CN103098202A - 具有可变厚度模制罩的电子封装 - Google Patents
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Abstract
一种具有改善的翘曲补偿的电子封装。所述电子封装包含厚度可变的模制罩。可变的厚度可具有隆凸或凹陷设计。在另一实施例中,提供一种方法,用于通过设计模制罩的构形以补偿翘曲来减少电子封装的单元翘曲。
Description
技术领域
本发明大体上涉及电子封装,且更明确地说,涉及具有可变厚度模制罩的电子封装。
背景技术
在现今的电子封装中,许多封装被制作为材料的复合物。换句话说,封装包含各种材料的组合,这些材料层叠在一起以形成最终产品。在制造、组装以及操作期间,每种材料的温度变化可能会在其中产生内部应力,这是由于每种材料的机械性质不同而造成的。举例来说,形成电子封装的每种材料可能具有不同的热膨胀系数,且材料之间的热失配可能会造成破裂、翘曲等。
在制作电子封装时,翘曲会给设计带来很大问题。设计挑战包含表面安装技术的良率问题、焊球间距缩减的能力、焊球应力,以及板级可靠性。继续在努力减少和/或消除电子封装中的翘曲。然而,这些努力大部分是集中于在条带级(即,在对封装进行切割或切块使之成为单片化单式封装之前)减少翘曲。尽管做了这些努力,但在常规电子封装中仍存在翘曲的问题。
因此,将希望开发出可经设计以补偿翘曲的电子封装,以及制造所述封装的方法。明确地说,将希望减少翘曲对单片化单式电子封装造成的影响。
发明内容
为了更完整地理解本发明,现在参考以下详细描述以及附图。在示范性实施例中,单片化单式电子封装具有厚度可变的模制罩。所述模制罩可包含异型表面。在本实施例的一个形式中,所述模制罩可具有隆凸设计。在其另一形式中,所述模制罩可具有凹陷设计。或者,所述模制罩可具有隆凸设计以及凹陷设计。另外,模制罩的表面轮廓补偿了翘曲。
在另一实施例中,提供一种减少电子封装的单元翘曲的方法,所述电子封装具有衬底。所述方法包含将具有多个高度的包覆模放置到电子封装上,以及将模制化合物施加到电子封装的衬底与包覆模之间。所述方法进一步包含允许模制化合物形成具有多个厚度的模制罩。所述方法还可包含改变模制罩的厚度。模制罩的厚度可在其中央或边缘附近发生变化。所述方法可进一步包含基于封装内的下伏组件来改变模制材料的厚度。封装的劲度也可改变。
在不同的实施例中,提供一种用于制作单片化单式电子封装的方法,所述电子封装的单元翘曲减少。所述方法包含提供电子封装以及用模制材料将所述封装围封。形成模制材料的表面轮廓以补偿单元翘曲。将电子封装分离成多个单片化单式封装。在本实施例的一个形式中,所述方法包含改变模制材料的厚度。在其另一形式中,所述方法包含改变封装的劲度。所形成的表面轮廓可以是隆凸或凹陷。或者,所述方法可包含基于封装内的下伏组件来改变模制材料的厚度。
上述实施例有利于减少翘曲对单片化单式电子封装造成的影响。大多数的常规电子封装在设法减少条带级处的翘曲,但无法减少个别封装的翘曲。本发明能够通过设计出模制罩以将单片化单式电子封装囊封起来而补偿翘曲。模制罩的设计是基于封装中的下伏组件来补偿单元翘曲。所述设计能适应各种封装,因此与常规封装相比能更好地用来减少翘曲的影响。
附图说明
图1是常规电子封装的横截面图;
图2是具有可变厚度模制罩的单片化单式电子封装的横截面图;
图3是受凸起式翘曲影响的电子封装的示意图;
图4是受凹入式翘曲影响的电子封装的示意图;
图5是隆凸形模制罩的立体图;
图6是凹陷形模制罩的立体图;
图7是隆凸形与凹陷形的组合式模制罩的立体图;以及
图8是展示了示范性无线通信系统的框图,在所述无线通信系统中使用具有可变厚度模制罩的电子封装可为有利的。
具体实施方式
参看图1,展示了常规电子封装100。常规封装100包含衬底102、第一裸片104,以及第二裸片106。第一裸片104是通过多个焊球或凸块108而附接到衬底102。第二裸片106则是通过打线结合110而附接到衬底102。另外,常规封装100包含将第一裸片104和第二裸片106围封的模制化合物112。模制化合物112形成囊封物,或模制罩114。如所示,常规模制罩114形成有统一的厚度(即,从衬底102起到模制罩114的顶部所测量到的厚度)。由于包含模制罩114的封装100是由不同材料形成的,因此翘曲以及其它内部应力可能会消极地影响常规封装100,以及其安装到(例如)印刷电路板(PCB)或其它封装上的能力。
在图2中,展示了电子封装200的示范性实施例,用于克服现有技术的缺点。与图1的常规封装100类似,图2中的封装200也包含衬底202、第一裸片204,以及第二裸片206。第一裸片204可(例如)通过多个微凸块208而耦合到衬底202。同样地,第二裸片206可通过打线结合210而耦合到衬底202。第一裸片204和第二裸片206在封装200中的存在是示范性的,且其它电子封装可包含额外的或不同的组件。
封装200也可包含模制化合物212(即,模制罩),所述模制化合物大体上围封第一裸片204和第二裸片206。在封装200的制作和组装期间,通过将“包覆模”放置到封装200上且将模制化合物212施配到封装衬底202与“包覆模”之间以大体上围封封装200来形成模制罩212。模制化合物212可减少或防止湿气以及其它污染物影响封装200的功能性以及可靠性。
与常规封装不同,图2中的封装200的模制罩可被设计成具有可变的厚度。参看图2,例如,模制罩可经形成以包含不同部分。在第一部分214中,模制罩的厚度可较小,而在第二部分216中,模制罩的厚度可较大。在第三部分218中,模制罩的厚度可大于第一部分214的厚度,但小于第二部分216的厚度。在其它实施例中,模制罩可具有多个厚度不同的部分。
模制罩的每一部分的厚度可经设计以对被预测会在封装的所述特定位置发生的翘曲进行补偿。参看图2,第一裸片204和第二裸片206可使封装200翘曲。为了补偿由第一裸片204造成的翘曲,形成模制罩的第一部分214,从而界定空穴、凹陷或低陷。空穴的深度(例如)可经设计以补偿预定量的翘曲。预先确定封装可能经历的翘曲量的能力可通过在制作封装之前对原型建模并进行测试来实现。
在图2中,模制罩还经设计以补偿由第二裸片206造成的翘曲。在本实施例中,模制罩的第二部分216的厚度增加(例如,隆凸形)。第二部分216的高度或厚度增加的量经设计以补偿预定量的翘曲。对原型电子封装建模并进行测试以确定封装如何翘曲以及翘曲的量。
转向图3,提供附接有多个焊球302的裸片300。如所示,裸片300可按凸起方式翘曲(即,“正向”翘曲),使得裸片300中部附近的焊球302与封装衬底(未图示)分开。
相反地,在图4中,提供附接有多个焊球402的类似裸片400。在本实施例中,裸片400可按凹入方式翘曲(即,“逆向”翘曲)。因而,裸片400的每一端附近的焊球402可与封装衬底(未图示)分开。
参看图5,展示了用于补偿“正向”翘曲或“逆向翘曲”的示范性实施例。在本实施例中,电子封装500包含模制罩502,所述模制罩大体上覆盖或围封下伏组件506(例如,裸片、衬底、另一封装等)。模制罩502可由基于环氧树脂的材料或其它已知的模制化合物材料形成。
在图5中,模制罩502包含隆凸形设计504(即,封装中央附近的厚度增加)。模制罩502的厚度增加可使封装的劲度增加,由此克服或抵挡封装的这个位置中发生的内部应力。裸片(例如)可位于封装500中央附近且被模制罩502覆盖或围封。通过建模以及其它测试,可确定裸片将会使封装500在其中央附近发生翘曲。因此,模制罩502可经设计以在封装500中央具有增加的厚度504,从而增加封装500的劲度并补偿可能发生的翘曲。另外,这种设计既可补偿“正向”翘曲,也可补偿“逆向”翘曲。
参看图6,提供电子封装600的另一实施例。电子封装600可包含模制罩602,所述模制罩大体上覆盖或围封下伏组件606(例如,裸片、衬底等)。模制罩602可由基于环氧树脂的材料或其它已知的模制化合物材料形成。
在图6的实施例中,模制罩602包含凹陷形或低陷设计604(即,封装中央附近的厚度减小)。模制罩602中央附近的厚度减小可有利于封装600的劲度沿着其外边缘而增加。这种设计既可补偿“正向”翘曲,也可补偿“逆向”翘曲。
如上所述,模制罩设计是依据封装中下伏组件的位置来进行。封装可包含多个裸片和/或其它组件。每一裸片或组件可使封装发生翘曲,且通过对原型封装建模并进行测试,可制造出一种电子封装并对其进行组装,这种电子封装具有异型的或厚度可变的模制罩以补偿翘曲。示范性封装700(例如)展示于图7中。
电子封装700可包含多个下伏组件708,例如裸片。封装700被设计有异型或厚度可变的模制罩702,以补偿由下伏组件708造成的翘曲。在本实施例中,模制罩702包含一对隆凸形部分704以及一个凹陷形部分706。在其它实施例中,封装700可包含一个或一个以上的隆凸形部分704和/或凹陷形部分706。模制罩702的厚度增加或减小的位置取决于封装700中的下伏组件708的位置。通过给封装700设计有可变厚度模制罩702,可大体上减少或消除封装700的净翘曲。因而,封装700保持大体上平坦(即,不翘曲),且可耦合到(例如)印刷电路板底座或另一衬底而不会因为翘曲而与其分开。
图7的封装的另一优点是不需要额外的材料或组装步骤便可制作和组装所述封装。在常规封装中使用模制化合物来保护封装以及其组件使之免遭湿气以及其它环境污染物的影响。通过使模制化合物的厚度沿着其外表面改变,模制罩还可用来保护封装使之免于翘曲。
另外,制作和组装封装所需的相同的制造和组装步骤中有许多保持相同。模制化合物是在条带级施加到封装的,例如,在对封装的条带进行切割或切块使之成为单片化单式封装之前。因此,对于制造和组装常规封装来说,处理步骤是类似或相同的。
上述实施例的另一优点是在单元级减少或防止翘曲的能力。如上所述,大多数的常规封装经设计及制作以克服条带级处的翘曲。由于电子封装在载带或条带上制作时可能会翘曲,因此大多数先前的解决方案一直都集中于控制条带级处的翘曲。虽然这很重要,但电子封装在被切割或切块成为单片化单式封装之后也可能会翘曲。上述实施例可补偿单元级处的翘曲,且因此克服与常规封装相关联的许多缺点。
图8展示了示范性无线通信系统800,在所述无线通信系统中可有利地采用具有可变厚度模制罩的电子封装的实施例。为进行说明,图8展示了三个远程单元820、830和850,以及两个基站840。应认识到,典型的无线通信系统可具有更多的远程单元以及基站。任一个远程单元820、830和850以及基站840都可包含例如本文所揭示的具有可变厚度模制罩的电子封装。图8展示了从基站840到远程单元820、830和850的前向链路信号880,以及从远程单元820、830和850到基站840的反向链路信号890。
在图8中,远程单元820被展示为移动电话,远程单元830被展示为便携式计算机,且远程单元850被展示为在无线本地环路系统中的固定位置远程单元。举例来说,远程单元可为手机、手持式个人通信系统(PCS)单元、例如个人数据助理等便携式数据单元,或例如仪表读取设备等固定位置数据单元。虽然图8说明了某些示范性远程单元,这些示范性远程单元可包含如本文所揭示的具有可变厚度模制罩的电子封装,但所述封装不限于所说明的这些示范性单元。实施例可适当地用在任何电子装置中,在这些电子装置中具有可变厚度模制罩的电子封装是所希望的。
虽然上文已揭示了并入了本发明的原理的示范性实施例,但本发明不限于所揭示的实施例。而是,本申请案既定涵盖使用本发明的一般原理的本发明的任何变体、使用或修改。另外,本申请案既定涵盖与本发明有所偏差的内容,只要它们是在本发明所属领域中的已知或惯常做法的范围内且属于所附权利要求书的限制范围内。
Claims (24)
1.一种单片化单式电子封装,其包括厚度可变的模制罩。
2.根据权利要求1所述的封装,其中所述模制罩包含异型表面。
3.根据权利要求1所述的封装,其中所述模制罩包含低陷部分。
4.根据权利要求1所述的封装,其中所述模制罩包含隆起部分。
5.根据权利要求1所述的封装,其中所述模制罩包含隆凸和凹陷设计。
6.根据权利要求1所述的封装,其中所述模制罩的表面轮廓对翘曲进行补偿。
7.根据权利要求1所述的封装,其并入到选自由以下各项组成的群组的装置中:音乐播放器、视频播放器、娱乐单元、导航装置、通信装置、个人数据助理PDA、固定位置数据单元,以及计算机。
8.一种减少具有衬底的电子封装的单元翘曲的方法,所述方法包括:
将具有多个高度的包覆模放置到所述电子封装上;
将模制化合物施加到所述电子封装的所述衬底与所述包覆模之间;以及
允许所述模制化合物形成具有多个厚度的模制罩。
9.根据权利要求8所述的方法,其进一步包括改变所述模制罩的厚度。
10.根据权利要求9所述的方法,其进一步包括使所述模制罩中央附近的厚度厚于所述模制罩边缘附近的厚度。
11.根据权利要求9所述的方法,其进一步包括使所述模制罩边缘附近的厚度厚于所述模制罩中央附近的厚度。
12.根据权利要求9所述的方法,其进一步包含基于所述封装内的下伏组件来改变所述模制材料的厚度。
13.根据权利要求8所述的方法,其进一步包括改变所述封装的劲度。
14.根据权利要求8所述的方法,其并入到选自由以下各项组成的群组的装置中:音乐播放器、视频播放器、娱乐单元、导航装置、通信装置、个人数据助理PDA、固定位置数据单元,以及计算机。
15.一种制作单元翘曲减少的单片化单式电子封装的方法,所述方法包括:
提供电子封装;
用模制材料将所述电子封装围封;
形成所述模制材料的表面轮廓以补偿单元翘曲;以及
将所述电子封装分离成多个单片化单式封装。
16.根据权利要求15所述的方法,其进一步包括在所述多个单片化单式封装中的一者的中央或边缘附近增加所述模制材料的厚度。
17.根据权利要求15所述的方法,其中所述所形成的表面轮廓包含隆凸或凹陷形状。
18.根据权利要求15所述的方法,其进一步包括改变所述封装的劲度。
19.根据权利要求15所述的方法,其进一步包含基于所述封装内的下伏组件来改变所述模制材料的厚度。
20.根据权利要求15所述的方法,其并入到选自由以下各项组成的群组的装置中:音乐播放器、视频播放器、娱乐单元、导航装置、通信装置、个人数据助理PDA、固定位置数据单元,以及计算机。
21.一种形成单片化单式电子封装的方法,其包括:
提供电子封装;
用模制材料将所述电子封装围封;
用于补偿单元翘曲的步骤;以及
将所述电子封装分离成多个单片化单式封装。
22.根据权利要求21所述的方法,其进一步包括改变所述封装的劲度。
23.根据权利要求21所述的方法,其进一步包含基于所述封装内的下伏组件来改变所述模制材料的厚度。
24.根据权利要求21所述的方法,其并入到选自由以下各项组成的群组的装置中:音乐播放器、视频播放器、娱乐单元、导航装置、通信装置、个人数据助理PDA、固定位置数据单元,以及计算机。
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CN112848608A (zh) * | 2021-01-18 | 2021-05-28 | 南京赛旺科技发展有限公司 | 一种新型防板材翘曲工艺 |
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KR101594886B1 (ko) | 2016-02-17 |
US20120061857A1 (en) | 2012-03-15 |
US8753926B2 (en) | 2014-06-17 |
EP2617056A1 (en) | 2013-07-24 |
EP2617056B1 (en) | 2019-11-06 |
CN103098202B (zh) | 2017-02-15 |
JP2013537372A (ja) | 2013-09-30 |
KR20130054411A (ko) | 2013-05-24 |
WO2012037263A1 (en) | 2012-03-22 |
JP2015144314A (ja) | 2015-08-06 |
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