CN102286675B - 电气、电子部件用铜合金材料及其制造方法 - Google Patents

电气、电子部件用铜合金材料及其制造方法 Download PDF

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Publication number
CN102286675B
CN102286675B CN201110053297.4A CN201110053297A CN102286675B CN 102286675 B CN102286675 B CN 102286675B CN 201110053297 A CN201110053297 A CN 201110053297A CN 102286675 B CN102286675 B CN 102286675B
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copper alloy
precipitate
quality
content
comparative example
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CN102286675A (zh
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山本佳纪
萩原登
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Hitachi Metals Neomaterial Ltd
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SH Copper Products Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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CN201110053297.4A 2010-06-18 2011-03-03 电气、电子部件用铜合金材料及其制造方法 Active CN102286675B (zh)

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JP2010139249A JP5539055B2 (ja) 2010-06-18 2010-06-18 電気・電子部品用銅合金材、及びその製造方法
JP2010-139249 2010-06-18

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CN102286675A CN102286675A (zh) 2011-12-21
CN102286675B true CN102286675B (zh) 2015-07-01

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5303678B1 (ja) * 2012-01-06 2013-10-02 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金薄板、電子・電気機器用導電部品および端子
JP2013185232A (ja) * 2012-03-09 2013-09-19 Hitachi Cable Ltd 銅合金材及び銅合金材の製造方法
JP2013231224A (ja) * 2012-05-01 2013-11-14 Sh Copper Products Co Ltd 曲げ加工性に優れた電気・電子部品用銅合金材
JP5475914B1 (ja) * 2012-09-28 2014-04-16 Ｊｘ日鉱日石金属株式会社 放熱性及び繰り返し曲げ加工性に優れた銅合金板
CN103667774B (zh) * 2013-11-27 2016-08-17 余姚市士森铜材厂 一种铜合金半导体引线框架的制备方法
CN103667770B (zh) * 2013-11-27 2015-11-11 余姚市士森铜材厂 一种沉淀硬化型铜合金
JP5688178B1 (ja) 2014-06-27 2015-03-25 株式会社Ｓｈカッパープロダクツ 銅合金材、銅合金材の製造方法、リードフレームおよびコネクタ
JP2016014165A (ja) 2014-07-01 2016-01-28 株式会社Ｓｈカッパープロダクツ 銅合金材、銅合金材の製造方法、リードフレームおよびコネクタ
JP6081513B2 (ja) * 2015-03-30 2017-02-15 株式会社神戸製鋼所 放熱部品用銅合金板
KR101775894B1 (ko) * 2015-07-10 2017-09-12 주식회사 네패스 투명 발열 필름 및 이의 제조 방법
CN105063418B (zh) * 2015-07-24 2017-04-26 宁波金田铜业(集团)股份有限公司 一种低合金化铜带的制备方法
KR20210020869A (ko) * 2018-06-20 2021-02-24 후루카와 덴키 고교 가부시키가이샤 저항기용 저항 재료 및 그 제조 방법 및 저항기
CN113502408B (zh) * 2021-06-17 2022-06-07 四川科派新材料有限公司 一种含碲镍的高导铜合金及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1498978A (zh) * 2002-10-31 2004-05-26 日矿金属株式会社 易加工高强度高电导性铜合金
CN1932057A (zh) * 2005-09-13 2007-03-21 本田技研工业株式会社 粒子分散铜合金及其生产方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01139736A (ja) * 1987-11-25 1989-06-01 Yazaki Corp 銅合金
JP3900733B2 (ja) * 1999-02-25 2007-04-04 日立電線株式会社 高強度・高導電性銅合金材の製造方法
JP5098096B2 (ja) * 2005-03-22 2012-12-12 Ｄｏｗａメタルテック株式会社 銅合金、端子又はバスバー及び銅合金の製造方法
JP4662834B2 (ja) * 2005-10-12 2011-03-30 Ｊｘ日鉱日石金属株式会社 回路用銅又は銅合金箔
JP4916154B2 (ja) * 2005-10-12 2012-04-11 Ｊｘ日鉱日石金属株式会社 回路用銅又は銅合金箔
JP5320638B2 (ja) * 2008-01-08 2013-10-23 株式会社Ｓｈカッパープロダクツ 圧延銅箔およびその製造方法
JP2009287062A (ja) * 2008-05-28 2009-12-10 Hitachi Cable Ltd バッキングプレート用銅合金とその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1498978A (zh) * 2002-10-31 2004-05-26 日矿金属株式会社 易加工高强度高电导性铜合金
CN1932057A (zh) * 2005-09-13 2007-03-21 本田技研工业株式会社 粒子分散铜合金及其生产方法

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JP5539055B2 (ja) 2014-07-02
CN102286675A (zh) 2011-12-21
JP2012001781A (ja) 2012-01-05

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Effective date of registration: 20210415

Address after: Osaka Japan

Patentee after: NEOMAX MAT Co.,Ltd.

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Patentee before: SH Copper Co.,Ltd.