CN102484120A - 使用小芯片控制电子器件 - Google Patents

使用小芯片控制电子器件 Download PDF

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Publication number
CN102484120A
CN102484120A CN2010800378049A CN201080037804A CN102484120A CN 102484120 A CN102484120 A CN 102484120A CN 2010800378049 A CN2010800378049 A CN 2010800378049A CN 201080037804 A CN201080037804 A CN 201080037804A CN 102484120 A CN102484120 A CN 102484120A
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CN
China
Prior art keywords
substrate
chiplet
common substrate
chiplets
little chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800378049A
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English (en)
Chinese (zh)
Inventor
R·S·库克
约翰·W·哈默
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Global OLED Technology LLC
Original Assignee
Global OLED Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global OLED Technology LLC filed Critical Global OLED Technology LLC
Publication of CN102484120A publication Critical patent/CN102484120A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Facsimile Heads (AREA)
CN2010800378049A 2009-08-24 2010-08-04 使用小芯片控制电子器件 Pending CN102484120A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/546,118 US8183765B2 (en) 2009-08-24 2009-08-24 Controlling an electronic device using chiplets
US12/546,118 2009-08-24
PCT/US2010/044361 WO2011028354A2 (en) 2009-08-24 2010-08-04 Controlling an electronic device using chiplets

Publications (1)

Publication Number Publication Date
CN102484120A true CN102484120A (zh) 2012-05-30

Family

ID=43027602

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800378049A Pending CN102484120A (zh) 2009-08-24 2010-08-04 使用小芯片控制电子器件

Country Status (7)

Country Link
US (1) US8183765B2 (enExample)
EP (1) EP2471099A2 (enExample)
JP (1) JP5437489B2 (enExample)
KR (1) KR101233691B1 (enExample)
CN (1) CN102484120A (enExample)
TW (1) TWI383479B (enExample)
WO (1) WO2011028354A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105706183A (zh) * 2013-10-29 2016-06-22 三星Sdi株式会社 各向异性导电膜及利用其的半导体装置
CN114556552A (zh) * 2019-10-14 2022-05-27 零能耗股份公司 集成电子结构及结构部件间的数据通信
CN114631183A (zh) * 2019-08-26 2022-06-14 艾克斯瑟乐普林特有限公司 可变刚度模块

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JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
US9165989B2 (en) * 2009-09-16 2015-10-20 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8391018B2 (en) * 2009-09-28 2013-03-05 Qualcomm Incorporated Semiconductor die-based packaging interconnect
WO2015145886A1 (ja) * 2014-03-25 2015-10-01 パナソニックＩｐマネジメント株式会社 電極パターンの形成方法及び太陽電池の製造方法
JP6424610B2 (ja) * 2014-04-23 2018-11-21 ソニー株式会社 半導体装置、および製造方法
US9198236B1 (en) 2014-05-07 2015-11-24 Grote Industries, Llc System and method for controlling a multiple-color lighting device
KR102446131B1 (ko) * 2015-11-06 2022-09-23 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법
JP6594246B2 (ja) * 2016-03-31 2019-10-23 株式会社ジャパンディスプレイ 表示装置
US10107860B2 (en) 2016-06-21 2018-10-23 International Business Machines Corporation Bitwise rotating scan section for microelectronic chip testing and diagnostics
EP3564741B1 (en) * 2017-01-04 2023-11-22 Shih-Hsien Tseng Pixel unit structure
US10930631B2 (en) 2017-11-03 2021-02-23 Shih-Hsien Tseng Display apparatus, pixel array and manufacturing method thereof
TWI688802B (zh) 2017-11-03 2020-03-21 曾世憲 畫素陣列及其製造方法
JP2020155417A (ja) * 2020-06-24 2020-09-24 パイオニア株式会社 発光装置
WO2024228757A2 (en) * 2023-01-30 2024-11-07 University Of Iowa Research Foundation Cascaded superlattice narrowband led

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EP1403691A1 (en) * 2002-09-26 2004-03-31 Seiko Epson Corporation Electro-optical display device and its manufacturing method including the transfer of a chip
CN1570718A (zh) * 2004-01-27 2005-01-26 友达光电股份有限公司 接合芯片与其它装置于液晶显示面板上的方法及显示装置
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US20020078559A1 (en) * 2000-12-27 2002-06-27 International Business Machines Corporation Display fabrication using modular active devices
CN1582461A (zh) * 2001-09-07 2005-02-16 松下电器产业株式会社 显示装置及其制造方法
CN1448986A (zh) * 2002-03-29 2003-10-15 精工爱普生株式会社 半导体装置和电光学装置
US20030223138A1 (en) * 2002-04-24 2003-12-04 Yoshikazu Akiyama Thin film apparatus, a manufacturing method of the thin film apparatus, an active matrix substrate, a manufacturing method of the active matrix substrate, and an electro-optical apparatus having the active matrix substrate
EP1403691A1 (en) * 2002-09-26 2004-03-31 Seiko Epson Corporation Electro-optical display device and its manufacturing method including the transfer of a chip
CN1570718A (zh) * 2004-01-27 2005-01-26 友达光电股份有限公司 接合芯片与其它装置于液晶显示面板上的方法及显示装置
CN101197331A (zh) * 2006-12-07 2008-06-11 广富群光电股份有限公司 薄膜晶体管面板的制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105706183A (zh) * 2013-10-29 2016-06-22 三星Sdi株式会社 各向异性导电膜及利用其的半导体装置
CN114631183A (zh) * 2019-08-26 2022-06-14 艾克斯瑟乐普林特有限公司 可变刚度模块
US12456706B2 (en) 2019-08-26 2025-10-28 X-Celeprint Limited Variable stiffness modules
CN114556552A (zh) * 2019-10-14 2022-05-27 零能耗股份公司 集成电子结构及结构部件间的数据通信

Also Published As

Publication number Publication date
EP2471099A2 (en) 2012-07-04
KR20120052392A (ko) 2012-05-23
JP5437489B2 (ja) 2014-03-12
KR101233691B1 (ko) 2013-02-15
US8183765B2 (en) 2012-05-22
TWI383479B (zh) 2013-01-21
WO2011028354A2 (en) 2011-03-10
WO2011028354A3 (en) 2011-06-30
US20110043105A1 (en) 2011-02-24
JP2013502620A (ja) 2013-01-24
TW201117333A (en) 2011-05-16

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Application publication date: 20120530