CN102656961B - 电子控制设备 - Google Patents

电子控制设备 Download PDF

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Publication number
CN102656961B
CN102656961B CN201080055785.2A CN201080055785A CN102656961B CN 102656961 B CN102656961 B CN 102656961B CN 201080055785 A CN201080055785 A CN 201080055785A CN 102656961 B CN102656961 B CN 102656961B
Authority
CN
China
Prior art keywords
electrically conductive
circuit board
electronic control
housing
shielding element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080055785.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN102656961A (zh
Inventor
V·韦伯
H·巴尔特
R·舍特伦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN102656961A publication Critical patent/CN102656961A/zh
Application granted granted Critical
Publication of CN102656961B publication Critical patent/CN102656961B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
CN201080055785.2A 2009-12-10 2010-11-25 电子控制设备 Expired - Fee Related CN102656961B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009054517.4 2009-12-10
DE102009054517A DE102009054517B4 (de) 2009-12-10 2009-12-10 Elektronisches Steuergerät
PCT/EP2010/068171 WO2011069828A1 (de) 2009-12-10 2010-11-25 Elektronisches steuergerät

Publications (2)

Publication Number Publication Date
CN102656961A CN102656961A (zh) 2012-09-05
CN102656961B true CN102656961B (zh) 2015-11-25

Family

ID=43607705

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080055785.2A Expired - Fee Related CN102656961B (zh) 2009-12-10 2010-11-25 电子控制设备

Country Status (6)

Country Link
US (1) US8929078B2 (https=)
EP (1) EP2510765B1 (https=)
CN (1) CN102656961B (https=)
DE (1) DE102009054517B4 (https=)
IN (1) IN2012DN01784A (https=)
WO (1) WO2011069828A1 (https=)

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JP5733260B2 (ja) * 2012-04-09 2015-06-10 株式会社村田製作所 電源モジュール
TWM472393U (zh) * 2012-05-04 2014-02-11 Molex Inc 成組連接器系統
TW201410127A (zh) * 2012-08-30 2014-03-01 鴻海精密工業股份有限公司 電子設備
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DE102013212446A1 (de) * 2013-06-27 2015-01-15 Zf Friedrichshafen Ag Elektrische Schaltung und Verfahren zum Herstellen einer elektrischen Schaltung zur Ansteuerung einer Last
CN105706540B (zh) * 2013-08-07 2018-04-03 Abb公司 用于电气或电子设备的冷却装置以及包括这样的冷却装置的电气或电子设备尤其是断路器
JP6075267B2 (ja) * 2013-10-29 2017-02-08 日立金属株式会社 光アンプモジュール
JP6278695B2 (ja) * 2013-12-26 2018-02-14 株式会社デンソー 電子制御ユニット、および、これを用いた電動パワーステアリング装置
CN105321898A (zh) * 2014-06-03 2016-02-10 住友电木株式会社 金属基座安装基板以及金属基座安装基板安装部件
JP2016012720A (ja) * 2014-06-03 2016-01-21 住友ベークライト株式会社 金属ベース実装基板および金属ベース実装基板実装部材
DE102014212540A1 (de) * 2014-06-30 2015-12-31 Robert Bosch Gmbh Fahrzeug mit verbesserter Batterieabschirmung
DE102014217552A1 (de) * 2014-09-03 2016-03-03 Conti Temic Microelectronic Gmbh Steuergerätevorrichtung für ein Kraftfahrzeug sowie Verfahren zum Herstellen einer solchen
US20160135282A1 (en) * 2014-11-07 2016-05-12 Kabushiki Kaisha Toshiba Electronic apparatus
JP6328044B2 (ja) * 2014-12-09 2018-05-23 カルソニックカンセイ株式会社 電子ユニット
DE102015001148B4 (de) 2015-01-30 2019-04-11 e.solutions GmbH Anordnung und Verfahren zur elektromagnetischen Abschirmung
JP6398849B2 (ja) * 2015-04-06 2018-10-03 株式会社デンソー 電子制御装置
DE102015206480A1 (de) * 2015-04-10 2016-10-13 Robert Bosch Gmbh Steuergerät
US10061363B2 (en) * 2015-09-04 2018-08-28 Apple Inc. Combination parallel path heatsink and EMI shield
JP6528620B2 (ja) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 回路構成体および電気接続箱
KR101998343B1 (ko) 2016-02-26 2019-07-09 삼성전자주식회사 냉각 구조를 포함하는 전자 장치
US10624240B2 (en) * 2016-04-29 2020-04-14 Hewlett Packard Enterprise Development Lp First and second shields for thermal isolation
US20180042144A1 (en) * 2016-08-03 2018-02-08 Kuei-Piao Lee Method of Cooling Electric-Vehicle Controller
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
DE102016115453B4 (de) * 2016-08-19 2023-10-19 Krohne Ag Messgerät mit Wärmeleitvorrichtung, Wärmeleitvorrichtung und Verfahren
TWM541686U (zh) * 2016-12-27 2017-05-11 微星科技股份有限公司 電子裝置
JP2019003965A (ja) * 2017-06-09 2019-01-10 富士通株式会社 電子機器
EP3416467B1 (en) * 2017-06-13 2022-05-04 ABB Schweiz AG Heat exchanger structure for a rack assembly
US10299405B2 (en) * 2017-10-02 2019-05-21 Plume Design, Inc. Mid-spreader for stacked circuit boards in an electronic device
US10631438B2 (en) * 2017-12-23 2020-04-21 International Business Machines Corporation Mechanically flexible cold plates for low power components
JP7016054B2 (ja) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 電源装置、前照灯、及び移動体
US10999957B2 (en) * 2018-02-12 2021-05-04 Samsung Electro-Mechanics Co., Ltd. Communication module and mounting structure thereof
EP3756431A1 (en) * 2018-02-19 2020-12-30 InterDigital CE Patent Holdings Heatsink assembly for an electronic device
DE102018103713A1 (de) * 2018-02-20 2019-08-22 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Mechanisches und thermisches System für eine modulare Batterie mit Leistungselektronikkomponenten
US11122707B2 (en) * 2018-07-12 2021-09-14 Arris Enterprises Llc Raised pathway heat sink
US10496137B1 (en) * 2018-09-13 2019-12-03 Fujifilm Sonosite, Inc. Electronics board mounting system
JP6945514B2 (ja) * 2018-09-20 2021-10-06 日立Astemo株式会社 電子制御装置
WO2022132657A1 (en) * 2020-12-17 2022-06-23 NearField Atomics Inc. Incubator with a magnetically-quiet incubator chamber
DE102021117920A1 (de) 2021-07-12 2023-01-12 Valeo Schalter Und Sensoren Gmbh Detektionsvorrichtung zur Überwachung wenigstens eines Überwachungsbereichs, Gehäuse für eine Detektionsvorrichtung, Fahrzeug mit wenigstens einer Detektionsvorrichtung und Verfahren zur Herstellung einer Detektionsvorrichtung
CN118140195A (zh) * 2021-10-27 2024-06-04 松下知识产权经营株式会社 电子设备
DE102022113505A1 (de) 2022-05-30 2023-11-30 Bayerische Motoren Werke Aktiengesellschaft Abschirmblech für eine Baugruppe eines Leistungselektronikmodul mit Abstützfunktion
DE102022207567A1 (de) 2022-07-25 2024-01-25 Robert Bosch Gesellschaft mit beschränkter Haftung Elektrische Vorrichtung, insbesondere Steuergerät
DE102023101875B4 (de) 2023-01-26 2026-01-15 Bayerische Motoren Werke Aktiengesellschaft Kühleinrichtung zum Kühlen einer elektronischen Recheneinrichtung für ein Kraftfahrzeug sowie Kraftfahrzeug
DE102023102548A1 (de) 2023-02-02 2024-08-08 Bayerische Motoren Werke Aktiengesellschaft Führungseinrichtung zum Führen eines Temperiermittels, insbesondere eines Kraftfahrzeugs, sowie Kraftfahrzeug
CN117119777B (zh) * 2023-07-27 2024-09-13 重庆天概电源科技有限公司 电磁屏蔽装置
DE102024200131A1 (de) * 2024-01-05 2025-07-10 Schaeffler Technologies AG & Co. KG Elektronische Steuereinheit mit Formdichtungselement

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Also Published As

Publication number Publication date
EP2510765A1 (de) 2012-10-17
DE102009054517A1 (de) 2011-06-16
CN102656961A (zh) 2012-09-05
WO2011069828A1 (de) 2011-06-16
EP2510765B1 (de) 2013-11-06
DE102009054517B4 (de) 2011-12-29
US8929078B2 (en) 2015-01-06
IN2012DN01784A (https=) 2015-06-05
US20120300405A1 (en) 2012-11-29

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