminium pad, pad shapes for it is circular, square,
Cross or other shapes.
Bonding wire 12 is used for the weld pad and support for connecting chip so that circuit can be turned on；In the embodiment of the present invention, the weldering
Line is gold thread, a diameter of 0.8mil or 1.0mil.Heat is transmitted to up in time by gold thread by support, can be radiated in time.
And the tensility of gold thread can be stronger, it is not easy to because the fracture of gold thread causes the phenomenon of dead lamp.
Blue chip lights to excite red light fluorescent powder layer 11, and bonding wire is by the way that the electric energy of power supply can be conducted by support
Onto chip, PN junction is excited to light, so as to allow blue chip to glow.Specifically, after blue chip is powered, the PN in chip
Knot just changes into electric energy 450-460NM luminous energy, the phosphor powder layer for making the light-transmissive of this wave band red, so as to realize institute
The feux rouges needed.
As shown in fig.3, Fig. 3 illustrates for the manufacture method flow of red-light LED lamp bead of the embodiment of the present invention.The present invention includes
Following steps：
Step 1: support is dehumidified inside high temperature roaster, condition is 170 DEG C/2H., can under the baking condition
The harmful chemical remained with effectively removing in support.
The support is used for fixed chip and carrying fluorescent material, and electric current is imported into chip top, and chip is produced
Heat derives are come.In the present embodiment, the support by support material through plating and formed, support be from inside to outside material, copper,
Nickel, copper, this five layers of silver are constituted.The support can be band cup support or flat-headed support.
Step 2: die bond and bonding wire
Blue chip is sticked on support with high heat conduction primer, then toasted, baking condition is 170 DEG C/1.5H,
Under this baking condition, it can allow between primer and chip and support and preferably be combined together, baked material is used
Gold thread is welded.
Step 3: point powder
Deployed red fluorescent glue is coated in the cup of support, then toasted, baking condition is：100℃/1H
To 150 DEG C/3H；Under this baking condition, glue can be allowed to possess more excellent performance, such as sulfuration resistant, the performance such as moisture resistance.
Specifically, it is then the red glimmering of 630nm by wave band first from moistureproof anti-vulcanization, resistant to elevated temperatures phenyl glue
Light powder is added in glue, is stirred by mixer, and mixing time is 30 minutes, that is, allows glue and fluorescent material sufficiently to melt
It is combined；Wherein, the ratio of phenyl glue and red fluorescence powder is：1 part of phenyl glue, 0.5-1 parts of red fluorescence powder.Then
Mixed glue is injected into a powder machine, the glue amount of better powder machine is adjusted, dispensing is carried out.Glue amount according to the cup type of support and
Depending on the proportioning of fluorescent glue, general glue amount will put down a glass nick, it is ensured that the progress of follow-up MOding techniques.
Step 4: cleaning and encapsulation
Material baked in step 3 is subjected to plasma cleaning, then cleaned rear progress Moding encapsulation dries again
Roasting, baking condition is 150 DEG C/3H.
Step 5: blanking and packaging
Material baked in step 4 is subjected to blanking, light splitting braid is carried out after blanking is good, labelling bag is then carried out
Dress.
The embodiment of the present invention provides a kind of red-light LED lamp bead and its manufacture method and adds red fluorescence powder using blue chip
It is packaged, so as to realize feux rouges, possesses the function as traditional red light chips, cost ratio is low using red light chips, and
Due to voltage and blue green light lamp bead voltage always, in circuit design, also obvious more traditional feux rouges is designed well.
It is somebody's turn to do above, is only presently preferred embodiments of the present invention, any formal limitation not is made to the present invention, although
The present invention is disclosed as above with preferred embodiment, but is not limited to the present invention, and any those skilled in the art are not taking off
In the range of technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to equivalent variations
Equivalent embodiment, as long as being that without departing from technical solution of the present invention content, the technical spirit according to the present invention is to above example
Any brief introduction modification, equivalent variations and the modification made, in the range of still falling within technical solution of the present invention.
Claims (6)
1. a kind of red-light LED lamp bead, it is characterised in that：Including support, the blue chip being arranged on support, connection blue chip
With support so that the bonding wire and the phosphor powder layer of red of circuit communication；Wherein, by the connection of bonding wire, the electric energy of power supply leads to
Cross support to be transmitted on blue chip, excite PN junction to light, blue chip is luminous with excitated red phosphor powder layer, so as to send
Feux rouges.
2. red-light LED lamp bead as claimed in claim 1, it is characterised in that：The support is used for fixed chip and carrying fluorescent material,
And electric current is imported into chip top, the heat derives that chip is produced are come.
3. red-light LED lamp bead as claimed in claim 2, it is characterised in that：The bonding wire is used for the weld pad and support for connecting chip,
Circuit is turned on.
4. red-light LED lamp bead as claimed in claim 3, it is characterised in that：The bonding wire be gold thread, a diameter of 0.8mil or
1.0mil。
5. a kind of manufacture method of red-light LED lamp bead, it is characterised in that comprise the following steps：
Step 1: support is dehumidified inside high temperature roaster, condition is 170 DEG C/2H；
Step 2: die bond and bonding wire：Blue chip is sticked on support with high heat conduction primer, then toasted, bar is toasted
Part is 170 DEG C/1.5H；
Step 3: point powder：Deployed red fluorescent glue is coated in the cup of support, then toasted, baking condition is：
100 DEG C/1H to 150 DEG C/3H；
Step 4: cleaning and encapsulation：Material baked in step 3 is subjected to plasma cleaning, cleaned rear progress Moding
Encapsulation, is then toasted again, and baking condition is 150 DEG C/3H.
Step 5: blanking and packaging：Material baked in step 4 is subjected to blanking, light splitting braid is carried out after blanking is good, so
Labelling packaging is carried out afterwards.
6. the manufacture method of red-light LED lamp bead as claimed in claim 5, it is characterised in that：
In step 3, first from moistureproof anti-vulcanization, resistant to elevated temperatures phenyl glue, then by red fluorescence of the wave band for 630nm
Powder is added in glue, is then stirred by mixer, and mixing time is 30 minutes, that is, allows glue and fluorescent material sufficient
It is merged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710484441.7A CN107086264A (en) | 2017-06-23 | 2017-06-23 | A kind of red-light LED lamp bead and its manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710484441.7A CN107086264A (en) | 2017-06-23 | 2017-06-23 | A kind of red-light LED lamp bead and its manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107086264A true CN107086264A (en) | 2017-08-22 |
Family
ID=59606361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710484441.7A Pending CN107086264A (en) | 2017-06-23 | 2017-06-23 | A kind of red-light LED lamp bead and its manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107086264A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109713111A (en) * | 2019-01-16 | 2019-05-03 | 浙江鸿大光电科技有限公司 | A kind of direct insertion LED lamp bead and its packaging technology |
| CN112038468A (en) * | 2020-09-17 | 2020-12-04 | 有研稀土新材料股份有限公司 | Red LED optical device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101233210A (en) * | 2005-08-10 | 2008-07-30 | 首尔半导体株式会社 | Red phosphor, method for manufacturing the same and light emitting diode for using the same |
| CN102163661A (en) * | 2011-02-26 | 2011-08-24 | 潍坊广生新能源有限公司 | Packaging method of white LED (light-emitting diode) |
| CN202259432U (en) * | 2011-09-05 | 2012-05-30 | 高攀宁 | Red LED lamp bead and indoor lamp adopting same |
| CN202268389U (en) * | 2011-10-13 | 2012-06-06 | 同济大学 | Near-infrared diode using blue light chip to stimulate down-conversion phosphor |
| CN102576796A (en) * | 2009-09-25 | 2012-07-11 | 海洋王照明科技股份有限公司 | Semiconductor light emitting package and method of manufacturing the same |
| CN103220902A (en) * | 2010-11-25 | 2013-07-24 | 夏普株式会社 | Light emitting device, LED light source for plant cultivation, and plant factory |
| CN104515069A (en) * | 2013-09-26 | 2015-04-15 | 信越化学工业株式会社 | Red lamp and vehicle lighting fixture |
| CN105392230A (en) * | 2015-12-01 | 2016-03-09 | 浙江华坚照明科技股份有限公司 | LED lamp with adjustable light emitting spectrum |
| CN106195664A (en) * | 2016-08-17 | 2016-12-07 | 江门市中亚光电有限公司 | A kind of LED light source for supplementary lighting for plant growing |
| CN206820019U (en) * | 2017-06-23 | 2017-12-29 | 深圳市德辰光电科技有限公司 | A kind of red-light LED lamp bead |
-
2017
- 2017-06-23 CN CN201710484441.7A patent/CN107086264A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101233210A (en) * | 2005-08-10 | 2008-07-30 | 首尔半导体株式会社 | Red phosphor, method for manufacturing the same and light emitting diode for using the same |
| CN102576796A (en) * | 2009-09-25 | 2012-07-11 | 海洋王照明科技股份有限公司 | Semiconductor light emitting package and method of manufacturing the same |
| CN103220902A (en) * | 2010-11-25 | 2013-07-24 | 夏普株式会社 | Light emitting device, LED light source for plant cultivation, and plant factory |
| CN102163661A (en) * | 2011-02-26 | 2011-08-24 | 潍坊广生新能源有限公司 | Packaging method of white LED (light-emitting diode) |
| CN202259432U (en) * | 2011-09-05 | 2012-05-30 | 高攀宁 | Red LED lamp bead and indoor lamp adopting same |
| CN202268389U (en) * | 2011-10-13 | 2012-06-06 | 同济大学 | Near-infrared diode using blue light chip to stimulate down-conversion phosphor |
| CN104515069A (en) * | 2013-09-26 | 2015-04-15 | 信越化学工业株式会社 | Red lamp and vehicle lighting fixture |
| CN105392230A (en) * | 2015-12-01 | 2016-03-09 | 浙江华坚照明科技股份有限公司 | LED lamp with adjustable light emitting spectrum |
| CN106195664A (en) * | 2016-08-17 | 2016-12-07 | 江门市中亚光电有限公司 | A kind of LED light source for supplementary lighting for plant growing |
| CN206820019U (en) * | 2017-06-23 | 2017-12-29 | 深圳市德辰光电科技有限公司 | A kind of red-light LED lamp bead |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109713111A (en) * | 2019-01-16 | 2019-05-03 | 浙江鸿大光电科技有限公司 | A kind of direct insertion LED lamp bead and its packaging technology |
| CN112038468A (en) * | 2020-09-17 | 2020-12-04 | 有研稀土新材料股份有限公司 | Red LED optical device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101661987A (en) | White light LED packaging structure and packaging method thereof | |
| CN100508228C (en) | Method for producing white light LED lamp and LED lamp using the same | |
| US20120168777A1 (en) | Led package structure and fabrication method thereof | |
| CN101123834B (en) | A LED manufacturing method | |
| CN206820019U (en) | A kind of red-light LED lamp bead | |
| CN107086264A (en) | A kind of red-light LED lamp bead and its manufacture method | |
| CN109713112A (en) | White-light LED chip, lamp bead and White-light LED chip, lamp bead preparation method | |
| CN109256458A (en) | A kind of LED product encapsulating structure and its packaging method | |
| CN102945910B (en) | Manufacture method of mixed type saffron light-emitting diode (LED) | |
| CN211265506U (en) | Flip-chip formula LED lamp pearl of cutting straightly | |
| CN101022102A (en) | LED lamp capable of emitting white light | |
| CN2901581Y (en) | Double crystal mixed color LED | |
| CN102734647A (en) | White light illumination system | |
| CN206480621U (en) | A kind of LED chip inverted structure | |
| CN206490057U (en) | One kind is with drive, panchromatic temperature, with brightness upside-down mounting COB light source | |
| CN100477307C (en) | Light-emitting diode | |
| CN206820018U (en) | A kind of green light LED lamp bead | |
| CN104851953A (en) | Dimmable LED packaging structure | |
| CN101261981B (en) | Warm color light source | |
| CN206849863U (en) | A kind of LED lamp bead | |
| CN106025047A (en) | LED Package and packaging method thereof | |
| CN205828428U (en) | A kind of LED encapsulation | |
| CN206471351U (en) | Adjustable color temperature light emitting diode with IC functions | |
| CN206040693U (en) | Blue light emitting diode wafer white light packaging hardware | |
| CN105591017B (en) | Two-section L ED packaging support with bendable head |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170822 |
|
| RJ01 | Rejection of invention patent application after publication |