TWM472393U - 成組連接器系統 - Google Patents

成組連接器系統 Download PDF

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Publication number
TWM472393U
TWM472393U TW102208356U TW102208356U TWM472393U TW M472393 U TWM472393 U TW M472393U TW 102208356 U TW102208356 U TW 102208356U TW 102208356 U TW102208356 U TW 102208356U TW M472393 U TWM472393 U TW M472393U
Authority
TW
Taiwan
Prior art keywords
body portion
connector system
covers
front surface
housings
Prior art date
Application number
TW102208356U
Other languages
English (en)
Inventor
Jerry D Kachli
Philip J Dambach
G Banakis Emanuel
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of TWM472393U publication Critical patent/TWM472393U/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/516—Means for holding or embracing insulating body, e.g. casing, hoods
    • H01R13/518—Means for holding or embracing insulating body, e.g. casing, hoods for holding or embracing several coupling parts, e.g. frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/659—Shield structure with plural ports for distinct connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
    • H01R25/006—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits the coupling part being secured to apparatus or structure, e.g. duplex wall receptacle

Landscapes

  • Connector Housings Or Holding Contact Members (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

成組連接器系統
本申請涉及輸入/輸出(IO)連接器領域，更具體地涉及成組設置的IO連接器。
使用IO連接器是公知的。一個典型的應用是一伺服器或開關。為了提供一足夠數目的IO介面，通常是將多個IO連接器以稱之為成組佈置的方式並排設置。成組連接器的使用減小連接器之間的間隔(space)，從而對於一給定的開關的寬度而言可具有額外的介面。由介面數目增加所帶來的一個問題是已變得更難於使該系統散熱。與過去經常採用的無源器件(passive components)相比，設置於所述介面中的模組日益要求為有源器件(active components)(例如電能消耗)的事實使得這個散熱問題進一步加重。因此，採用一連續罩體系統的現有成組方案因散熱性能問題而變得難以利用。因此，某些人群會賞識在一成組連接器上的進一步的改進。
一種連接器系統包括多個罩體，各罩體單獨包 圍一殼體，各罩體限定至少一個介面。所述多個罩體分隔開，以使相鄰罩體之間存在一間隙。一導熱墊片設置在所述多個罩體周圍。所述導熱墊片包括多個通氣孔，以使空氣在所述多個間隙之間流動。所述導熱墊片可包括一前部，所述前部構造成接合該罩體的前表面且還可包括一密封面，所述密封面將所述導熱墊片密封於一邊框。
10‧‧‧成組連接器系統
15‧‧‧殼體
17‧‧‧間隙
20‧‧‧罩體
21‧‧‧外壁
22‧‧‧前緣
25‧‧‧前表面
28a‧‧‧第一介面
28b‧‧‧第二介面
29‧‧‧墊片
40‧‧‧電路板
60‧‧‧邊框
62‧‧‧唇部
64‧‧‧後表面
80‧‧‧導熱墊片
83‧‧‧主體部
84‧‧‧前部
85‧‧‧邊緣
86‧‧‧通氣孔
88‧‧‧密封面
96‧‧‧密封件
D1‧‧‧第一寬度
D2‧‧‧第二寬度
圖1示出一成組連接器系統的一實施例的一簡化立體圖。
圖2示出一成組連接器系統的一實施例的一前視圖。
圖3示出一成組連接器系統的一實施例的一部分立體圖。
圖4示出一成組連接器系統的一實施例的一側視圖。
圖5示出一成組連接器系統的一實施例的一部分分解立體圖。
圖6示出一導熱墊片的一實施例的一立體圖。
下面的詳細說明描述示範性實施例且不意欲限制於明確公開的組合。因此，除非另有說明，本文所公開的特徵可以組合在一起，以形成出於簡明目的而未示出的多個另外組合。
有關本新型之前述及其他技術內容、特點與功效，在以下配合參考圖式之一個較佳實施例的詳細說明中，將可清楚地呈現。
圖1-6示出可結合成一成組連接器系統10的多個特徵。一電路板40支撐多個殼體15，所述多個殼體15以間隔方式並排設置，同時多個罩體20設置於相應殼體15周圍，從而所述多個殼體15各被單獨地包圍。如能夠認識到的，相應相鄰罩體20的相鄰的外壁21之間存在有間隙17，間隙17提供相鄰罩體20之間的一預定距離。
所示出的所述多個罩體20(以及相對應的殼體15)各設置一第一介面28a以及一第二介面28b，所述兩個介面28a、28b為一堆疊結構。然而，應注意的是，如需要，則罩體20與殼體15可構造成設置一單個介面。這樣一種構造會成為電源配置(power profile)但也會在電路板40的每個前緣提供更少的介面。
示出一邊框60且邊框60具有一開口，所述開口圍繞所述多個罩體20延伸。邊框60包括一唇部62，唇部62限定所述開口且包括一後表面64，後表面64能夠由以常規方式形成開關或伺服器的結構支撐。
如能夠認識到的，所示出的罩體20具有一前緣22以及一前表面25，前表面25具有適於空氣和/或指示器(諸如適合供光導管使用)使用的多個開孔。一導熱墊片80包括一前部84，前部84具有提供給所述前部84一第一寬度D1的邊緣85。前部84設置成壓靠在所述罩體20的前 表面25和/或前緣22上。導熱墊片80還包括具有一第二寬度D2的一主體部83，並且所述主體部83是將置於罩體20之間且可接合一電磁干擾(EMI)墊片29的部分。如所示出的，EMI墊片29包括與主體部83接合並產生撓曲的多個指部。如能夠認識到的，該第一寬度D1大於該第二寬度D2，這使得罩體20的所述前表面25接合導熱墊片80。
導熱墊片80包括多個通氣孔86，所述多個通氣孔86構造成使得空氣流動通過所述導熱墊片80並在罩體20之間的間隙17流動。所述多個通氣孔86設置在前部84和主體部83二者上。導熱墊片80還包括一密封面88，密封面88構造成將一密封件96壓擠在密封面88與所述邊框60的後表面64之間。密封件96可構造成有助於阻擋EMI，從而所述連接器系統可提供良好的EMI保護。
在此提供的本申請借助其優選且示範性實施例說明了各個特徵。對於本領域普通技術人員而言，從閱讀本申請將做出隨附申請專利範圍的範圍和精神內的各種其他的實施例、修改和變形。
10‧‧‧成組連接器系統
17‧‧‧間隙
20‧‧‧罩體
21‧‧‧外壁
22‧‧‧前緣
28a‧‧‧第一介面
28b‧‧‧第二介面
40‧‧‧電路板
60‧‧‧邊框
80‧‧‧導熱墊片

Claims (6)

  1. 一種連接器系統，包括：一電路板；多個殼體，安裝於所述電路板，所述多個殼體並排佈置；多個罩體，各罩體包圍所述多個殼體的其中之一，各罩體包括限定一第一介面的一前表面且包括一電磁干擾(EMI)墊片，所述電磁干擾墊片圍繞該罩體在該前表面附近的周邊延伸，其中所述多個罩體以一預定距離分隔開；一導熱墊片，位於所述多個罩體周圍，所述導熱墊片包括一前部以及一主體部，所述前部和所述主體部各均包括多個通氣孔，所述主體部具有稍小於所述預定距離的一第一寬度，所述主體部接合所述EMI墊片，且所述前部具有稍大於所述預定距離的一第二寬度，所述前部接合所述前表面以防止在操作時所述導熱墊片的所述前部受壓越過所述前表面。
  2. 如請求項1所述連接器系統，還包括一邊框，所述邊框圍繞所述多個罩體的前表面延伸，所述導熱墊片具有一密封面，所述密封面構造成壓靠在所述邊框上。
  3. 如請求項2所述連接器系統，還包括一密封件，所述密封件設置於所述密封面和所述邊框之間，所述密封件壓擠在所述密封面與所述邊框之間。
  4. 如請求項3所述連接器系統，其中所述多個殼體和所述 多個罩體構造成各提供兩個介面，所述兩個介面中的一個堆疊在所述兩個介面中的另一個之上。
  5. 如請求項4所述連接器系統，其中所述EMI墊片具有多個指部，且所述主體部使得所述多個指部的至少一些指部撓曲。
  6. 如請求項5所述連接器系統，其中所述密封面位於所述主體部的後面，以使所述前部置於所述前表面上，所述主體部向後凹設且所述密封面相對於所述主體部進一步向後凹設。
TW102208356U 2012-05-04 2013-05-06 成組連接器系統 TWM472393U (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261642771P 2012-05-04 2012-05-04

Publications (1)

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TWM472393U true TWM472393U (zh) 2014-02-11

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Application Number Title Priority Date Filing Date
TW102208356U TWM472393U (zh) 2012-05-04 2013-05-06 成組連接器系統

Country Status (5)

Country Link
US (1) US9246252B2 (zh)
JP (1) JP5897765B2 (zh)
CN (1) CN104350645B (zh)
TW (1) TWM472393U (zh)
WO (1) WO2013166494A1 (zh)

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Also Published As

Publication number Publication date
WO2013166494A1 (en) 2013-11-07
JP5897765B2 (ja) 2016-03-30
US9246252B2 (en) 2016-01-26
CN104350645A (zh) 2015-02-11
JP2015524983A (ja) 2015-08-27
US20150087164A1 (en) 2015-03-26
CN104350645B (zh) 2016-04-20

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