CN102843876A - 制造多层电路板的方法和多层电路板 - Google Patents

制造多层电路板的方法和多层电路板 Download PDF

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Publication number
CN102843876A
CN102843876A CN201210143582XA CN201210143582A CN102843876A CN 102843876 A CN102843876 A CN 102843876A CN 201210143582X A CN201210143582X A CN 201210143582XA CN 201210143582 A CN201210143582 A CN 201210143582A CN 102843876 A CN102843876 A CN 102843876A
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CN
China
Prior art keywords
circuit board
prepreg
hole
pad
multilayer circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201210143582XA
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English (en)
Chinese (zh)
Inventor
吉村英明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of CN102843876A publication Critical patent/CN102843876A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201210143582XA 2011-06-24 2012-05-09 制造多层电路板的方法和多层电路板 Pending CN102843876A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011141232A JP2013008880A (ja) 2011-06-24 2011-06-24 積層回路基板の製造方法及び積層回路基板
JP2011-141232 2011-06-24

Publications (1)

Publication Number Publication Date
CN102843876A true CN102843876A (zh) 2012-12-26

Family

ID=47360763

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210143582XA Pending CN102843876A (zh) 2011-06-24 2012-05-09 制造多层电路板的方法和多层电路板

Country Status (5)

Country Link
US (1) US20120325533A1 (https=)
JP (1) JP2013008880A (https=)
KR (1) KR20130007415A (https=)
CN (1) CN102843876A (https=)
TW (1) TW201301967A (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105577214A (zh) * 2014-10-30 2016-05-11 瑞萨电子株式会社 电子装置及其制造方法
CN107155266A (zh) * 2017-06-20 2017-09-12 广州兴森快捷电路科技有限公司 Z向互连线路板及其制作方法
CN107403770A (zh) * 2016-08-29 2017-11-28 上海兆芯集成电路有限公司 电子结构以及电子结构阵列
WO2018233272A1 (zh) * 2017-06-20 2018-12-27 广州兴森快捷电路科技有限公司 孔连接层的制作方法、线路板的制作方法及线路板
CN110165442A (zh) * 2018-02-12 2019-08-23 泰达电子股份有限公司 金属块焊接柱组合及其应用的电源模块
CN111385981A (zh) * 2018-12-29 2020-07-07 深南电路股份有限公司 多样化装配印刷线路板及制造方法
CN112118676A (zh) * 2019-06-21 2020-12-22 唐虞企业股份有限公司 电路板及其制造方法
CN120805769A (zh) * 2025-07-02 2025-10-17 江西世邦电路有限公司 双层电路板电镀层精准电镀控制系统及方法
CN121152127A (zh) * 2025-11-18 2025-12-16 深圳市卡博尔科技有限公司 一种高密度互联电路板及其制备方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6088724B2 (ja) * 2010-08-31 2017-03-01 ユニ・チャーム株式会社 吸収体の製造装置、及び通気性部材の製造方法
US9288917B2 (en) * 2013-11-07 2016-03-15 Unimicron Technology Corp. Manufacturing method for multi-layer circuit board
CN104538314B (zh) * 2014-12-29 2017-08-11 华进半导体封装先导技术研发中心有限公司 三层封装基板及封装芯片的制作方法及三层封装基板
CN104768326B (zh) * 2015-03-31 2017-11-24 华为技术有限公司 印刷电路板及印刷电路板制造方法
TWI608779B (zh) * 2016-04-20 2017-12-11 中華精測科技股份有限公司 高密度互連多層電路板及其製造方法
KR101858186B1 (ko) * 2016-12-26 2018-05-15 주식회사 카펙발레오 차량용 토크 컨버터
CN107864555B (zh) * 2017-12-09 2024-02-09 中国电子科技集团公司第四十三研究所 一种柔性电路板
EP4040926A1 (en) 2021-02-09 2022-08-10 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carriers connected by staggered interconnect elements
US11950378B2 (en) * 2021-08-13 2024-04-02 Harbor Electronics, Inc. Via bond attachment
KR102951470B1 (ko) * 2021-09-30 2026-04-13 삼성전자주식회사 열경화성 본딩 시트를 포함하는 전자 장치
JP2025501060A (ja) * 2022-12-12 2025-01-17 ハーバー・エレクトロニクス・インク ビアの固着取付け
KR102729754B1 (ko) * 2022-12-28 2024-11-13 주식회사 이에스이 솔더 페이스트 균일밀도공급이 가능한 밀폐형 스퀴지
JP7846165B2 (ja) * 2024-05-30 2026-04-14 Ｆｉｃｔ株式会社 積層基板及び積層基板の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000101248A (ja) * 1998-09-24 2000-04-07 Ibiden Co Ltd 多数個取り多層プリント配線板
JP2004288989A (ja) * 2003-03-24 2004-10-14 Fujitsu Ltd 多層プリント配線板及びその製造方法
CN1906985A (zh) * 2004-10-08 2007-01-31 松下电器产业株式会社 多层电路板的制造方法
CN101411253A (zh) * 2006-03-28 2009-04-15 松下电器产业株式会社 多层布线基板及其制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1199536C (zh) * 1999-10-26 2005-04-27 伊比登株式会社 多层印刷配线板及多层印刷配线板的制造方法
JP4536430B2 (ja) * 2004-06-10 2010-09-01 イビデン株式会社 フレックスリジッド配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000101248A (ja) * 1998-09-24 2000-04-07 Ibiden Co Ltd 多数個取り多層プリント配線板
JP2004288989A (ja) * 2003-03-24 2004-10-14 Fujitsu Ltd 多層プリント配線板及びその製造方法
CN1906985A (zh) * 2004-10-08 2007-01-31 松下电器产业株式会社 多层电路板的制造方法
CN101411253A (zh) * 2006-03-28 2009-04-15 松下电器产业株式会社 多层布线基板及其制造方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105577214A (zh) * 2014-10-30 2016-05-11 瑞萨电子株式会社 电子装置及其制造方法
CN107403770A (zh) * 2016-08-29 2017-11-28 上海兆芯集成电路有限公司 电子结构以及电子结构阵列
CN107155266B (zh) * 2017-06-20 2020-10-23 广州兴森快捷电路科技有限公司 Z向互连线路板及其制作方法
WO2018233272A1 (zh) * 2017-06-20 2018-12-27 广州兴森快捷电路科技有限公司 孔连接层的制作方法、线路板的制作方法及线路板
CN107155266A (zh) * 2017-06-20 2017-09-12 广州兴森快捷电路科技有限公司 Z向互连线路板及其制作方法
US11083091B2 (en) 2017-06-20 2021-08-03 Guangzhou Fastprint Circuit Tech Co., Ltd. Hole connecting layer manufacturing method, circuit board manufacturing method and circuit board
CN110165442A (zh) * 2018-02-12 2019-08-23 泰达电子股份有限公司 金属块焊接柱组合及其应用的电源模块
CN110165442B (zh) * 2018-02-12 2020-11-03 泰达电子股份有限公司 金属块焊接柱组合及其应用的电源模块
CN111385981A (zh) * 2018-12-29 2020-07-07 深南电路股份有限公司 多样化装配印刷线路板及制造方法
CN111385981B (zh) * 2018-12-29 2025-01-03 深南电路股份有限公司 多样化装配印刷线路板及制造方法
CN112118676A (zh) * 2019-06-21 2020-12-22 唐虞企业股份有限公司 电路板及其制造方法
CN112118676B (zh) * 2019-06-21 2022-02-01 唐虞企业股份有限公司 电路板及其制造方法
CN120805769A (zh) * 2025-07-02 2025-10-17 江西世邦电路有限公司 双层电路板电镀层精准电镀控制系统及方法
CN120805769B (zh) * 2025-07-02 2026-02-03 江西世邦电路有限公司 双层电路板电镀层精准电镀控制系统及方法
CN121152127A (zh) * 2025-11-18 2025-12-16 深圳市卡博尔科技有限公司 一种高密度互联电路板及其制备方法

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Publication number Publication date
KR20130007415A (ko) 2013-01-18
TW201301967A (zh) 2013-01-01
US20120325533A1 (en) 2012-12-27
JP2013008880A (ja) 2013-01-10

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Application publication date: 20121226