CN102796223A - 聚合物组合物以及包含所述聚合物的光刻胶 - Google Patents
聚合物组合物以及包含所述聚合物的光刻胶 Download PDFInfo
- Publication number
- CN102796223A CN102796223A CN2012102429953A CN201210242995A CN102796223A CN 102796223 A CN102796223 A CN 102796223A CN 2012102429953 A CN2012102429953 A CN 2012102429953A CN 201210242995 A CN201210242995 A CN 201210242995A CN 102796223 A CN102796223 A CN 102796223A
- Authority
- CN
- China
- Prior art keywords
- alkyl
- group
- multipolymer
- monomer
- combination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 0 COC(CC(C1)C2)(CC1C1)CC21OC(CC(**)=O)=O Chemical compound COC(CC(C1)C2)(CC1C1)CC21OC(CC(**)=O)=O 0.000 description 2
- NHODMUPNITVAAU-UHFFFAOYSA-N CC1(CCCC1)OC=O Chemical compound CC1(CCCC1)OC=O NHODMUPNITVAAU-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/186—Monomers containing fluorine with non-fluorinated comonomers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161490883P | 2011-05-27 | 2011-05-27 | |
| US61/490,883 | 2011-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102796223A true CN102796223A (zh) | 2012-11-28 |
Family
ID=46298243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102429953A Pending CN102796223A (zh) | 2011-05-27 | 2012-05-28 | 聚合物组合物以及包含所述聚合物的光刻胶 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8603728B2 (enExample) |
| EP (1) | EP2527379A1 (enExample) |
| JP (1) | JP5897986B2 (enExample) |
| CN (1) | CN102796223A (enExample) |
| TW (1) | TWI507428B (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107251190A (zh) * | 2014-12-24 | 2017-10-13 | 正交公司 | 电子装置的光刻图案化 |
| CN104725558B (zh) * | 2013-12-19 | 2018-07-27 | 罗门哈斯电子材料有限公司 | 光致酸生成共聚物和相关的光刻胶组合物、涂覆的基材以及形成电子器件的方法 |
| CN118702852A (zh) * | 2024-08-29 | 2024-09-27 | 珠海基石科技有限公司 | 含氟树脂及其制备方法、含氟单体、树脂组合物、功能膜和功能件、半导体器件及其制备方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5793489B2 (ja) * | 2011-11-30 | 2015-10-14 | 富士フイルム株式会社 | 感活性光線性又は感放射線性組成物、それを用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法 |
| JP6267532B2 (ja) | 2014-02-14 | 2018-01-24 | 信越化学工業株式会社 | レジスト保護膜材料及びパターン形成方法 |
| KR102233577B1 (ko) | 2014-02-25 | 2021-03-30 | 삼성전자주식회사 | 반도체 소자의 패턴 형성 방법 |
| CN119161524B (zh) * | 2024-11-19 | 2025-04-08 | 中节能万润股份有限公司 | 一种用于电子束光刻胶的聚合物及其制备方法和应用 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060246373A1 (en) * | 2005-05-01 | 2006-11-02 | Rohm And Haas Electronic Materials Llc | Compositions and processes for immersion lithography |
| JP2008165146A (ja) * | 2007-01-05 | 2008-07-17 | Fujifilm Corp | ポジ型感光性組成物、それを用いたパターン形成方法及び該ポジ型感光性組成物に用いられる樹脂 |
| WO2010071029A1 (ja) * | 2008-12-15 | 2010-06-24 | セントラル硝子株式会社 | 含フッ素重合性単量体、含フッ素重合体、レジスト材料及びパターン形成方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0654382B2 (ja) | 1986-11-18 | 1994-07-20 | 富士写真フイルム株式会社 | 感光性組成物 |
| AU632605B2 (en) * | 1989-08-14 | 1993-01-07 | Mitsubishi Rayon Company Limited | Material for dentistry |
| US5229245A (en) * | 1991-07-26 | 1993-07-20 | Industrial Technology Research Institute | Positively working photosensitive composition |
| US5185403A (en) * | 1991-07-31 | 1993-02-09 | Morton Coatings, Inc. | Thermosetting acrylic polymers and coating compositions containing said acrylic polymers and fluorocarbon resins |
| US6011119A (en) * | 1995-07-28 | 2000-01-04 | Mitsui Chemicals, Inc. | Resin composition for electrophotographic toner, and toner |
| JP2000510187A (ja) * | 1996-05-10 | 2000-08-08 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | アクリルポリマー化合物 |
| JP3623058B2 (ja) | 1996-06-13 | 2005-02-23 | 和光純薬工業株式会社 | 新規ポリマー及びこれを用いたレジスト組成物並びにこれを用いたパターン形成方法 |
| TW491860B (en) | 1997-04-30 | 2002-06-21 | Wako Pure Chem Ind Ltd | Acrylic or methacrylic acid derivatives and polymers obtained therefrom |
| JP3788549B2 (ja) | 1997-09-30 | 2006-06-21 | 旭電化工業株式会社 | ポリビニルブチラール樹脂組成物 |
| US6254878B1 (en) * | 1999-07-01 | 2001-07-03 | E. I. Du Pont De Nemours And Company | Nail polish compositions containing acrylic polymers |
| JP3984488B2 (ja) * | 2001-03-27 | 2007-10-03 | 日本ペイント株式会社 | 硬化性塗料組成物および塗膜形成方法 |
| WO2004067592A1 (ja) * | 2003-01-31 | 2004-08-12 | Mitsubishi Rayon Co., Ltd. | レジスト用重合体およびレジスト組成物 |
| JP4301872B2 (ja) * | 2003-06-19 | 2009-07-22 | ダイセル化学工業株式会社 | ラクトン環含有重合性単量体、高分子化合物、フォトレジスト用樹脂組成物、及び半導体の製造方法 |
| US7063931B2 (en) * | 2004-01-08 | 2006-06-20 | International Business Machines Corporation | Positive photoresist composition with a polymer including a fluorosulfonamide group and process for its use |
| JP4442887B2 (ja) * | 2004-02-27 | 2010-03-31 | 三菱レイヨン株式会社 | レジスト用重合体 |
| EP1621927B1 (en) * | 2004-07-07 | 2018-05-23 | FUJIFILM Corporation | Positive type resist composition for use in liquid immersion exposure and a method of forming the pattern using the same |
| JP4714488B2 (ja) * | 2004-08-26 | 2011-06-29 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
| JP2006171667A (ja) * | 2004-11-22 | 2006-06-29 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
| US7247419B2 (en) * | 2005-04-11 | 2007-07-24 | Az Electronic Materials Usa Corp. | Nanocomposite photosensitive composition and use thereof |
| JP4614092B2 (ja) * | 2006-01-31 | 2011-01-19 | 信越化学工業株式会社 | フッ素アルコール化合物の製造方法 |
| JP2007284368A (ja) * | 2006-04-14 | 2007-11-01 | Daicel Chem Ind Ltd | (メタ)アクリル系単量体及びレジスト樹脂の保護膜用樹脂 |
| JP2007284381A (ja) * | 2006-04-18 | 2007-11-01 | Daicel Chem Ind Ltd | フォトレジスト用(メタ)アクリル系単量体、その高分子化合物及びフォトレジスト用樹脂組成物 |
| EP1970760B1 (en) * | 2007-03-14 | 2012-12-26 | FUJIFILM Corporation | Positive resist composition containing a resin for hydrophobilizing resist surface, method for production thereof |
| JP4621754B2 (ja) * | 2007-03-28 | 2011-01-26 | 富士フイルム株式会社 | ポジ型レジスト組成物およびパターン形成方法 |
| JP4743450B2 (ja) * | 2008-09-05 | 2011-08-10 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
| US8663903B2 (en) * | 2009-04-21 | 2014-03-04 | Central Glass Company, Limited | Top coating composition |
| CN101963755B (zh) | 2009-06-26 | 2012-12-19 | 罗门哈斯电子材料有限公司 | 自对准间隔物多重图形化方法 |
| JP5741297B2 (ja) * | 2010-08-05 | 2015-07-01 | Jsr株式会社 | 感放射線性樹脂組成物、レジストパターン形成方法及び重合体 |
-
2012
- 2012-05-22 EP EP12168975A patent/EP2527379A1/en not_active Withdrawn
- 2012-05-23 JP JP2012117271A patent/JP5897986B2/ja not_active Expired - Fee Related
- 2012-05-24 TW TW101118475A patent/TWI507428B/zh not_active IP Right Cessation
- 2012-05-28 CN CN2012102429953A patent/CN102796223A/zh active Pending
- 2012-05-29 US US13/482,559 patent/US8603728B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060246373A1 (en) * | 2005-05-01 | 2006-11-02 | Rohm And Haas Electronic Materials Llc | Compositions and processes for immersion lithography |
| JP2008165146A (ja) * | 2007-01-05 | 2008-07-17 | Fujifilm Corp | ポジ型感光性組成物、それを用いたパターン形成方法及び該ポジ型感光性組成物に用いられる樹脂 |
| WO2010071029A1 (ja) * | 2008-12-15 | 2010-06-24 | セントラル硝子株式会社 | 含フッ素重合性単量体、含フッ素重合体、レジスト材料及びパターン形成方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104725558B (zh) * | 2013-12-19 | 2018-07-27 | 罗门哈斯电子材料有限公司 | 光致酸生成共聚物和相关的光刻胶组合物、涂覆的基材以及形成电子器件的方法 |
| CN107251190A (zh) * | 2014-12-24 | 2017-10-13 | 正交公司 | 电子装置的光刻图案化 |
| CN107251190B (zh) * | 2014-12-24 | 2020-11-10 | 正交公司 | 电子装置的光刻图案化 |
| CN118702852A (zh) * | 2024-08-29 | 2024-09-27 | 珠海基石科技有限公司 | 含氟树脂及其制备方法、含氟单体、树脂组合物、功能膜和功能件、半导体器件及其制备方法 |
| CN118702852B (zh) * | 2024-08-29 | 2024-11-08 | 珠海基石科技有限公司 | 含氟树脂及其制备方法、含氟单体、树脂组合物、功能膜和功能件、半导体器件及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI507428B (zh) | 2015-11-11 |
| JP5897986B2 (ja) | 2016-04-06 |
| TW201307406A (zh) | 2013-02-16 |
| EP2527379A1 (en) | 2012-11-28 |
| US20120301823A1 (en) | 2012-11-29 |
| US8603728B2 (en) | 2013-12-10 |
| JP2013010936A (ja) | 2013-01-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121128 |
|
| RJ01 | Rejection of invention patent application after publication |