WO2011027411A1 - Patin de support - Google Patents

Patin de support Download PDF

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Publication number
WO2011027411A1
WO2011027411A1 PCT/JP2009/004791 JP2009004791W WO2011027411A1 WO 2011027411 A1 WO2011027411 A1 WO 2011027411A1 JP 2009004791 W JP2009004791 W JP 2009004791W WO 2011027411 A1 WO2011027411 A1 WO 2011027411A1
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WO
WIPO (PCT)
Prior art keywords
holding
foam
thickness direction
holding pad
foaming
Prior art date
Application number
PCT/JP2009/004791
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English (en)
Japanese (ja)
Inventor
川村佳秀
久米貴宏
佐藤章子
Original Assignee
富士紡ホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 富士紡ホールディングス株式会社 filed Critical 富士紡ホールディングス株式会社
Priority to CN200980160742.8A priority Critical patent/CN102481679B/zh
Priority to KR1020127001320A priority patent/KR101588925B1/ko
Publication of WO2011027411A1 publication Critical patent/WO2011027411A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Definitions

  • the present invention relates to a holding pad, and more particularly, to a holding pad provided with a resin sheet having a holding surface for holding an object to be polished in which a number of vertical foams having a size over the entire thickness are formed by a wet coagulation method.
  • WF semiconductor wafer
  • FPD flat panel display
  • substrate for a hard disk the two are arranged to face each other. Polishing using a polishing machine having two surface plates is performed.
  • WF for semiconductors and glass substrates for FPDs have a higher degree of demand for flatness of their underlying substrates in order to produce highly integrated multilayer wiring without defects and produce high-quality images. It is growing.
  • a polishing pad is mounted on one surface plate of the polishing machine, and the object to be polished is held on the other surface plate so as to face the polishing pad.
  • a polishing slurry containing abrasive particles (abrasive grains) is supplied between the object to be polished and the polishing pad, and a polishing pressure (pressing force) is applied to the object to be polished.
  • a holding pad is usually attached to the surface plate that holds the object to be polished. That is, the holding pad can temporarily hold an object to be polished in the polishing process.
  • a mold may be used for the holding pad in order to suppress lateral displacement of the object to be polished. Whether or not the mold is used differs depending on the type of the object to be polished. For example, a holding pad without a mold is used for polishing a glass substrate for FPD.
  • a holding pad provided with a soft urethane film (resin sheet) having a foamed structure formed by a wet coagulation method is used (for example, see JP-A-2006-62059).
  • a soft urethane film resin sheet
  • foam of almost the entire thickness is formed, so if the foam size is increased for the purpose of improving cushioning properties, it will reach the vicinity of the holding surface for holding the workpiece The foam size increases and the rigidity decreases. If the cushioning property is too low, the stress applied to the workpiece will be uneven due to the polishing pressure, so stress concentrates on the convex portion where the sinking of the workpiece to the holding pad side is large, and this stress concentration portion is excessively polished.
  • the surface (holding surface) of the surface layer (skin layer) formed by the wet coagulation method has smoothness, so that the object to be polished is held substantially flat.
  • the hardness may be non-uniform due to the influence of an adhesive or the like used for bonding two types of sheets.
  • the two types of sheets are peeled off during polishing. At the time of polishing, the object to be polished is usually flattened while being submerged and held in the holding pad.
  • an object of the present invention is to provide a holding pad capable of improving the flatness accuracy of the holding surface and improving the in-plane uniformity of the object to be polished.
  • the present invention provides a holding pad including a resin sheet having a holding surface for holding an object to be polished, in which a number of vertical foams having a size over the entire thickness are formed by a wet coagulation method.
  • the foaming is formed such that the foaming direction from the central part in the thickness direction of the resin sheet to the foaming end part on the holding surface side is uniformly inclined in a certain direction with respect to the thickness direction.
  • the foaming is formed so that the foaming direction from the central part in the thickness direction of the resin sheet to the foaming end part on the holding surface side is uniformly inclined in a constant direction with respect to the thickness direction. Even if density unevenness occurs in the resin sheet sometimes, the stress on the workpiece is equalized over the entire area when compressed during polishing, so the flatness accuracy of the holding surface is increased and the surface of the workpiece is evenly distributed. Can be improved.
  • the central portion in the thickness direction of the resin sheet can be within a range of ⁇ 10% from the center in the thickness direction with respect to the entire thickness.
  • the foaming has a larger diameter from the center in the thickness direction to the foaming end on the back side of the holding surface than the foaming end on the holding surface.
  • the foam may be formed such that the foam formation direction from the central portion in the thickness direction to the foam end portion on the back side of the holding surface is along the thickness direction. In such foaming, the vertical line passing through the center of the hole formed in the cross section parallel to the holding surface in the vicinity of the holding surface crosses the cross section parallel to the back surface in the vicinity of the back surface of the holding surface. It can be located outside the holes formed of the same foam.
  • the elevation angle ⁇ may be formed in the range of 30 to 60 degrees.
  • the resin sheet is formed in a long shape by a wet coagulation method, and the foam formation direction from the central part in the thickness direction to the foam end on the holding surface side is inclined in the longitudinal direction of the resin sheet with respect to the thickness direction. It may be formed so as to. Moreover, you may form so that foaming may follow a thickness direction in the width direction which cross
  • the resin sheet is made of polyurethane resin, and the space between the foams can be formed in a microporous shape.
  • the foam is formed such that the foam formation direction from the central portion in the thickness direction of the resin sheet to the foam end on the holding surface side is uniformly inclined in a constant direction with respect to the thickness direction. Even if density unevenness occurs in the resin sheet during wet coagulation, the stress on the object to be polished is equalized over the entire area when compressed during the polishing process. The effect that internal uniformity can be improved can be acquired.
  • FIG. 2 schematically shows a foaming state in a urethane sheet constituting a holding pad of an embodiment, in which (A) is a cross-sectional view in the thickness direction of the urethane sheet, (B) is an aa cross section of (A), b
  • FIG. 6 is an explanatory diagram schematically showing the positional relationship between the centers of holes formed in the ⁇ b cross section and the cc cross section, respectively. It is explanatory drawing which shows typically the grade of the inclination in the foaming formed in the urethane sheet which comprises the holding pad of embodiment.
  • FIG. 2 schematically shows a foaming state in a urethane sheet constituting a conventional holding pad, where (A) is a cross-sectional view in the thickness direction of the urethane sheet, and (B) is an ll cross section of (A), mm
  • FIG. 6 is an explanatory diagram schematically showing the positional relationship between the centers of holes formed in the cross section and the nn cross section, respectively.
  • the holding pad 10 of the present embodiment includes a urethane sheet 2 as a resin sheet made of polyurethane resin.
  • the urethane sheet 2 is formed by a wet coagulation method and has a holding surface Sh for holding an object to be polished.
  • the urethane sheet 2 has a skin layer 2a in which fine micropores are formed over a thickness of about several ⁇ m in the immediate vicinity of the holding surface Sh. That is, the skin layer 2a has a microporous structure. Inside the skin layer 2 a of the urethane sheet 2, a large number of foams 4 are formed in a substantially uniformly dispersed state. The foam 4 has a size over almost the entire thickness of the urethane sheet 2 and is formed in a conical shape that is vertically long and round in the thickness direction. Since the urethane sheet 2 has the skin layer 2a, the opening of the foam 4 is not formed on the holding surface Sh.
  • the urethane sheet 2 has a continuous foam structure in which the fine pores, foam 4 and fine pores of the skin layer 2a communicate with each other in a mesh pattern, and the foam is formed in a continuous foam shape.
  • the foam 4 includes an upper layer Ph on the holding surface Sh side from the central portion in the thickness direction of the urethane sheet 2 and a back surface of the holding surface Sh from the central portion in the thickness direction, that is, a surface opposite to the holding surface Sh (hereinafter referred to as a back surface Sr). ) Side lower layer Pr and the formation state is different. That is, the foam 4 is formed such that the hole diameter in the lower layer Pr is larger than the hole diameter in the upper layer Ph. The foam 4 is formed such that the foam formation direction to the foam end on the holding surface Sh side in the upper layer Ph is uniformly inclined in a constant direction with respect to the thickness direction, and the back surface Sr in the lower layer Pr.
  • the foam formation direction to the foaming end on the side is formed so as to be along the thickness direction.
  • the foam formation direction of the foam 4 is along the direction inclined with respect to the thickness direction (the direction of arrow A in FIG. 1) in the upper layer portion Ph, and along the thickness direction (the direction of arrow B) in the lower layer Pr. ing.
  • the foam 4 Since the foam 4 is inclined in the upper layer Ph, the vertical line passing through the center of the hole formed by the foam 4 in the cross section parallel to the holding surface Sh in the vicinity of the holding surface Sh is near the back surface Sr.
  • the position intersecting the cross section parallel to the back surface Sr is located outside the hole formed by the same foam 4 in the cross section parallel to the back surface Sr. That is, as shown in FIG.
  • a position about 50 to 100 ⁇ m from the holding surface Sh that is in the vicinity of the holding surface Sh (position of the arrow a), a center position in the thickness direction of the urethane sheet 2 (of the arrow b) Position), and a position in the vicinity of the back surface Sr in the vicinity of the back surface Sr by about 50 to 100 ⁇ m (a position indicated by an arrow c).
  • a hole Ha at the center Ma is formed by the foam 4 in the aa cross section in the vicinity of the holding surface Sh.
  • a hole Hb of the center Mb is formed by the same foam 4 in the bb cross section at the center in the thickness direction of the urethane sheet 2
  • a hole Hc of the center Mc is formed by the same foam 4 in the cc cross section near the back surface Sr. Is done.
  • the center Ma of the hole Ha, the center Mb of the hole Hb, and the center Mc of the hole Hc are not aligned in the thickness direction and are located at a shifted position. That is, the vertical line L passing through the center Ma of the hole Ha intersects the cc cross section at the intersection Q. For this reason, the intersection point Q is located outside the hole Hc.
  • the radius of the hole Hc is Rc and the distance between the center Mc of the hole Hc and the intersection Q is Lc
  • the distance Lc is 2 to 5 times the radius Rc.
  • the degree of inclination of the foam 4 formed on the urethane sheet 2 will be described.
  • the center of the thickness M 1 is centered by the foam 4 on the cross section parallel to the holding surface Sh (refer to the bb cross section in FIG. 2B).
  • a hole will be formed.
  • the elevation angle ⁇ was obtained by taking a non-destructive photograph of an internal cross-section of the urethane sheet 2 using a three-dimensional measurement X-ray CT and positioning the center M1 and the vertex M2 with an image analyzer. Value.
  • the elevation angle ⁇ can be calculated by taking a cross section in the thickness direction along the longitudinal direction during wet film formation with a scanning electron microscope and determining the center M1 and the vertex M2.
  • the holding pad 10 has a double-sided tape 7 for attaching the holding pad 10 to the polishing machine attached to the back surface Sr side of the urethane sheet 2.
  • the double-sided tape 7 has a base material (not shown), and a pressure-sensitive adhesive layer (not shown) such as an acrylic pressure-sensitive adhesive is formed on both sides of the base material.
  • a flexible film such as a film made of polyethylene terephthalate (hereinafter abbreviated as PET) is used.
  • PET polyethylene terephthalate
  • the double-sided tape 7 is bonded to the urethane sheet 2 with an adhesive layer on one side of the base material, and the adhesive layer on the other side (the side opposite to the urethane sheet 2) is covered with the release paper 8 on the surface.
  • the base material of the double-sided tape 7 also serves as the base material of the holding pad 10.
  • the holding pad 10 is manufactured by bonding the urethane sheet 2 formed by the wet coagulation method and the double-sided tape 7 together. That is, a preparation process for preparing a polyurethane resin solution, a polyurethane resin solution applied to a film-forming substrate, a coagulation regeneration process for coagulating the polyurethane resin solution in a coagulation liquid to regenerate the polyurethane resin, and washing the sheet-like polyurethane resin
  • the holding pad 10 is manufactured through a cleaning / drying process for drying and a laminating process for bonding the obtained urethane sheet 2 and the double-sided tape 7 together.
  • a cleaning / drying process for drying
  • a laminating process for bonding the obtained urethane sheet 2 and the double-sided tape 7 together.
  • the polyurethane resin is dissolved by mixing a polyurethane resin, a water-miscible organic solvent capable of dissolving the polyurethane resin, and an additive.
  • the organic solvent include N, N-dimethylformamide (hereinafter abbreviated as DMF) and N, N-dimethylacetamide (DMAc).
  • DMF N-dimethylformamide
  • DMAc N, N-dimethylacetamide
  • the polyurethane resin can be selected from resins such as polyester, polyether and polycarbonate. Considering the formation of the foamed structure described above, a resin solution in which a polyurethane resin is dissolved in DMF at 20% by weight has a viscosity measured at 25 ° C.
  • a B-type rotational viscometer of 3 to 10 Pa ⁇ s. It is desirable to select and use a resin having a range, preferably 3 to 6 Pa ⁇ s.
  • This polyurethane resin is dissolved in DMF so as to be in the range of 10 to 30% by weight, preferably in the range of 15 to 25% by weight. Since the viscosity of the polyurethane resin solution depends on the molecular structure in addition to the concentration and molecular weight of the polyurethane resin to be used, it is important to select the polyurethane resin and set the concentration in consideration of these comprehensively.
  • the polyurethane resin for the holding pad it is preferable to use a resin having a 100% modulus of 20 MPa or less, and more preferably 10 MPa or less.
  • a resin having a 100% modulus of 20 MPa or less it is preferable to use.
  • a pigment such as carbon black, a hydrophilic additive, a hydrophobic additive, or the like is used in order to control the size and amount (number) of foam 4 and the formation of an inclined foam in the upper layer Ph. Can do.
  • various commonly used materials can be used.
  • the resulting solution is degassed under reduced pressure to obtain a polyurethane resin solution.
  • the polyurethane resin solution obtained in the preparation process is applied substantially uniformly in a sheet form to the belt-shaped film forming substrate at a normal temperature by a coating device such as a knife coater.
  • the application thickness (application amount) of the polyurethane resin solution is adjusted by adjusting the gap (clearance) between the knife coater and the film forming substrate.
  • the clearance is adjusted so that the coating thickness is in the range of 0.8 to 1.2 mm.
  • a resin film, a fabric, a nonwoven fabric, or the like can be used.
  • a PET film is used as the film forming substrate.
  • the polyurethane resin solution applied to the film-forming substrate is continuously guided into a coagulating liquid (water-based coagulating liquid) whose main component is water which is a poor solvent for the polyurethane resin.
  • a coagulating liquid water-based coagulating liquid
  • an organic solvent such as DMF or a polar solvent other than DMF may be added to the coagulation liquid.
  • water is used.
  • the temperature of the coagulation liquid is set to 15 to 20 ° C. in this example.
  • the coagulating liquid first, a film is formed at the interface between the polyurethane resin solution and the coagulating liquid, and innumerable micropores constituting the skin layer 2a are formed in the polyurethane resin immediately adjacent to the film.
  • regeneration of the polyurethane resin having a continuous foamed structure proceeds by a cooperative phenomenon of diffusion of DMF in the polyurethane resin solution into the coagulating liquid and penetration of water into the polyurethane resin.
  • the PET film of the film forming substrate does not permeate the coagulation liquid, the substitution of DMF and water occurs on the skin layer 2a side, and the foam 4 having a larger film forming substrate side than the skin layer 2a side is formed. .
  • the foam formation associated with the regeneration of the polyurethane resin will be described. Since the cohesive force of the polyurethane resin is increased, the regeneration proceeds rapidly in the polyurethane resin immediately adjacent to the film, and the skin layer 2a is formed. In this example, only water is used as the coagulation liquid, and the temperature of the coagulation liquid is set to a relatively low temperature of 15 to 20 ° C. For this reason, since the polyurethane resin solution rapidly solidifies at the portion in contact with water and the dense skin layer 2a is formed on the surface, mutual diffusion between water and DMF is suppressed. On the other hand, since the concentration of the polyurethane resin is adjusted in the range of 10 to 30% by weight, the coagulation speed becomes slow.
  • the amount of water penetrating into the polyurethane resin solution is reduced, and regeneration of the polyurethane resin proceeds slowly. Further, the viscosity of the polyurethane resin solution is adjusted to a range of 3 to 10 Pa ⁇ s. For this reason, the foaming 4 in the upper layer Ph seems to be inclined by increasing the difference in viscosity between the skin layer 2a side to be regenerated first in the coagulation liquid and the incompletely regenerated film forming substrate side. Will be formed. Further, by removing the DMF from the polyurethane resin solution, that is, by replacing DMF with water, the skin layer 2a, foam 4 and micropores are formed, and the skin layer 2a is microporous, foamed 4 and microporous. Communicate with.
  • the polyurethane resin solution applied to the film forming substrate is continuously guided into the coagulating liquid.
  • the conveyance speed of the polyurethane resin solution in the coagulation liquid is set to 5 to 10 m / min. Since this conveyance speed is faster than the conventional conveyance speed (about 1 to 2 m / min), as shown in FIG. 4A, the foam 4 is formed in the traveling direction of the film-forming substrate (see FIG. 4A). 4 (A) in the direction of the arrow).
  • the foam 4 in the upper layer Ph is a polyurethane in which the foam formation direction to the foam end on the skin layer 2a side is the longitudinal direction of the film forming substrate with respect to the thickness direction, that is, the polyurethane regenerated on the film forming substrate. It is formed so as to be inclined in the longitudinal direction of the resin. As shown in FIG. 4B, the foam 4 is formed along the vertical direction, that is, the thickness direction when viewed from the cross section in the width direction intersecting the longitudinal direction of the polyurethane resin. In other words, the foam 4 is formed so as to uniformly incline in a certain direction with respect to the thickness direction in the upper layer Ph, and is formed along the thickness direction in the lower layer Pr. Since the polyurethane resin is regenerated on the film forming substrate, the opening of the foam 4 is not formed on the back surface Sr formed in contact with the surface of the film forming substrate.
  • the polyurethane resin regenerated in the regeneration step is washed in a washing solution such as water to remove DMF remaining in the polyurethane resin, and then dried.
  • a cylinder dryer provided with a cylinder having a heat source is used for drying the polyurethane resin.
  • the polyurethane resin is dried by passing along the peripheral surface of the cylinder.
  • the obtained urethane sheet 2 is wound up into a roll.
  • the urethane sheet 2 produced by the wet coagulation method and the double-sided tape 7 are bonded together.
  • the back surface Sr of the urethane sheet 2 and the double-sided tape 7 are bonded together.
  • an inspection is performed to confirm that there is no adhesion of scratches, dirt, foreign matter, etc., and the holding pad 10 is completed.
  • a foamed structure of a urethane sheet formed by a conventional wet coagulation method will be described.
  • a polyurethane resin solution applied on a film forming substrate such as a PET film coagulates in a coagulation liquid such as water. Therefore, as shown in FIG. 5, in the urethane sheet 12 constituting the conventional holding pad 20, a large number of foams 14 over the entire thickness of the urethane sheet 12 are formed inside the skin layer 12 a formed at the initial stage during wet coagulation. Is formed.
  • the foam 14 has a holding surface Sh side that is reduced in diameter from the back surface Sr side, and is formed in a vertical direction along the thickness direction.
  • a hole Ha of the center Ma is formed by the foaming 14 in the l-l cross section near the holding surface Sh.
  • the hole Hb of the center Mb is formed by the same foam 14 in the mm cross section of the central portion in the thickness direction of the urethane sheet 12
  • the hole Hc of the center Mc is formed by the same foam 14 in the nn cross section near the back surface Sr. Is done.
  • the center Ma of the hole Ha, the center Mb of the hole Hb, and the center Mc of the hole Hc are positioned so as to be substantially aligned in the thickness direction. That is, the vertical line L passing through the center Ma of the hole Ha intersects the nn cross section at the intersection Q. For this reason, the intersection point Q is located inside the hole Hc.
  • the polishing allowance differs between the outer edge portion and the central portion, and so-called edge drooping may occur.
  • holding the object to be polished by the holding pad 20 for polishing may impair the flatness of the processed surface. Therefore, the conventional holding pad 20 satisfies the high-precision flatness required for a semiconductor WF or FPD glass substrate for the purpose of producing a high-density image with no defects and producing a high-quality image. Is not enough.
  • the foam 4 formed on the urethane sheet 2 is formed so as to uniformly incline in a certain direction with respect to the thickness direction in the upper layer Ph, and has a thickness in the lower layer Pr. It is formed along the direction. For this reason, even if density unevenness occurs in the urethane sheet 2 during wet coagulation, the stress on the object to be polished can be equalized when compressed during polishing. This is presumably because the position of the foam 4 is shifted on the holding surface Sh side with respect to the formation position of the lower layer Pr.
  • the plurality of foams 4 formed close to each other on the lower layer Pr side with respect to the compressive force received on the holding surface Sh expand and contract comprehensively, so that the object to be polished can be obtained without revealing density unevenness. This is thought to be because the stress unevenness to be applied could be reduced. Accordingly, since the flatness accuracy of the holding surface is improved and the stress on the object to be polished is equalized, the in-plane uniformity of the object to be polished can be improved and highly smoothed.
  • the holding pad itself is deformed in an oblique cross section due to the compressive force at the time of polishing, and stress on the object to be polished is caused. It becomes difficult to equalize.
  • the foam 4 is not formed with a uniform inclination in a certain direction but is formed with a random inclination, even if the foam 4 is enlarged in the lower layer Pr, the stress unevenness may increase.
  • the foam 4 is formed so as to be uniformly inclined in a certain direction, the stress unevenness can be reduced and the flatness of the object to be polished can be improved.
  • the elevation angle ⁇ when the vertex M2 is viewed from the center M1 in a right triangle having a hypothetical line segment connecting the center M1 and the vertex M2 in the foam 4 is in the range of 30 to 60 degrees, that is, tan ⁇ .
  • the foam 4 is formed so that is in the range of 0.58 to 1.73.
  • the foam 4 is formed so that the elevation angle ⁇ is in the range of 40 to 55 degrees, that is, the tan ⁇ is in the range of 0.84 to 1.43. Preferably it is formed.
  • the foam 4 is formed such that the hole diameter in the lower layer Pr is larger than the hole diameter in the upper layer Ph. For this reason, cushioning properties can be ensured when a polishing pressure is applied during polishing. Further, since the foam 4 is formed so as to be inclined at the upper layer Ph, the polishing pressure applied to the object to be polished is equalized, and the sinking of the object to be polished toward the holding pad 10 can be suppressed. For this reason, when the sinking is increased, the holding pad itself is ground, whereas the holding pad 20 itself can be prevented from being ground. Thereby, the flatness of the workpiece can be improved while ensuring the flatness of the holding surface Sh.
  • the urethane sheet 2 constituting the holding pad 20 is made of polyurethane resin, but the present invention is not limited to this.
  • the holding pad 20 may be provided with a resin sheet, and may have a cushioning property or appropriate hardness in order to hold an object to be polished.
  • the resin sheet polyester or polyethylene may be used instead of polyurethane resin.
  • a sheet having a foam structure formed by a wet coagulation method is preferable.
  • the thickness ratio between the upper layer Ph and the lower layer Pr is changed by changing the conditions in the wet coagulation method, for example, the concentration and temperature of the polyurethane resin solution, the conveyance speed in the coagulation liquid, and the like. Can do. That is, the thickness direction central portion of the urethane sheet 2 can be changed within a range of ⁇ 10% from the thickness direction center with respect to the entire thickness of the urethane sheet 2. In consideration of securing cushioning properties during polishing and reducing stress unevenness with respect to the object to be polished, it is preferable that the boundary between the upper layer Ph and the lower layer Pr is located substantially at the center in the thickness direction of the urethane sheet 2.
  • the double-sided tape 7 having a PET film as a base material and having a pressure-sensitive adhesive layer formed on both sides of the base material is exemplified, but the present invention is limited to the material of the base material and the pressure-sensitive adhesive. It is not something.
  • the urethane sheet 2 may be provided.
  • the base material of the double-sided tape 7 serves as the base material of the holding pad 10 in the present embodiment, the present invention is not limited to this, and between the urethane sheet 2 and the double-sided tape 7. Another support material may be bonded together.
  • Such a support material is not particularly limited, and examples thereof include a film made of PET, a nonwoven fabric, and the like. Furthermore, specific examples of the solvent of the polyurethane resin solution, the film forming substrate, the coagulating liquid, and the like have been shown. However, the present invention is not limited to these, and naturally used materials may be used. .
  • the holding surface Sh and the back surface Sr are parallel to each other. It is preferable to smooth the Sr side by a method such as buffing or slicing. In this way, the flatness of the holding surface Sh can be further improved.
  • Example 1 In Example 1, a polyester MDI (diphenylmethane diisocyanate) polyurethane resin was used for the production of the urethane sheet 2, and 45 parts of DMF and carbon black as a pigment were added to 100 parts of a solution dissolved in DMF at a ratio of 20% by weight. A polyurethane resin solution was prepared by adding and mixing 40 parts of a DMF dispersion containing 20% by weight. The viscosity of the obtained polyurethane resin solution was 3.4 Pa ⁇ s. This viscosity was measured with a rotational viscometer (Toki Sangyo Co., Ltd., TVB-10 type). It is a value measured under a temperature environment of 25 ° C. using an M3 rotor.
  • a rotational viscometer Toki Sangyo Co., Ltd., TVB-10 type
  • the clearance of the coating device was set to 1.0 mm.
  • the polyurethane resin solution was continuously guided to water (coagulating liquid) at a temperature of 20 ° C.
  • the conveyance speed (line speed) of the polyurethane resin solution was set to 7 m / min, and the polyurethane resin was completely regenerated.
  • buffing was performed on the back surface Sr side of the obtained urethane sheet 2, and the double-sided tape 7 was bonded to the buff surface to manufacture the holding pad 10.
  • Example 2 a urethane sheet 2 was produced in the same manner as in Example 1 except that the line speed of the polyurethane resin solution was set to 5 m / min, and a holding pad 10 was produced.
  • the viscosity of the polyurethane resin solution used was 3.2 Pa ⁇ s.
  • Comparative Example 1 In Comparative Example 1, the urethane sheet 12 was prepared in the same manner as in Example 1 except that the polyester MDI polyurethane resin was dissolved in DMF at a ratio of 30% by weight and the line speed in the coagulation liquid was set to 1.5 m / min. The produced holding pad 20 was manufactured. The viscosity of the polyurethane resin solution was 8.2 Pa ⁇ s. That is, the holding pad 20 of Comparative Example 1 is a conventional holding pad (see also FIG. 5).
  • the internal structure was visualized non-destructively with a three-dimensional measurement X-ray CT apparatus, and the formation state of foam was compared. That is, scanning was performed using a three-dimensional measurement X-ray CT apparatus (manufactured by Yamato Kagaku, TDM1000-IS / SP), and continuous tomographic images at 10 ⁇ m intervals were obtained from the holding surface Sh.
  • the obtained tomographic image was taken into SEM image analysis software “Scandium” (manufactured by Olympus Soft-Imaging Solutions), and each cross-section of one foam 4 (foam 14 in Comparative Example 1; the same applies hereinafter) of interest.
  • the foam center (center of gravity) of the image was determined.
  • two cross sections are obtained.
  • a distance y between was obtained.
  • a distance x between the center M1 and the intersection point P was obtained when the intersection point of the straight line in the direction perpendicular to the thickness direction passing through the center M1 and the straight line in the thickness direction passing through the vertex M2 was defined as P (see also FIG. 3). ).
  • a glass substrate for liquid crystal display (470 mm ⁇ 370 mm ⁇ 0.7 mm) was polished under the following polishing conditions using the holding pads of each Example and Comparative Example, and Japanese Industrial Standard (JIS B 0601: '82))
  • the flatness a was obtained from the filtered wave center waviness.
  • a surface roughness shape measuring machine manufactured by Tokyo Seimitsu Co., Ltd., Surfcom 480A was used, and measurement was performed under the following measurement conditions.
  • the width W between the adjacent convex part (peak part) and the convex part and the height S between the convex part and the concave part (valley part) are calculated.
  • Example 1 and Example 2 When the flatness a by polishing using the holding pad 10 of Example 1 and Example 2 and the holding pad 20 of Comparative Example 1 is compared, 0.0004 is obtained in Example 1 and Example 2 after 30 minutes of polishing time. 0.0006 and Comparative Example 1 showed 0.0012. That is, in Example 1 and Example 2, the final flatness a could be improved as compared with Comparative Example 1. Therefore, the urethane sheet formed by the wet coagulation method is formed such that the foam 4 is uniformly inclined in a certain direction with respect to the thickness direction in the upper layer Ph, and is formed in the thickness direction in the lower layer Pr. It was revealed that the use of the holding pad 10 with 2 can improve the flatness accuracy of the holding surface and improve the in-plane uniformity of the object to be polished.
  • the present invention provides a holding pad that can improve the flatness accuracy of the holding surface and improve the in-plane uniformity of the object to be polished, it contributes to the manufacture and sale of the holding pad. Have potential.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention porte sur un patin de support qui possède une face de support ayant une précision de planéité supérieure et qui peut améliorer l'uniformité dans le plan d'un objet qu'il s'agit de polir. Le patin de support (10) comprend une feuille d'uréthane (2) formée par le procédé de solidification à l'état humide et ayant une face de support (Sh). La feuille d'uréthane (2) dispose d’une couche de peau (2a) formée intérieurement et elle comporte de nombreuses cellules (4) formées sur le côté intérieur de la couche de peau (2a). Les cellules (4) ont une dimension telle que les cellules (4) s'étendent sur presque toute l'épaisseur de la feuille d'uréthane (2). Chaque cellule (4) a été formée de manière telle que, dans une couche inférieure (Pr) de la feuille d'uréthane (2) son diamètre soit plus grand que dans une couche supérieure (Ph) de la feuille (2). Les cellules (4) ont été formées de manière telle que la direction de la formation des cellules dans la couche supérieure (Ph) soit uniformément inclinée dans une certaine direction par rapport à la direction de l'épaisseur et que la direction de la formation des cellules dans la couche inférieure (Pr) soit la même que la direction de l'épaisseur. Lorsque le patin (10) est comprimé au cours du polissage, une contrainte est imposée uniformément à l'objet qui est poli.
PCT/JP2009/004791 2009-09-03 2009-09-24 Patin de support WO2011027411A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200980160742.8A CN102481679B (zh) 2009-09-03 2009-09-24 保持垫
KR1020127001320A KR101588925B1 (ko) 2009-09-03 2009-09-24 유지 패드

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-204003 2009-09-03
JP2009204003A JP5355310B2 (ja) 2009-09-03 2009-09-03 保持パッド

Publications (1)

Publication Number Publication Date
WO2011027411A1 true WO2011027411A1 (fr) 2011-03-10

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PCT/JP2009/004791 WO2011027411A1 (fr) 2009-09-03 2009-09-24 Patin de support

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JP (1) JP5355310B2 (fr)
KR (1) KR101588925B1 (fr)
CN (1) CN102481679B (fr)
TW (1) TWI432287B (fr)
WO (1) WO2011027411A1 (fr)

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CN105829022A (zh) * 2013-12-20 2016-08-03 3M创新有限公司 抛光垫、抛光设备、抛光方法以及包括用该抛光方法抛光的物体的制品

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JP5484145B2 (ja) * 2010-03-24 2014-05-07 東洋ゴム工業株式会社 研磨パッド
JP5917236B2 (ja) * 2012-03-30 2016-05-11 富士紡ホールディングス株式会社 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法
JP5854910B2 (ja) * 2012-03-30 2016-02-09 富士紡ホールディングス株式会社 研磨パッド
KR101666477B1 (ko) * 2013-06-04 2016-10-14 주식회사 엘지화학 폴리우레탄 지지 패드의 제조 방법 및 폴리우레탄 지지 패드
WO2015046203A1 (fr) * 2013-09-30 2015-04-02 富士紡ホールディングス株式会社 Coussinet de retenue
KR101527348B1 (ko) * 2014-03-04 2015-06-09 대원화성 주식회사 내구성이 향상된 유지패드
CN105269451A (zh) * 2014-07-02 2016-01-27 大元化成株式会社 具有高精度的平坦度的保持垫
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad

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JP4455230B2 (ja) 2004-08-30 2010-04-21 富士紡ホールディングス株式会社 保持パッド及び保持パッドの製造方法
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CN105829022B (zh) * 2013-12-20 2019-05-28 3M创新有限公司 抛光垫、抛光设备、抛光方法以及包括用该抛光方法抛光的物体的制品

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JP2011051074A (ja) 2011-03-17
CN102481679B (zh) 2014-06-18
TW201109123A (en) 2011-03-16
TWI432287B (zh) 2014-04-01
JP5355310B2 (ja) 2013-11-27
KR101588925B1 (ko) 2016-01-26
KR20120060812A (ko) 2012-06-12
CN102481679A (zh) 2012-05-30

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