CN102365730A - 对源极/漏极延伸区、晕环袋和栅极电介质厚度具有不同组态的类极性场效应晶体管的结构和制造 - Google Patents
对源极/漏极延伸区、晕环袋和栅极电介质厚度具有不同组态的类极性场效应晶体管的结构和制造 Download PDFInfo
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- H10D30/0221—Manufacture or treatment of FETs having insulated gates [IGFET] having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended-drain MOSFETs [EDMOS]
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- H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
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- H10D62/235—Channel regions of field-effect devices of FETs of IGFETs
- H10D62/299—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
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- H10D62/357—Substrate regions of field-effect devices of FETs
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- H10D84/85—Complementary IGFETs, e.g. CMOS
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- H10P30/225—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of a molecular ion, e.g. decaborane
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/382,971 | 2009-03-27 | ||
| US12/382,971 US8084827B2 (en) | 2009-03-27 | 2009-03-27 | Structure and fabrication of like-polarity field-effect transistors having different configurations of source/drain extensions, halo pockets, and gate dielectric thicknesses |
| PCT/US2010/000898 WO2010110902A1 (en) | 2009-03-27 | 2010-03-25 | Structure and fabrication of like-polarity field-effect transistors having different configurations of source/drain extensions, halo pockets, and gate dielectric thicknesses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102365730A true CN102365730A (zh) | 2012-02-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010800138539A Pending CN102365730A (zh) | 2009-03-27 | 2010-03-25 | 对源极/漏极延伸区、晕环袋和栅极电介质厚度具有不同组态的类极性场效应晶体管的结构和制造 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8084827B2 (https=) |
| EP (1) | EP2412016A4 (https=) |
| JP (1) | JP2012522369A (https=) |
| KR (1) | KR20110133622A (https=) |
| CN (1) | CN102365730A (https=) |
| TW (1) | TW201101463A (https=) |
| WO (1) | WO2010110902A1 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470290A (zh) * | 2014-09-30 | 2016-04-06 | 英飞凌科技股份有限公司 | 软开关半导体器件及其生产方法 |
| CN112309982A (zh) * | 2019-07-31 | 2021-02-02 | 意法半导体(鲁塞)公司 | 包括限定mosfet晶体管的有效沟道长度的操作的制造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8482076B2 (en) | 2009-09-16 | 2013-07-09 | International Business Machines Corporation | Method and structure for differential silicide and recessed or raised source/drain to improve field effect transistor |
| US20110291193A1 (en) * | 2010-05-27 | 2011-12-01 | International Business Machines Corporation | High density butted junction cmos inverter, and making and layout of same |
| JP6043193B2 (ja) * | 2013-01-28 | 2016-12-14 | 株式会社東芝 | トンネルトランジスタ |
| KR102180554B1 (ko) | 2013-12-04 | 2020-11-19 | 삼성디스플레이 주식회사 | 박막 트랜지스터 및 이의 제조 방법 |
| CN109980009B (zh) * | 2017-12-28 | 2020-11-03 | 无锡华润上华科技有限公司 | 一种半导体器件的制造方法和集成半导体器件 |
| CN109980010B (zh) * | 2017-12-28 | 2020-10-13 | 无锡华润上华科技有限公司 | 一种半导体器件的制造方法和集成半导体器件 |
| US11455452B2 (en) * | 2019-09-23 | 2022-09-27 | Texas Instruments Incorporated | Variable implant and wafer-level feed-forward for dopant dose optimization |
| CN111785777B (zh) * | 2020-06-28 | 2023-10-20 | 上海华虹宏力半导体制造有限公司 | 高压cmos器件及其制造方法 |
| US20260090079A1 (en) * | 2024-09-23 | 2026-03-26 | Apple Inc. | Low Noise Stacked Field Effect Transistor Design |
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| CN101142687A (zh) * | 2005-04-01 | 2008-03-12 | 半导体元件工业有限责任公司 | 具有改进性能的半导体器件及方法 |
| US20080311717A1 (en) * | 2005-08-29 | 2008-12-18 | Constantin Bulucea | Fabrication of semiconductor architecture having field-effect transistors especially suitable for analog applications |
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2010
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- 2010-03-25 WO PCT/US2010/000898 patent/WO2010110902A1/en not_active Ceased
- 2010-03-25 EP EP10756493.2A patent/EP2412016A4/en not_active Withdrawn
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- 2010-03-25 CN CN2010800138539A patent/CN102365730A/zh active Pending
- 2010-03-25 KR KR1020117025429A patent/KR20110133622A/ko not_active Withdrawn
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2011
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| CN105470290A (zh) * | 2014-09-30 | 2016-04-06 | 英飞凌科技股份有限公司 | 软开关半导体器件及其生产方法 |
| CN112309982A (zh) * | 2019-07-31 | 2021-02-02 | 意法半导体(鲁塞)公司 | 包括限定mosfet晶体管的有效沟道长度的操作的制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2412016A1 (en) | 2012-02-01 |
| US8084827B2 (en) | 2011-12-27 |
| US8377768B2 (en) | 2013-02-19 |
| KR20110133622A (ko) | 2011-12-13 |
| TW201101463A (en) | 2011-01-01 |
| US20100244149A1 (en) | 2010-09-30 |
| JP2012522369A (ja) | 2012-09-20 |
| WO2010110902A1 (en) | 2010-09-30 |
| US20120264263A1 (en) | 2012-10-18 |
| EP2412016A4 (en) | 2014-03-19 |
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