TWI432287B - Keep the pad - Google Patents

Keep the pad Download PDF

Info

Publication number
TWI432287B
TWI432287B TW98132166A TW98132166A TWI432287B TW I432287 B TWI432287 B TW I432287B TW 98132166 A TW98132166 A TW 98132166A TW 98132166 A TW98132166 A TW 98132166A TW I432287 B TWI432287 B TW I432287B
Authority
TW
Taiwan
Prior art keywords
foaming
holding
thickness direction
center
holding surface
Prior art date
Application number
TW98132166A
Other languages
English (en)
Chinese (zh)
Other versions
TW201109123A (en
Inventor
Yoshihide Kawamura
Takahiro Kume
Ayako Sato
Original Assignee
Fujibo Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujibo Holdings Inc filed Critical Fujibo Holdings Inc
Publication of TW201109123A publication Critical patent/TW201109123A/zh
Application granted granted Critical
Publication of TWI432287B publication Critical patent/TWI432287B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
TW98132166A 2009-09-03 2009-09-23 Keep the pad TWI432287B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009204003A JP5355310B2 (ja) 2009-09-03 2009-09-03 保持パッド

Publications (2)

Publication Number Publication Date
TW201109123A TW201109123A (en) 2011-03-16
TWI432287B true TWI432287B (zh) 2014-04-01

Family

ID=43648974

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98132166A TWI432287B (zh) 2009-09-03 2009-09-23 Keep the pad

Country Status (5)

Country Link
JP (1) JP5355310B2 (fr)
KR (1) KR101588925B1 (fr)
CN (1) CN102481679B (fr)
TW (1) TWI432287B (fr)
WO (1) WO2011027411A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5484145B2 (ja) * 2010-03-24 2014-05-07 東洋ゴム工業株式会社 研磨パッド
JP5917236B2 (ja) * 2012-03-30 2016-05-11 富士紡ホールディングス株式会社 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法
JP5854910B2 (ja) * 2012-03-30 2016-02-09 富士紡ホールディングス株式会社 研磨パッド
KR101666477B1 (ko) * 2013-06-04 2016-10-14 주식회사 엘지화학 폴리우레탄 지지 패드의 제조 방법 및 폴리우레탄 지지 패드
WO2015046203A1 (fr) * 2013-09-30 2015-04-02 富士紡ホールディングス株式会社 Coussinet de retenue
JP6279309B2 (ja) * 2013-12-20 2018-02-14 スリーエム イノベイティブ プロパティズ カンパニー 研磨用クッション、研磨装置、研磨方法、及び当該研磨方法により研磨された対象物を含む物品
KR101527348B1 (ko) * 2014-03-04 2015-06-09 대원화성 주식회사 내구성이 향상된 유지패드
CN105269451A (zh) * 2014-07-02 2016-01-27 大元化成株式会社 具有高精度的平坦度的保持垫
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840356U (ja) * 1981-09-10 1983-03-16 株式会社三興技研 研摩加工物の保護具
JPH11277407A (ja) * 1998-03-30 1999-10-12 Sony Corp 研磨パッド、研磨装置および研磨方法
JP4189384B2 (ja) * 2002-12-26 2008-12-03 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法と研磨装置
JP2004358588A (ja) * 2003-06-03 2004-12-24 Unitika Ltd 研磨パッド及びその製造方法
JP2005349502A (ja) * 2004-06-09 2005-12-22 Nitta Haas Inc 被研磨加工物保持材
JP4455230B2 (ja) * 2004-08-30 2010-04-21 富士紡ホールディングス株式会社 保持パッド及び保持パッドの製造方法
JP2007160474A (ja) * 2005-12-15 2007-06-28 Nitta Haas Inc 研磨布およびその製造方法
JP5216238B2 (ja) * 2007-05-21 2013-06-19 富士紡ホールディングス株式会社 保持パッドおよび保持パッドの製造方法

Also Published As

Publication number Publication date
CN102481679B (zh) 2014-06-18
TW201109123A (en) 2011-03-16
JP5355310B2 (ja) 2013-11-27
CN102481679A (zh) 2012-05-30
JP2011051074A (ja) 2011-03-17
KR101588925B1 (ko) 2016-01-26
KR20120060812A (ko) 2012-06-12
WO2011027411A1 (fr) 2011-03-10

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