CN102939339B - 包含流平试剂的金属电镀用组合物 - Google Patents

包含流平试剂的金属电镀用组合物 Download PDF

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Publication number
CN102939339B
CN102939339B CN201180027324.9A CN201180027324A CN102939339B CN 102939339 B CN102939339 B CN 102939339B CN 201180027324 A CN201180027324 A CN 201180027324A CN 102939339 B CN102939339 B CN 102939339B
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composition
compound
metal
copper
compounds
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Chinese (zh)
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CN102939339A (zh
Inventor
M·西默
C·勒格尔-格普费特
N·梅尔
R·B·雷特尔
M·阿诺德
C·埃姆内特
D·迈耶
A·弗鲁格尔
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BASF SE
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BASF SE
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0605—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0616—Polycondensates containing five-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CN201180027324.9A 2010-06-01 2011-05-31 包含流平试剂的金属电镀用组合物 Active CN102939339B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35004510P 2010-06-01 2010-06-01
US61/350,045 2010-06-01
PCT/IB2011/052385 WO2011151785A1 (en) 2010-06-01 2011-05-31 Composition for metal electroplating comprising leveling agent

Publications (2)

Publication Number Publication Date
CN102939339A CN102939339A (zh) 2013-02-20
CN102939339B true CN102939339B (zh) 2016-02-17

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CN201180027324.9A Active CN102939339B (zh) 2010-06-01 2011-05-31 包含流平试剂的金属电镀用组合物

Country Status (11)

Country Link
US (1) US9683302B2 (https=)
EP (1) EP2576696B1 (https=)
JP (1) JP5933532B2 (https=)
KR (3) KR101829866B1 (https=)
CN (1) CN102939339B (https=)
IL (1) IL223183B (https=)
MY (1) MY164464A (https=)
RU (1) RU2603675C2 (https=)
SG (2) SG185736A1 (https=)
TW (1) TWI539036B (https=)
WO (1) WO2011151785A1 (https=)

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WO2019201623A2 (en) * 2018-04-19 2019-10-24 Basf Se Composition for cobalt or cobalt alloy electroplating
KR102662397B1 (ko) * 2018-10-23 2024-05-02 솔브레인 주식회사 전기도금 조성물 및 전기도금 방법
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EP4034696A1 (en) 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
CN110938847B (zh) * 2019-10-30 2021-11-12 苏州清飙科技有限公司 电镀铜整平剂及其制备方法、以及电镀液
JP2023520530A (ja) 2020-04-03 2023-05-17 ビーエーエスエフ ソシエタス・ヨーロピア ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物
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KR102339868B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물
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Also Published As

Publication number Publication date
US20130068626A1 (en) 2013-03-21
TW201211321A (en) 2012-03-16
JP5933532B2 (ja) 2016-06-15
KR20180017244A (ko) 2018-02-20
IL223183A0 (en) 2013-02-03
IL223183B (en) 2018-03-29
KR20130112018A (ko) 2013-10-11
TWI539036B (zh) 2016-06-21
WO2011151785A1 (en) 2011-12-08
KR101891473B1 (ko) 2018-08-27
KR20180094140A (ko) 2018-08-22
KR101829866B1 (ko) 2018-02-20
EP2576696A1 (en) 2013-04-10
RU2603675C2 (ru) 2016-11-27
CN102939339A (zh) 2013-02-20
JP2013527325A (ja) 2013-06-27
EP2576696B1 (en) 2017-10-04
RU2012157535A (ru) 2014-07-20
KR101955869B1 (ko) 2019-03-07
EP2576696A4 (en) 2014-07-16
SG10201504251WA (en) 2015-07-30
MY164464A (en) 2017-12-15
SG185736A1 (en) 2012-12-28
US9683302B2 (en) 2017-06-20

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