CN102481679B - 保持垫 - Google Patents
保持垫 Download PDFInfo
- Publication number
- CN102481679B CN102481679B CN200980160742.8A CN200980160742A CN102481679B CN 102481679 B CN102481679 B CN 102481679B CN 200980160742 A CN200980160742 A CN 200980160742A CN 102481679 B CN102481679 B CN 102481679B
- Authority
- CN
- China
- Prior art keywords
- foaming
- supporting pad
- thickness direction
- ethyl formate
- maintenance face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009204003A JP5355310B2 (ja) | 2009-09-03 | 2009-09-03 | 保持パッド |
JP2009-204003 | 2009-09-03 | ||
PCT/JP2009/004791 WO2011027411A1 (fr) | 2009-09-03 | 2009-09-24 | Patin de support |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102481679A CN102481679A (zh) | 2012-05-30 |
CN102481679B true CN102481679B (zh) | 2014-06-18 |
Family
ID=43648974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980160742.8A Active CN102481679B (zh) | 2009-09-03 | 2009-09-24 | 保持垫 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5355310B2 (fr) |
KR (1) | KR101588925B1 (fr) |
CN (1) | CN102481679B (fr) |
TW (1) | TWI432287B (fr) |
WO (1) | WO2011027411A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5484145B2 (ja) * | 2010-03-24 | 2014-05-07 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5917236B2 (ja) * | 2012-03-30 | 2016-05-11 | 富士紡ホールディングス株式会社 | 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法 |
JP5854910B2 (ja) * | 2012-03-30 | 2016-02-09 | 富士紡ホールディングス株式会社 | 研磨パッド |
KR101666477B1 (ko) * | 2013-06-04 | 2016-10-14 | 주식회사 엘지화학 | 폴리우레탄 지지 패드의 제조 방법 및 폴리우레탄 지지 패드 |
WO2015046203A1 (fr) * | 2013-09-30 | 2015-04-02 | 富士紡ホールディングス株式会社 | Coussinet de retenue |
JP6279309B2 (ja) * | 2013-12-20 | 2018-02-14 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨用クッション、研磨装置、研磨方法、及び当該研磨方法により研磨された対象物を含む物品 |
KR101527348B1 (ko) * | 2014-03-04 | 2015-06-09 | 대원화성 주식회사 | 내구성이 향상된 유지패드 |
CN105269451A (zh) * | 2014-07-02 | 2016-01-27 | 大元化成株式会社 | 具有高精度的平坦度的保持垫 |
US20210323116A1 (en) * | 2020-04-18 | 2021-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Offset pore poromeric polishing pad |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1711153A (zh) * | 2002-12-26 | 2005-12-21 | Hoya株式会社 | 用于信息记录介质的玻璃衬底及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5840356U (ja) * | 1981-09-10 | 1983-03-16 | 株式会社三興技研 | 研摩加工物の保護具 |
JPH11277407A (ja) * | 1998-03-30 | 1999-10-12 | Sony Corp | 研磨パッド、研磨装置および研磨方法 |
JP2004358588A (ja) * | 2003-06-03 | 2004-12-24 | Unitika Ltd | 研磨パッド及びその製造方法 |
JP2005349502A (ja) * | 2004-06-09 | 2005-12-22 | Nitta Haas Inc | 被研磨加工物保持材 |
JP4455230B2 (ja) * | 2004-08-30 | 2010-04-21 | 富士紡ホールディングス株式会社 | 保持パッド及び保持パッドの製造方法 |
JP2007160474A (ja) * | 2005-12-15 | 2007-06-28 | Nitta Haas Inc | 研磨布およびその製造方法 |
JP5216238B2 (ja) * | 2007-05-21 | 2013-06-19 | 富士紡ホールディングス株式会社 | 保持パッドおよび保持パッドの製造方法 |
-
2009
- 2009-09-03 JP JP2009204003A patent/JP5355310B2/ja active Active
- 2009-09-23 TW TW98132166A patent/TWI432287B/zh active
- 2009-09-24 WO PCT/JP2009/004791 patent/WO2011027411A1/fr active Application Filing
- 2009-09-24 CN CN200980160742.8A patent/CN102481679B/zh active Active
- 2009-09-24 KR KR1020127001320A patent/KR101588925B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1711153A (zh) * | 2002-12-26 | 2005-12-21 | Hoya株式会社 | 用于信息记录介质的玻璃衬底及其制造方法 |
Non-Patent Citations (4)
Title |
---|
JP特开2005-11972A 2005.01.13 |
JP特开2006-62059A 2006.03.09 |
JP特开2007-160474A 2007.06.28 |
JP特开平11-277407A 1999.10.12 |
Also Published As
Publication number | Publication date |
---|---|
TW201109123A (en) | 2011-03-16 |
TWI432287B (zh) | 2014-04-01 |
JP5355310B2 (ja) | 2013-11-27 |
CN102481679A (zh) | 2012-05-30 |
JP2011051074A (ja) | 2011-03-17 |
KR101588925B1 (ko) | 2016-01-26 |
KR20120060812A (ko) | 2012-06-12 |
WO2011027411A1 (fr) | 2011-03-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102481679B (zh) | 保持垫 | |
CN101795817B (zh) | 研磨垫 | |
US7897250B2 (en) | Polishing pad | |
US10201886B2 (en) | Polishing pad and method for manufacturing the same | |
CN102574267B (zh) | 保持垫 | |
JP2007260884A (ja) | 研磨布 | |
JP4948935B2 (ja) | 研磨布 | |
JP5274286B2 (ja) | 研磨パッドの製造方法 | |
JP5873910B2 (ja) | 研磨パッド | |
JP2006062058A (ja) | 仕上げ研磨用研磨布及び研磨布の製造方法 | |
JP5700912B2 (ja) | 研磨パッド | |
JP5632144B2 (ja) | 研磨パッド | |
JP4364291B1 (ja) | 研磨パッド | |
JP2006175576A (ja) | 研磨布 | |
JP2010228075A (ja) | 研磨パッド | |
JP7355511B2 (ja) | 保持パッド | |
JP5502560B2 (ja) | 研磨パッドおよび研磨パッドの製造方法 | |
JP5587636B2 (ja) | 研磨パッド | |
JP5371662B2 (ja) | 保持パッド | |
JP7181140B2 (ja) | 保持パッド | |
JP5587566B2 (ja) | 保持パッド | |
JP5534834B2 (ja) | 保持パッド及び研磨加工方法 | |
JP2010201590A (ja) | 研磨パッド |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |