KR20110133622A - 소스/드레인 확장부들, 할로 포켓들, 및 게이트 유전체 두께의 상이한 구성들을 갖는 유사-극성 전계-효과 트랜지스터들의 구조 및 제조 - Google Patents
소스/드레인 확장부들, 할로 포켓들, 및 게이트 유전체 두께의 상이한 구성들을 갖는 유사-극성 전계-효과 트랜지스터들의 구조 및 제조 Download PDFInfo
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- KR20110133622A KR20110133622A KR1020117025429A KR20117025429A KR20110133622A KR 20110133622 A KR20110133622 A KR 20110133622A KR 1020117025429 A KR1020117025429 A KR 1020117025429A KR 20117025429 A KR20117025429 A KR 20117025429A KR 20110133622 A KR20110133622 A KR 20110133622A
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- H10D30/0221—Manufacture or treatment of FETs having insulated gates [IGFET] having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended-drain MOSFETs [EDMOS]
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- H10D30/603—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs having asymmetry in the channel direction, e.g. lateral high-voltage MISFETs having drain offset region or extended drain IGFETs [EDMOS]
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- H10D62/299—Channel regions of field-effect devices of FETs of IGFETs having lateral doping variations
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- H10D62/357—Substrate regions of field-effect devices of FETs
- H10D62/364—Substrate regions of field-effect devices of FETs of IGFETs
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- H10D84/85—Complementary IGFETs, e.g. CMOS
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Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/382,971 | 2009-03-27 | ||
| US12/382,971 US8084827B2 (en) | 2009-03-27 | 2009-03-27 | Structure and fabrication of like-polarity field-effect transistors having different configurations of source/drain extensions, halo pockets, and gate dielectric thicknesses |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20110133622A true KR20110133622A (ko) | 2011-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117025429A Withdrawn KR20110133622A (ko) | 2009-03-27 | 2010-03-25 | 소스/드레인 확장부들, 할로 포켓들, 및 게이트 유전체 두께의 상이한 구성들을 갖는 유사-극성 전계-효과 트랜지스터들의 구조 및 제조 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8084827B2 (https=) |
| EP (1) | EP2412016A4 (https=) |
| JP (1) | JP2012522369A (https=) |
| KR (1) | KR20110133622A (https=) |
| CN (1) | CN102365730A (https=) |
| TW (1) | TW201101463A (https=) |
| WO (1) | WO2010110902A1 (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9263590B2 (en) | 2013-12-04 | 2016-02-16 | Samsung Display Co., Ltd. | Thin film transistor and manufacturing method thereof |
| KR20200095541A (ko) * | 2017-12-28 | 2020-08-10 | 씨에스엠씨 테크놀로지스 에프에이비2 코., 엘티디. | 반도체 디바이스의 제조 방법 및 집적 반도체 디바이스 |
| KR20200095539A (ko) * | 2017-12-28 | 2020-08-10 | 씨에스엠씨 테크놀로지스 에프에이비2 코., 엘티디. | 반도체 디바이스의 제조 방법 및 집적 반도체 디바이스 |
| WO2026064765A1 (en) * | 2024-09-23 | 2026-03-26 | Apple Inc. | Low noise stacked field effect transistor design |
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| US8482076B2 (en) | 2009-09-16 | 2013-07-09 | International Business Machines Corporation | Method and structure for differential silicide and recessed or raised source/drain to improve field effect transistor |
| US20110291193A1 (en) * | 2010-05-27 | 2011-12-01 | International Business Machines Corporation | High density butted junction cmos inverter, and making and layout of same |
| JP6043193B2 (ja) * | 2013-01-28 | 2016-12-14 | 株式会社東芝 | トンネルトランジスタ |
| US9324783B2 (en) * | 2014-09-30 | 2016-04-26 | Infineon Technologies Ag | Soft switching semiconductor device and method for producing thereof |
| FR3099638A1 (fr) * | 2019-07-31 | 2021-02-05 | Stmicroelectronics (Rousset) Sas | Procédé de fabrication comprenant une définition d’une longueur effective de canal de transistors MOSFET |
| US11455452B2 (en) * | 2019-09-23 | 2022-09-27 | Texas Instruments Incorporated | Variable implant and wafer-level feed-forward for dopant dose optimization |
| CN111785777B (zh) * | 2020-06-28 | 2023-10-20 | 上海华虹宏力半导体制造有限公司 | 高压cmos器件及其制造方法 |
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| JP3905098B2 (ja) * | 2004-07-02 | 2007-04-18 | 旭化成マイクロシステム株式会社 | 半導体装置の製造方法 |
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| US7397084B2 (en) * | 2005-04-01 | 2008-07-08 | Semiconductor Components Industries, L.L.C. | Semiconductor device having enhanced performance and method |
| US7838369B2 (en) | 2005-08-29 | 2010-11-23 | National Semiconductor Corporation | Fabrication of semiconductor architecture having field-effect transistors especially suitable for analog applications |
| US7419863B1 (en) | 2005-08-29 | 2008-09-02 | National Semiconductor Corporation | Fabrication of semiconductor structure in which complementary field-effect transistors each have hypoabrupt body dopant distribution below at least one source/drain zone |
| US7642574B2 (en) | 2005-08-29 | 2010-01-05 | National Semiconductor Corporation | Semiconductor architecture having field-effect transistors especially suitable for analog applications |
| JP4832069B2 (ja) * | 2005-12-06 | 2011-12-07 | パナソニック株式会社 | 半導体装置及びその製造方法 |
| US7468305B2 (en) * | 2006-05-01 | 2008-12-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Forming pocket and LDD regions using separate masks |
| JP2009004444A (ja) * | 2007-06-19 | 2009-01-08 | Panasonic Corp | 半導体装置及びその製造方法 |
| JP4970185B2 (ja) * | 2007-07-30 | 2012-07-04 | 株式会社東芝 | 半導体装置及びその製造方法 |
| TWI426564B (zh) * | 2007-10-31 | 2014-02-11 | 國家半導體公司 | 特別適合類比應用之具有場效電晶體的半導體架構之構造與製造 |
| JP2008147693A (ja) * | 2008-01-28 | 2008-06-26 | Fujitsu Ltd | 半導体装置の製造方法 |
-
2009
- 2009-03-27 US US12/382,971 patent/US8084827B2/en active Active
-
2010
- 2010-03-24 TW TW099108624A patent/TW201101463A/zh unknown
- 2010-03-25 WO PCT/US2010/000898 patent/WO2010110902A1/en not_active Ceased
- 2010-03-25 EP EP10756493.2A patent/EP2412016A4/en not_active Withdrawn
- 2010-03-25 JP JP2012502017A patent/JP2012522369A/ja active Pending
- 2010-03-25 CN CN2010800138539A patent/CN102365730A/zh active Pending
- 2010-03-25 KR KR1020117025429A patent/KR20110133622A/ko not_active Withdrawn
-
2011
- 2011-11-09 US US13/293,096 patent/US8377768B2/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9263590B2 (en) | 2013-12-04 | 2016-02-16 | Samsung Display Co., Ltd. | Thin film transistor and manufacturing method thereof |
| KR20200095541A (ko) * | 2017-12-28 | 2020-08-10 | 씨에스엠씨 테크놀로지스 에프에이비2 코., 엘티디. | 반도체 디바이스의 제조 방법 및 집적 반도체 디바이스 |
| KR20200095539A (ko) * | 2017-12-28 | 2020-08-10 | 씨에스엠씨 테크놀로지스 에프에이비2 코., 엘티디. | 반도체 디바이스의 제조 방법 및 집적 반도체 디바이스 |
| US11257720B2 (en) | 2017-12-28 | 2022-02-22 | Csmc Technologies Fab2 Co., Ltd. | Manufacturing method for semiconductor device and integrated semiconductor device |
| WO2026064765A1 (en) * | 2024-09-23 | 2026-03-26 | Apple Inc. | Low noise stacked field effect transistor design |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2412016A1 (en) | 2012-02-01 |
| US8084827B2 (en) | 2011-12-27 |
| CN102365730A (zh) | 2012-02-29 |
| US8377768B2 (en) | 2013-02-19 |
| TW201101463A (en) | 2011-01-01 |
| US20100244149A1 (en) | 2010-09-30 |
| JP2012522369A (ja) | 2012-09-20 |
| WO2010110902A1 (en) | 2010-09-30 |
| US20120264263A1 (en) | 2012-10-18 |
| EP2412016A4 (en) | 2014-03-19 |
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