IN2012DN01784A - - Google Patents
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- Publication number
- IN2012DN01784A IN2012DN01784A IN1784DEN2012A IN2012DN01784A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A IN 1784DEN2012 A IN1784DEN2012 A IN 1784DEN2012A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A
- Authority
- IN
- India
- Prior art keywords
- shielding
- electrically conductive
- electronic component
- conductive shielding
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Described herein is an electronic control unit (10) comprising a housing (100, 200), wherein at least one electronic component (150, 160, 162, 164, 192, 194) is arranged on a circuit board (110, 112). The electronic control unit (10) has a unit for shielding of electrical and/or magnetic fields having an electrically conductive shielding (170, 176, 178 , 270, 278, 300, 310, 320). The shielding is arranged so that at least the electrically conductive shielding and the circuit board form a Faraday cage for at least an associated electronic component (160, 162, 164, 192, 194). Further, the electrically conductive shielding (176, 178, 278) is connected to a ground potential. In an embodiment, at least the electronic component (164, 192, 292) with its rear side, which particularly has a rear side metallization (168, 268), stands in conductive contact with at least the electrically conductive shielding (176, 178, 278).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE200910054517 DE102009054517B4 (en) | 2009-12-10 | 2009-12-10 | Electronic control unit |
| PCT/EP2010/068171 WO2011069828A1 (en) | 2009-12-10 | 2010-11-25 | Electronic control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DN01784A true IN2012DN01784A (en) | 2015-06-05 |
Family
ID=43607705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN1784DEN2012 IN2012DN01784A (en) | 2009-12-10 | 2010-11-25 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8929078B2 (en) |
| EP (1) | EP2510765B1 (en) |
| CN (1) | CN102656961B (en) |
| DE (1) | DE102009054517B4 (en) |
| IN (1) | IN2012DN01784A (en) |
| WO (1) | WO2011069828A1 (en) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8451600B1 (en) * | 2010-03-04 | 2013-05-28 | Amazon Technologies, Inc. | Heat spreading chassis for rack-mounted computer system |
| US9119327B2 (en) * | 2010-10-26 | 2015-08-25 | Tdk-Lambda Corporation | Thermal management system and method |
| DE102011075308A1 (en) | 2011-05-05 | 2012-11-08 | Robert Bosch Gmbh | Electronic circuit arrangement for control device in motor car, has electronic components arranged on circuit boards, where regions around components are filled with material, which has heat conductivity larger than heat conductivity of air |
| WO2013095490A1 (en) * | 2011-12-22 | 2013-06-27 | Hewlett-Packard Development Company, L.P. | Heat sink base and shield |
| JP2015508942A (en) | 2012-03-01 | 2015-03-23 | オートリブ ディベロップメント エービー | Electronic unit having a PCB and two housing parts |
| JP5733260B2 (en) * | 2012-04-09 | 2015-06-10 | 株式会社村田製作所 | Power module |
| TWM472393U (en) * | 2012-05-04 | 2014-02-11 | Molex Inc | Grouped connector system |
| TW201410127A (en) * | 2012-08-30 | 2014-03-01 | Hon Hai Prec Ind Co Ltd | Electronic device |
| US9215833B2 (en) * | 2013-03-15 | 2015-12-15 | Apple Inc. | Electronic device with heat dissipating electromagnetic interference shielding structures |
| DE102013212446A1 (en) * | 2013-06-27 | 2015-01-15 | Zf Friedrichshafen Ag | Electric circuit and method for producing an electrical circuit for driving a load |
| RU2650183C2 (en) * | 2013-08-07 | 2018-04-11 | АББ С.п.А. | Cooling apparatus for an electrical or electronic device, and electrical or electronic device, in particular a circuit breaker, comprising such cooling apparatus |
| JP6075267B2 (en) * | 2013-10-29 | 2017-02-08 | 日立金属株式会社 | Optical amplifier module |
| JP6278695B2 (en) * | 2013-12-26 | 2018-02-14 | 株式会社デンソー | Electronic control unit and electric power steering apparatus using the same |
| JP2016012720A (en) * | 2014-06-03 | 2016-01-21 | 住友ベークライト株式会社 | Metal-based mounting board and member provided with metal-based mounting board |
| CN105321898A (en) * | 2014-06-03 | 2016-02-10 | 住友电木株式会社 | Metal-based mounting board and member provided with metal-based mounting board |
| DE102014212540A1 (en) * | 2014-06-30 | 2015-12-31 | Robert Bosch Gmbh | Vehicle with improved battery shield |
| DE102014217552A1 (en) * | 2014-09-03 | 2016-03-03 | Conti Temic Microelectronic Gmbh | Control device for a motor vehicle and method for producing such |
| US20160135282A1 (en) * | 2014-11-07 | 2016-05-12 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| JP6328044B2 (en) * | 2014-12-09 | 2018-05-23 | カルソニックカンセイ株式会社 | Electronic unit |
| DE102015001148B4 (en) * | 2015-01-30 | 2019-04-11 | e.solutions GmbH | Arrangement and method for electromagnetic shielding |
| JP6398849B2 (en) * | 2015-04-06 | 2018-10-03 | 株式会社デンソー | Electronic control unit |
| DE102015206480A1 (en) * | 2015-04-10 | 2016-10-13 | Robert Bosch Gmbh | control unit |
| US10061363B2 (en) * | 2015-09-04 | 2018-08-28 | Apple Inc. | Combination parallel path heatsink and EMI shield |
| JP6528620B2 (en) * | 2015-09-15 | 2019-06-12 | 株式会社オートネットワーク技術研究所 | Circuit structure and electrical connection box |
| KR101998343B1 (en) | 2016-02-26 | 2019-07-09 | 삼성전자주식회사 | Electronic Device having Cooling Structure |
| US10624240B2 (en) * | 2016-04-29 | 2020-04-14 | Hewlett Packard Enterprise Development Lp | First and second shields for thermal isolation |
| US20180042144A1 (en) * | 2016-08-03 | 2018-02-08 | Kuei-Piao Lee | Method of Cooling Electric-Vehicle Controller |
| DE102017212968B4 (en) * | 2016-08-05 | 2024-02-01 | Robert Bosch Gmbh | HOUSING STRUCTURE FOR AN ELECTRONIC CONTROL UNIT AND PRODUCTION METHOD |
| DE102016115453B4 (en) * | 2016-08-19 | 2023-10-19 | Krohne Ag | Measuring device with heat-conducting device, heat-conducting device and method |
| TWM541686U (en) * | 2016-12-27 | 2017-05-11 | Micro-Star Int'l Co Ltd | Electronic device |
| JP2019003965A (en) * | 2017-06-09 | 2019-01-10 | 富士通株式会社 | Electronics |
| EP3416467B1 (en) * | 2017-06-13 | 2022-05-04 | ABB Schweiz AG | Heat exchanger structure for a rack assembly |
| US10299405B2 (en) * | 2017-10-02 | 2019-05-21 | Plume Design, Inc. | Mid-spreader for stacked circuit boards in an electronic device |
| US10631438B2 (en) * | 2017-12-23 | 2020-04-21 | International Business Machines Corporation | Mechanically flexible cold plates for low power components |
| JP7016054B2 (en) * | 2018-01-12 | 2022-02-04 | パナソニックIpマネジメント株式会社 | Power supplies, headlights, and mobiles |
| US10999957B2 (en) * | 2018-02-12 | 2021-05-04 | Samsung Electro-Mechanics Co., Ltd. | Communication module and mounting structure thereof |
| CN111713184A (en) * | 2018-02-19 | 2020-09-25 | 交互数字Ce专利控股公司 | Heat sink assemblies for electronic equipment |
| DE102018103713A1 (en) * | 2018-02-20 | 2019-08-22 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Mechanical and thermal system for a modular battery with power electronics components |
| US11122707B2 (en) * | 2018-07-12 | 2021-09-14 | Arris Enterprises Llc | Raised pathway heat sink |
| US10496137B1 (en) * | 2018-09-13 | 2019-12-03 | Fujifilm Sonosite, Inc. | Electronics board mounting system |
| JP6945514B2 (en) * | 2018-09-20 | 2021-10-06 | 日立Astemo株式会社 | Electronic control device |
| US20220195373A1 (en) * | 2020-12-17 | 2022-06-23 | NearField Atomics Inc. | Incubator with a magnetically-quiet incubator chamber and methods of making and using |
| DE102021117920A1 (en) | 2021-07-12 | 2023-01-12 | Valeo Schalter Und Sensoren Gmbh | Detection device for monitoring at least one monitoring area, housing for a detection device, vehicle with at least one detection device and method for producing a detection device |
| DE102022113505A1 (en) | 2022-05-30 | 2023-11-30 | Bayerische Motoren Werke Aktiengesellschaft | Shielding plate for an assembly of a power electronics module with a support function |
| DE102022207567A1 (en) | 2022-07-25 | 2024-01-25 | Robert Bosch Gesellschaft mit beschränkter Haftung | Electrical device, in particular control device |
| DE102023101875A1 (en) | 2023-01-26 | 2024-08-01 | Bayerische Motoren Werke Aktiengesellschaft | Cooling device for cooling an electronic computing device for a motor vehicle and motor vehicle |
| DE102023102548A1 (en) | 2023-02-02 | 2024-08-08 | Bayerische Motoren Werke Aktiengesellschaft | Guide device for guiding a temperature control medium, in particular of a motor vehicle, and motor vehicle |
| CN117119777B (en) * | 2023-07-27 | 2024-09-13 | 重庆天概电源科技有限公司 | Electromagnetic shielding device |
| DE102024200131A1 (en) * | 2024-01-05 | 2025-07-10 | Schaeffler Technologies AG & Co. KG | Electronic control unit with molded sealing element |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4317469A1 (en) | 1993-05-26 | 1994-12-01 | Bosch Gmbh Robert | Assembly for electronic apparatuses |
| US5815371A (en) * | 1996-09-26 | 1998-09-29 | Dell U.S.A., L.P. | Multi-function heat dissipator |
| DE69732174T2 (en) * | 1997-03-19 | 2005-12-29 | Telefonaktiebolaget Lm Ericsson (Publ) | Two-piece electromagnetic shielding device for mounting on a printed circuit board |
| US6049469A (en) * | 1997-08-20 | 2000-04-11 | Dell Usa, L.P. | Combination electromagnetic shield and heat spreader |
| US7082033B1 (en) * | 1998-02-13 | 2006-07-25 | Micron Technology, Inc. | Removing heat from integrated circuit devices mounted on a support structure |
| US5973923A (en) * | 1998-05-28 | 1999-10-26 | Jitaru; Ionel | Packaging power converters |
| US6367263B1 (en) * | 2000-05-31 | 2002-04-09 | Intel Corporation | Integrated circuit refrigeration device |
| WO2001095687A1 (en) * | 2000-06-06 | 2001-12-13 | Mitsubishi Denki Kabushiki Kaisha | Cooling structure of communication device |
| US6562655B1 (en) * | 2001-04-20 | 2003-05-13 | Amkor Technology, Inc. | Heat spreader with spring IC package fabrication method |
| US6740959B2 (en) | 2001-08-01 | 2004-05-25 | International Business Machines Corporation | EMI shielding for semiconductor chip carriers |
| US6881077B2 (en) * | 2002-07-22 | 2005-04-19 | Siemens Vdo Automotive Corporation | Automotive control module housing |
| JP4469563B2 (en) * | 2003-06-05 | 2010-05-26 | 株式会社ソニー・コンピュータエンタテインメント | Electronic equipment, electromagnetic wave radiation suppression member |
| DE602005021129D1 (en) | 2004-09-27 | 2010-06-17 | Murata Manufacturing Co | shielding |
| JP2006190707A (en) * | 2004-12-28 | 2006-07-20 | Toshiba Corp | Electronic device and television receiver to which the electronic device is applied |
| JP4555119B2 (en) * | 2005-02-22 | 2010-09-29 | アルプス電気株式会社 | Surface mount electronic circuit unit |
| CN1845666A (en) * | 2005-04-07 | 2006-10-11 | 华硕电脑股份有限公司 | shelter structure |
| KR100703090B1 (en) * | 2005-08-30 | 2007-04-06 | 삼성전기주식회사 | Back Ground Flip Chip Semiconductor Packages |
| US7651938B2 (en) * | 2006-06-07 | 2010-01-26 | Advanced Micro Devices, Inc. | Void reduction in indium thermal interface material |
| US20080310114A1 (en) * | 2007-06-18 | 2008-12-18 | Lucent Technologies Inc. | Heat-transfer device for an electromagnetic interference (emi) shield using conductive bristles |
| US20090002949A1 (en) | 2007-06-29 | 2009-01-01 | Lucent Technologies Inc. | Heat transfer for electronic component via an electromagnetic interference (emi) shield having shield deformation |
| CN101150123B (en) | 2007-10-31 | 2010-06-02 | 日月光半导体制造股份有限公司 | Semiconductor packaging structure with electromagnetic shielding cover |
| US8507319B2 (en) * | 2007-12-07 | 2013-08-13 | Stats Chippac Ltd. | Integrated circuit package system with shield |
| TWI370722B (en) * | 2008-12-22 | 2012-08-11 | Unihan Corp | Electromagnetic shielding device with heat dissipating |
-
2009
- 2009-12-10 DE DE200910054517 patent/DE102009054517B4/en not_active Expired - Fee Related
-
2010
- 2010-11-25 US US13/514,705 patent/US8929078B2/en not_active Expired - Fee Related
- 2010-11-25 CN CN201080055785.2A patent/CN102656961B/en not_active Expired - Fee Related
- 2010-11-25 IN IN1784DEN2012 patent/IN2012DN01784A/en unknown
- 2010-11-25 EP EP10788276.3A patent/EP2510765B1/en not_active Not-in-force
- 2010-11-25 WO PCT/EP2010/068171 patent/WO2011069828A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN102656961A (en) | 2012-09-05 |
| DE102009054517B4 (en) | 2011-12-29 |
| EP2510765B1 (en) | 2013-11-06 |
| CN102656961B (en) | 2015-11-25 |
| US20120300405A1 (en) | 2012-11-29 |
| WO2011069828A1 (en) | 2011-06-16 |
| US8929078B2 (en) | 2015-01-06 |
| EP2510765A1 (en) | 2012-10-17 |
| DE102009054517A1 (en) | 2011-06-16 |
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