CN102598273A - 用于soi mosfet中的面积高效型主体接触的分层浅沟槽隔离 - Google Patents
用于soi mosfet中的面积高效型主体接触的分层浅沟槽隔离 Download PDFInfo
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- CN102598273A CN102598273A CN2010800452884A CN201080045288A CN102598273A CN 102598273 A CN102598273 A CN 102598273A CN 2010800452884 A CN2010800452884 A CN 2010800452884A CN 201080045288 A CN201080045288 A CN 201080045288A CN 102598273 A CN102598273 A CN 102598273A
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- soi
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 18
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78612—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
- H01L29/78615—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing the kink- or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect with a body contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76283—Lateral isolation by refilling of trenches with dielectric material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thin Film Transistor (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (25)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/574,126 | 2009-10-06 | ||
US12/574,126 US8680617B2 (en) | 2009-10-06 | 2009-10-06 | Split level shallow trench isolation for area efficient body contacts in SOI MOSFETS |
PCT/US2010/046567 WO2011043870A2 (en) | 2009-10-06 | 2010-08-25 | Split level shallow trench isolation for area efficient body contacts in soi mosfets |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102598273A true CN102598273A (zh) | 2012-07-18 |
CN102598273B CN102598273B (zh) | 2016-01-13 |
Family
ID=43822540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201080045288.4A Expired - Fee Related CN102598273B (zh) | 2009-10-06 | 2010-08-25 | 用于soi mosfet中的面积高效型主体接触的分层浅沟槽隔离 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8680617B2 (zh) |
CN (1) | CN102598273B (zh) |
DE (1) | DE112010003986B4 (zh) |
GB (1) | GB2486601C (zh) |
TW (1) | TW201130135A (zh) |
WO (1) | WO2011043870A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104143555A (zh) * | 2013-05-08 | 2014-11-12 | 新加坡商格罗方德半导体私人有限公司 | 具有硅局部氧化的绝缘体上硅的集成电路及其制造方法 |
CN108231867A (zh) * | 2016-12-14 | 2018-06-29 | 格芯公司 | 至本体接触的多晶栅极延伸源极 |
CN112054061A (zh) * | 2020-08-25 | 2020-12-08 | 中国科学院微电子研究所 | 一种部分耗尽绝缘体上硅的体接触结构及其制作方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US8536656B2 (en) * | 2011-01-10 | 2013-09-17 | International Business Machines Corporation | Self-aligned contacts for high k/metal gate process flow |
JP2012174982A (ja) * | 2011-02-23 | 2012-09-10 | Toshiba Corp | 半導体記憶装置及びその製造方法 |
US20140073106A1 (en) | 2012-09-12 | 2014-03-13 | International Business Machines Corporation | Lateral bipolar transistor and cmos hybrid technology |
JP6545546B2 (ja) * | 2015-07-03 | 2019-07-17 | 株式会社東芝 | 半導体スイッチ |
US9818652B1 (en) | 2016-04-27 | 2017-11-14 | Globalfoundries Inc. | Commonly-bodied field-effect transistors |
Citations (3)
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US20020089031A1 (en) * | 2001-01-08 | 2002-07-11 | Chartered Semiconductor Manufacturing Ltd. | Novel method of body contact for SOI mosfet |
CN1741277A (zh) * | 2004-08-27 | 2006-03-01 | 株式会社瑞萨科技 | 半导体装置及其制造方法 |
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- 2010-08-25 CN CN201080045288.4A patent/CN102598273B/zh not_active Expired - Fee Related
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CN104143555A (zh) * | 2013-05-08 | 2014-11-12 | 新加坡商格罗方德半导体私人有限公司 | 具有硅局部氧化的绝缘体上硅的集成电路及其制造方法 |
CN108231867A (zh) * | 2016-12-14 | 2018-06-29 | 格芯公司 | 至本体接触的多晶栅极延伸源极 |
CN108231867B (zh) * | 2016-12-14 | 2021-07-30 | 格芯(美国)集成电路科技有限公司 | 至本体接触的多晶栅极延伸源极 |
CN112054061A (zh) * | 2020-08-25 | 2020-12-08 | 中国科学院微电子研究所 | 一种部分耗尽绝缘体上硅的体接触结构及其制作方法 |
CN112054061B (zh) * | 2020-08-25 | 2024-04-05 | 中国科学院微电子研究所 | 一种部分耗尽绝缘体上硅的体接触结构及其制作方法 |
Also Published As
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DE112010003986B4 (de) | 2015-07-02 |
WO2011043870A2 (en) | 2011-04-14 |
GB2486601B (en) | 2013-10-30 |
CN102598273B (zh) | 2016-01-13 |
DE112010003986T5 (de) | 2013-01-10 |
GB2486601C (en) | 2013-11-27 |
TW201130135A (en) | 2011-09-01 |
US8680617B2 (en) | 2014-03-25 |
US20110079851A1 (en) | 2011-04-07 |
GB201203113D0 (en) | 2012-04-04 |
GB2486601A (en) | 2012-06-20 |
WO2011043870A3 (en) | 2011-06-23 |
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