CN102873322A - 枝晶状铜粉 - Google Patents

枝晶状铜粉 Download PDF

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Publication number
CN102873322A
CN102873322A CN201210090814XA CN201210090814A CN102873322A CN 102873322 A CN102873322 A CN 102873322A CN 201210090814X A CN201210090814X A CN 201210090814XA CN 201210090814 A CN201210090814 A CN 201210090814A CN 102873322 A CN102873322 A CN 102873322A
Authority
CN
China
Prior art keywords
copper powder
branch
main shaft
dendritic crystalline
particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210090814XA
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English (en)
Chinese (zh)
Inventor
藤本卓
三轮昌宏
胁森康成
林富雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=47474960&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN102873322(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of CN102873322A publication Critical patent/CN102873322A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

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  • Powder Metallurgy (AREA)
  • Electrolytic Production Of Metals (AREA)
CN201210090814XA 2011-07-13 2012-03-30 枝晶状铜粉 Pending CN102873322A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-154577 2011-07-13
JP2011154577A JP5320442B2 (ja) 2011-07-13 2011-07-13 デンドライト状銅粉

Publications (1)

Publication Number Publication Date
CN102873322A true CN102873322A (zh) 2013-01-16

Family

ID=47474960

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210090814XA Pending CN102873322A (zh) 2011-07-13 2012-03-30 枝晶状铜粉

Country Status (4)

Country Link
JP (1) JP5320442B2 (ja)
KR (1) KR20130009592A (ja)
CN (1) CN102873322A (ja)
TW (1) TWI599420B (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104918732A (zh) * 2013-01-24 2015-09-16 三井金属矿业株式会社 铜粉
CN106457386A (zh) * 2014-06-25 2017-02-22 住友金属矿山株式会社 铜粉及使用其的铜膏、导电性涂料、导电性片材
CN106457387A (zh) * 2014-07-07 2017-02-22 住友金属矿山株式会社 铜粉及使用该铜粉的导电性膏剂、导电性涂料、导电性片材、抗静电涂料
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
CN107614156A (zh) * 2015-05-15 2018-01-19 住友金属矿山株式会社 铜粉及使用其的铜膏、导电性涂料、导电性片以及铜粉的制造方法
CN106457382B (zh) * 2014-06-16 2019-06-25 三井金属矿业株式会社 铜粉、其制造方法以及包含该铜粉的导电性组合物
CN111834231A (zh) * 2019-04-19 2020-10-27 中国科学院深圳先进技术研究院 铜基导电浆料及其制备方法和应用

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013136818A (ja) * 2011-12-28 2013-07-11 Mitsui Mining & Smelting Co Ltd 銅粉
JP5503813B1 (ja) * 2012-08-02 2014-05-28 三井金属鉱業株式会社 導電性フィルム
CN104717841B (zh) * 2013-12-11 2017-12-29 东莞市龙谊电子科技有限公司 线路板制备方法及线路板
JP5876971B2 (ja) * 2014-01-29 2016-03-02 三井金属鉱業株式会社 銅粉
JP2016008333A (ja) * 2014-06-25 2016-01-18 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト
JP6295870B2 (ja) * 2014-07-23 2018-03-20 住友金属鉱山株式会社 銅粉末の製造方法
CN105472887B (zh) * 2014-07-31 2018-12-21 比亚迪股份有限公司 一种3d导电线路的制作方法
US20180079000A1 (en) * 2015-03-26 2018-03-22 Sumitomo Metal Mining Co., Ltd. Silver-coated copper powder and conductive paste, conductive material, and conductive sheet using same
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
USD805094S1 (en) 2015-12-24 2017-12-12 Samsung Electronics Co., Ltd. Display screen or portion thereof with graphical user interface
KR101911306B1 (ko) 2016-12-29 2018-10-24 서울과학기술대학교 산학협력단 벼이삭형 구리 입자의 제조방법
JP6765328B2 (ja) 2017-03-15 2020-10-07 株式会社堀場製作所 作成方法、グロー放電発光分析方法、器具、及びグロー放電発光分析装置
KR102149098B1 (ko) * 2018-12-17 2020-08-27 엘티메탈 주식회사 열전 소자 및 이에 포함되는 솔더 페이스트
WO2020130282A1 (ko) * 2018-12-17 2020-06-25 엘티메탈 주식회사 열전 소자 및 이에 포함되는 솔더 페이스트
WO2021112566A1 (ko) * 2019-12-06 2021-06-10 엘티메탈 주식회사 열전 소자 및 그 제조방법

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02138492A (ja) * 1988-11-18 1990-05-28 Fukuda Metal Foil & Powder Co Ltd 銅微粉末の製造方法
US4944797A (en) * 1989-01-03 1990-07-31 Gte Products Corporation Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing
US5409520A (en) * 1992-11-25 1995-04-25 Mitsui Kinzoku Kogyo Kabushiki Kaisha Copper powder for solderable and electroconductive paints and process for producing the same
JPH10147801A (ja) * 1996-11-20 1998-06-02 Tokuyama Corp 樹枝状銅粉の表面処理法
US5837119A (en) * 1995-03-31 1998-11-17 International Business Machines Corporation Methods of fabricating dendritic powder materials for high conductivity paste applications
JP2000080408A (ja) * 1998-08-31 2000-03-21 Mitsui Mining & Smelting Co Ltd 微小銅粉の製造方法
JP2005146387A (ja) * 2003-11-18 2005-06-09 Mitsui Mining & Smelting Co Ltd デンドライト状微粒銀粉及びその製造方法
JP2008122030A (ja) * 2006-11-15 2008-05-29 Mitsui Mining & Smelting Co Ltd ヒートパイプ構成原料
CN102009169A (zh) * 2009-09-07 2011-04-13 福田金属箔粉工业株式会社 电解铜粉以及该电解铜粉的制造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63286477A (ja) 1987-05-19 1988-11-24 Mitsui Mining & Smelting Co Ltd 導電性塗料

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02138492A (ja) * 1988-11-18 1990-05-28 Fukuda Metal Foil & Powder Co Ltd 銅微粉末の製造方法
US4944797A (en) * 1989-01-03 1990-07-31 Gte Products Corporation Low oxygen content fine spherical copper particles and process for producing same by fluid energy milling and high temperature processing
US5409520A (en) * 1992-11-25 1995-04-25 Mitsui Kinzoku Kogyo Kabushiki Kaisha Copper powder for solderable and electroconductive paints and process for producing the same
US5837119A (en) * 1995-03-31 1998-11-17 International Business Machines Corporation Methods of fabricating dendritic powder materials for high conductivity paste applications
JPH10147801A (ja) * 1996-11-20 1998-06-02 Tokuyama Corp 樹枝状銅粉の表面処理法
JP2000080408A (ja) * 1998-08-31 2000-03-21 Mitsui Mining & Smelting Co Ltd 微小銅粉の製造方法
JP2005146387A (ja) * 2003-11-18 2005-06-09 Mitsui Mining & Smelting Co Ltd デンドライト状微粒銀粉及びその製造方法
JP2008122030A (ja) * 2006-11-15 2008-05-29 Mitsui Mining & Smelting Co Ltd ヒートパイプ構成原料
CN102009169A (zh) * 2009-09-07 2011-04-13 福田金属箔粉工业株式会社 电解铜粉以及该电解铜粉的制造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104918732A (zh) * 2013-01-24 2015-09-16 三井金属矿业株式会社 铜粉
CN106457382B (zh) * 2014-06-16 2019-06-25 三井金属矿业株式会社 铜粉、其制造方法以及包含该铜粉的导电性组合物
CN106457386A (zh) * 2014-06-25 2017-02-22 住友金属矿山株式会社 铜粉及使用其的铜膏、导电性涂料、导电性片材
CN106457387A (zh) * 2014-07-07 2017-02-22 住友金属矿山株式会社 铜粉及使用该铜粉的导电性膏剂、导电性涂料、导电性片材、抗静电涂料
CN106604794A (zh) * 2014-09-12 2017-04-26 住友金属矿山株式会社 银包覆铜粉及使用银包覆铜粉的导电膏、导电涂料、导电片
CN107614156A (zh) * 2015-05-15 2018-01-19 住友金属矿山株式会社 铜粉及使用其的铜膏、导电性涂料、导电性片以及铜粉的制造方法
CN111834231A (zh) * 2019-04-19 2020-10-27 中国科学院深圳先进技术研究院 铜基导电浆料及其制备方法和应用

Also Published As

Publication number Publication date
KR20130009592A (ko) 2013-01-23
TWI599420B (zh) 2017-09-21
JP5320442B2 (ja) 2013-10-23
TW201302347A (zh) 2013-01-16
JP2013019034A (ja) 2013-01-31

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Application publication date: 20130116