TWI383479B - 使用晶片載置器控制電子裝置 - Google Patents

使用晶片載置器控制電子裝置 Download PDF

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Publication number
TWI383479B
TWI383479B TW099126934A TW99126934A TWI383479B TW I383479 B TWI383479 B TW I383479B TW 099126934 A TW099126934 A TW 099126934A TW 99126934 A TW99126934 A TW 99126934A TW I383479 B TWI383479 B TW I383479B
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TW
Taiwan
Prior art keywords
wafer carrier
wafer
common substrate
substrate
bottom side
Prior art date
Application number
TW099126934A
Other languages
English (en)
Chinese (zh)
Other versions
TW201117333A (en
Inventor
羅納德Ｓ 寇克
約翰Ｗ 漢蒙
Original Assignee
全球Ｏｌｅｄ科技公司
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Application filed by 全球Ｏｌｅｄ科技公司 filed Critical 全球Ｏｌｅｄ科技公司
Publication of TW201117333A publication Critical patent/TW201117333A/zh
Application granted granted Critical
Publication of TWI383479B publication Critical patent/TWI383479B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/129—Chiplets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/861—Repairing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Facsimile Heads (AREA)
TW099126934A 2009-08-24 2010-08-12 使用晶片載置器控制電子裝置 TWI383479B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/546,118 US8183765B2 (en) 2009-08-24 2009-08-24 Controlling an electronic device using chiplets

Publications (2)

Publication Number Publication Date
TW201117333A TW201117333A (en) 2011-05-16
TWI383479B true TWI383479B (zh) 2013-01-21

Family

ID=43027602

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099126934A TWI383479B (zh) 2009-08-24 2010-08-12 使用晶片載置器控制電子裝置

Country Status (7)

Country Link
US (1) US8183765B2 (enExample)
EP (1) EP2471099A2 (enExample)
JP (1) JP5437489B2 (enExample)
KR (1) KR101233691B1 (enExample)
CN (1) CN102484120A (enExample)
TW (1) TWI383479B (enExample)
WO (1) WO2011028354A2 (enExample)

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JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
US9165989B2 (en) * 2009-09-16 2015-10-20 Semprius, Inc. High-yield fabrication of large-format substrates with distributed, independent control elements
US8391018B2 (en) * 2009-09-28 2013-03-05 Qualcomm Incorporated Semiconductor die-based packaging interconnect
CN105706183B (zh) * 2013-10-29 2018-03-06 三星Sdi株式会社 各向异性导电膜及利用其的半导体装置
WO2015145886A1 (ja) * 2014-03-25 2015-10-01 パナソニックＩｐマネジメント株式会社 電極パターンの形成方法及び太陽電池の製造方法
JP6424610B2 (ja) * 2014-04-23 2018-11-21 ソニー株式会社 半導体装置、および製造方法
US9198236B1 (en) 2014-05-07 2015-11-24 Grote Industries, Llc System and method for controlling a multiple-color lighting device
KR102446131B1 (ko) * 2015-11-06 2022-09-23 삼성디스플레이 주식회사 표시장치 및 이의 제조 방법
JP6594246B2 (ja) * 2016-03-31 2019-10-23 株式会社ジャパンディスプレイ 表示装置
US10107860B2 (en) 2016-06-21 2018-10-23 International Business Machines Corporation Bitwise rotating scan section for microelectronic chip testing and diagnostics
EP3564741B1 (en) * 2017-01-04 2023-11-22 Shih-Hsien Tseng Pixel unit structure
US10930631B2 (en) 2017-11-03 2021-02-23 Shih-Hsien Tseng Display apparatus, pixel array and manufacturing method thereof
TWI688802B (zh) 2017-11-03 2020-03-21 曾世憲 畫素陣列及其製造方法
US12456706B2 (en) 2019-08-26 2025-10-28 X-Celeprint Limited Variable stiffness modules
DE112020004153T5 (de) * 2019-10-14 2022-06-02 Zero Ec Sa Integrierte elektronische struktur und datenkommunikation zwischen komponenten der struktur
JP2020155417A (ja) * 2020-06-24 2020-09-24 パイオニア株式会社 発光装置
WO2024228757A2 (en) * 2023-01-30 2024-11-07 University Of Iowa Research Foundation Cascaded superlattice narrowband led

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US6987355B2 (en) * 2003-06-11 2006-01-17 Eastman Kodak Company Stacked OLED display having improved efficiency
US7169652B2 (en) * 2002-09-26 2007-01-30 Seiko Epson Corporation Method of manufacturing electro-optical device, electro-optical device, transferred chip, transfer origin substrate
US7230594B2 (en) * 2002-12-16 2007-06-12 Eastman Kodak Company Color OLED display with improved power efficiency
US7492377B2 (en) * 2001-05-22 2009-02-17 Chi Mei Optoelectronics Corporation Display devices and driving method therefor

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US7492377B2 (en) * 2001-05-22 2009-02-17 Chi Mei Optoelectronics Corporation Display devices and driving method therefor
US7169652B2 (en) * 2002-09-26 2007-01-30 Seiko Epson Corporation Method of manufacturing electro-optical device, electro-optical device, transferred chip, transfer origin substrate
US7230594B2 (en) * 2002-12-16 2007-06-12 Eastman Kodak Company Color OLED display with improved power efficiency
US6987355B2 (en) * 2003-06-11 2006-01-17 Eastman Kodak Company Stacked OLED display having improved efficiency

Also Published As

Publication number Publication date
EP2471099A2 (en) 2012-07-04
KR20120052392A (ko) 2012-05-23
JP5437489B2 (ja) 2014-03-12
KR101233691B1 (ko) 2013-02-15
US8183765B2 (en) 2012-05-22
CN102484120A (zh) 2012-05-30
WO2011028354A2 (en) 2011-03-10
WO2011028354A3 (en) 2011-06-30
US20110043105A1 (en) 2011-02-24
JP2013502620A (ja) 2013-01-24
TW201117333A (en) 2011-05-16

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