CN102626895B - 基于光谱的监测化学机械研磨的装置及方法 - Google Patents

基于光谱的监测化学机械研磨的装置及方法 Download PDF

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Publication number
CN102626895B
CN102626895B CN201210109226.6A CN201210109226A CN102626895B CN 102626895 B CN102626895 B CN 102626895B CN 201210109226 A CN201210109226 A CN 201210109226A CN 102626895 B CN102626895 B CN 102626895B
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China
Prior art keywords
spectrum
grinding
base material
window
terminal
Prior art date
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CN201210109226.6A
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English (en)
Chinese (zh)
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CN102626895A (zh
Inventor
D·J·本韦格努
J·D·戴维
B·斯韦德克
H·Q·李
L·卡鲁皮亚
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Priority claimed from US11/213,674 external-priority patent/US7226339B2/en
Priority claimed from US11/261,742 external-priority patent/US7406394B2/en
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Publication of CN102626895A publication Critical patent/CN102626895A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/64—Manufacture or treatment of solid state devices other than semiconductor devices, or of parts thereof, not peculiar to a single device provided for in groups H01L31/00 - H10K99/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CN201210109226.6A 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法 Active CN102626895B (zh)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US71068205P 2005-08-22 2005-08-22
US60/710,682 2005-08-22
US11/213,344 2005-08-26
US11/213,674 US7226339B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,344 US7764377B2 (en) 2005-08-22 2005-08-26 Spectrum based endpointing for chemical mechanical polishing
US11/213,675 US7306507B2 (en) 2005-08-22 2005-08-26 Polishing pad assembly with glass or crystalline window
US11/213,674 2005-08-26
US11/213,675 2005-08-26
US11/261,742 2005-10-28
US11/261,742 US7406394B2 (en) 2005-08-22 2005-10-28 Spectra based endpointing for chemical mechanical polishing
US74776806P 2006-05-19 2006-05-19
US60/747,768 2006-05-19
CN2006800304049A CN101242931B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2006800304049A Division CN101242931B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法

Publications (2)

Publication Number Publication Date
CN102626895A CN102626895A (zh) 2012-08-08
CN102626895B true CN102626895B (zh) 2016-05-25

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CN201210109226.6A Active CN102626895B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法
CN201610227541.7A Active CN105773398B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法
CN201410667878.0A Active CN104526536B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法

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CN201610227541.7A Active CN105773398B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法
CN201410667878.0A Active CN104526536B (zh) 2005-08-22 2006-08-21 基于光谱的监测化学机械研磨的装置及方法

Country Status (4)

Country Link
JP (6) JP5622807B2 (ko)
KR (5) KR101593927B1 (ko)
CN (3) CN102626895B (ko)
TW (1) TWI361454B (ko)

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TWI496661B (zh) * 2010-04-28 2015-08-21 Applied Materials Inc 用於光學監測之參考光譜的自動產生
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US9352440B2 (en) * 2014-04-30 2016-05-31 Applied Materials, Inc. Serial feature tracking for endpoint detection
KR102447790B1 (ko) * 2014-12-12 2022-09-27 어플라이드 머티어리얼스, 인코포레이티드 Cmp 동안의 인 시튜 부산물 제거 및 플래튼 냉각을 위한 시스템 및 프로세스
CN104802091A (zh) * 2015-05-19 2015-07-29 肥西县三星玻璃有限公司 一种玻璃磨边机
JP2017064899A (ja) * 2015-10-01 2017-04-06 株式会社荏原製作所 研磨装置
KR101870701B1 (ko) 2016-08-01 2018-06-25 에스케이실트론 주식회사 폴리싱 측정 장치 및 그의 연마 시간 제어 방법, 및 그를 포함한 폴리싱 제어 시스템
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CN107520740A (zh) * 2017-09-18 2017-12-29 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 一种化学机械抛光中光谱终点的检测方法、装置及系统
KR101890331B1 (ko) * 2017-10-16 2018-08-21 에스케이씨 주식회사 누수 방지된 연마패드 및 이의 제조방법
CN107900788B (zh) * 2017-11-24 2020-04-24 上海华力微电子有限公司 一种改善层间介质研磨工艺厚度稳定性的方法
KR102527659B1 (ko) 2017-11-27 2023-05-03 삼성전자주식회사 공기청정기
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US11780047B2 (en) * 2020-06-24 2023-10-10 Applied Materials, Inc. Determination of substrate layer thickness with polishing pad wear compensation
CN112025547B (zh) * 2020-09-15 2021-11-02 泉芯集成电路制造(济南)有限公司 激光投影虚拟校正设备和方法
CN113478382B (zh) * 2021-07-20 2022-11-04 湖北鼎汇微电子材料有限公司 检测窗口、化学机械抛光垫及抛光系统

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Publication number Publication date
KR20130041396A (ko) 2013-04-24
JP5622806B2 (ja) 2014-11-12
KR101423579B1 (ko) 2014-07-25
JP6438288B2 (ja) 2018-12-12
JP5622807B2 (ja) 2014-11-12
JP2013048259A (ja) 2013-03-07
JP2012256912A (ja) 2012-12-27
CN102626895A (zh) 2012-08-08
CN104526536B (zh) 2017-09-22
JP6052906B2 (ja) 2016-12-27
KR20130041397A (ko) 2013-04-24
KR101398567B1 (ko) 2014-05-22
JP2012256913A (ja) 2012-12-27
CN105773398A (zh) 2016-07-20
JP2012256911A (ja) 2012-12-27
JP2015079984A (ja) 2015-04-23
JP6047327B2 (ja) 2016-12-21
TW200717637A (en) 2007-05-01
KR101593927B1 (ko) 2016-02-15
JP2015077684A (ja) 2015-04-23
KR20130042059A (ko) 2013-04-25
TWI361454B (en) 2012-04-01
KR101521414B1 (ko) 2015-05-19
KR20140019484A (ko) 2014-02-14
CN105773398B (zh) 2019-11-19
CN104526536A (zh) 2015-04-22
JP5624099B2 (ja) 2014-11-12
KR101398570B1 (ko) 2014-05-22
KR20140140598A (ko) 2014-12-09

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