JP5437489B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP5437489B2
JP5437489B2 JP2012526800A JP2012526800A JP5437489B2 JP 5437489 B2 JP5437489 B2 JP 5437489B2 JP 2012526800 A JP2012526800 A JP 2012526800A JP 2012526800 A JP2012526800 A JP 2012526800A JP 5437489 B2 JP5437489 B2 JP 5437489B2
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JP
Japan
Prior art keywords
chiplet
substrate
common substrate
electrode
chiplets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012526800A
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English (en)
Japanese (ja)
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JP2013502620A (ja
JP2013502620A5 (enExample
Inventor
コック、ロナルド・エス
ヘイマー、ジョン・ダブリュー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Global OLED Technology LLC
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Global OLED Technology LLC
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Publication date
Application filed by Global OLED Technology LLC filed Critical Global OLED Technology LLC
Publication of JP2013502620A publication Critical patent/JP2013502620A/ja
Publication of JP2013502620A5 publication Critical patent/JP2013502620A5/ja
Application granted granted Critical
Publication of JP5437489B2 publication Critical patent/JP5437489B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Facsimile Heads (AREA)
JP2012526800A 2009-08-24 2010-08-04 電子装置 Active JP5437489B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/546,118 2009-08-24
US12/546,118 US8183765B2 (en) 2009-08-24 2009-08-24 Controlling an electronic device using chiplets
PCT/US2010/044361 WO2011028354A2 (en) 2009-08-24 2010-08-04 Controlling an electronic device using chiplets

Publications (3)

Publication Number Publication Date
JP2013502620A JP2013502620A (ja) 2013-01-24
JP2013502620A5 JP2013502620A5 (enExample) 2013-03-07
JP5437489B2 true JP5437489B2 (ja) 2014-03-12

Family

ID=43027602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012526800A Active JP5437489B2 (ja) 2009-08-24 2010-08-04 電子装置

Country Status (7)

Country Link
US (1) US8183765B2 (enExample)
EP (1) EP2471099A2 (enExample)
JP (1) JP5437489B2 (enExample)
KR (1) KR101233691B1 (enExample)
CN (1) CN102484120A (enExample)
TW (1) TWI383479B (enExample)
WO (1) WO2011028354A2 (enExample)

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JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
US9165989B2 (en) * 2009-09-16 2015-10-20 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8391018B2 (en) * 2009-09-28 2013-03-05 Qualcomm Incorporated Semiconductor die-based packaging interconnect
WO2015064961A1 (ko) * 2013-10-29 2015-05-07 삼성에스디아이 주식회사 이방성 도전 필름 및 이를 이용한 반도체 장치
JPWO2015145886A1 (ja) * 2014-03-25 2017-04-13 パナソニックＩｐマネジメント株式会社 電極パターンの形成方法及び太陽電池の製造方法
JP6424610B2 (ja) * 2014-04-23 2018-11-21 ソニー株式会社 半導体装置、および製造方法
US9198236B1 (en) 2014-05-07 2015-11-24 Grote Industries, Llc System and method for controlling a multiple-color lighting device
KR102446131B1 (ko) * 2015-11-06 2022-09-23 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법
JP6594246B2 (ja) * 2016-03-31 2019-10-23 株式会社ジャパンディスプレイ 表示装置
US10107860B2 (en) 2016-06-21 2018-10-23 International Business Machines Corporation Bitwise rotating scan section for microelectronic chip testing and diagnostics
KR102623233B1 (ko) * 2017-01-04 2024-01-09 쉬-시엔 셍 디스플레이 장치 및 그 제조방법
US10930631B2 (en) 2017-11-03 2021-02-23 Shih-Hsien Tseng Display apparatus, pixel array and manufacturing method thereof
TWI688802B (zh) * 2017-11-03 2020-03-21 曾世憲 畫素陣列及其製造方法
WO2021037808A2 (en) 2019-08-26 2021-03-04 X-Celeprint Limited Variable stiffness modules
US20240105676A1 (en) * 2019-10-14 2024-03-28 Zero Ec Sa Integrated electronic structure and data communication between components of the structure
JP2020155417A (ja) * 2020-06-24 2020-09-24 パイオニア株式会社 発光装置
WO2024228757A2 (en) * 2023-01-30 2024-11-07 University Of Iowa Research Foundation Cascaded superlattice narrowband led

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Also Published As

Publication number Publication date
WO2011028354A3 (en) 2011-06-30
CN102484120A (zh) 2012-05-30
US8183765B2 (en) 2012-05-22
US20110043105A1 (en) 2011-02-24
EP2471099A2 (en) 2012-07-04
JP2013502620A (ja) 2013-01-24
KR101233691B1 (ko) 2013-02-15
TWI383479B (zh) 2013-01-21
WO2011028354A2 (en) 2011-03-10
TW201117333A (en) 2011-05-16
KR20120052392A (ko) 2012-05-23

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