CN102254874A - 半导体模块、半导体模块的制造方法以及便携式设备 - Google Patents

半导体模块、半导体模块的制造方法以及便携式设备 Download PDF

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Publication number
CN102254874A
CN102254874A CN2011101894506A CN201110189450A CN102254874A CN 102254874 A CN102254874 A CN 102254874A CN 2011101894506 A CN2011101894506 A CN 2011101894506A CN 201110189450 A CN201110189450 A CN 201110189450A CN 102254874 A CN102254874 A CN 102254874A
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CN
China
Prior art keywords
jut
semiconductor module
electrode
wiring pattern
insulating barrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011101894506A
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English (en)
Chinese (zh)
Inventor
柳瀬康行
冈山芳央
柴田清司
井上恭典
水原秀树
臼井良辅
山本哲也
吉井益良男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of CN102254874A publication Critical patent/CN102254874A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0236—Shape of the insulating layers therebetween
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CN2011101894506A 2007-01-31 2008-01-31 半导体模块、半导体模块的制造方法以及便携式设备 Pending CN102254874A (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP020540/07 2007-01-31
JP2007020540 2007-01-31
JP2007090375 2007-03-30
JP090375/07 2007-03-30
JP013191/08 2008-01-23
JP2008013191A JP5118982B2 (ja) 2007-01-31 2008-01-23 半導体モジュールおよびその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN2008101428105A Division CN101312169B (zh) 2007-01-31 2008-01-31 半导体模块、半导体模块的制造方法以及便携式设备

Publications (1)

Publication Number Publication Date
CN102254874A true CN102254874A (zh) 2011-11-23

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ID=40055300

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2011101894506A Pending CN102254874A (zh) 2007-01-31 2008-01-31 半导体模块、半导体模块的制造方法以及便携式设备
CN2008101428105A Active CN101312169B (zh) 2007-01-31 2008-01-31 半导体模块、半导体模块的制造方法以及便携式设备

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Country Status (2)

Country Link
JP (1) JP5118982B2 (enrdf_load_stackoverflow)
CN (2) CN102254874A (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4972633B2 (ja) * 2008-12-11 2012-07-11 日東電工株式会社 半導体装置の製造方法
JP2010199148A (ja) * 2009-02-23 2010-09-09 Fujikura Ltd 半導体センサデバイス及びその製造方法、パッケージ及びその製造方法、モジュール及びその製造方法、並びに電子機器
JP2010238996A (ja) * 2009-03-31 2010-10-21 Sanyo Electric Co Ltd 半導体モジュールの製造方法
WO2011136363A1 (ja) * 2010-04-28 2011-11-03 三洋電機株式会社 回路装置の製造方法
JP5607994B2 (ja) * 2010-06-15 2014-10-15 ルネサスエレクトロニクス株式会社 半導体集積回路装置およびその製造方法
GB2525774A (en) * 2013-02-28 2015-11-04 Murata Manufacturing Co Semiconductor device
JP5796692B2 (ja) 2013-02-28 2015-10-21 株式会社村田製作所 Ｅｓｄ保護デバイス
JP6102398B2 (ja) * 2013-03-26 2017-03-29 セイコーエプソン株式会社 半導体装置
CN205452284U (zh) 2013-04-05 2016-08-10 株式会社村田制作所 Esd保护器件
CN106252315B (zh) * 2015-06-13 2019-07-02 中芯国际集成电路制造(上海)有限公司 封装结构及其制造方法
CN110537251B (zh) * 2017-04-25 2023-07-04 三菱电机株式会社 半导体装置
JP7088224B2 (ja) * 2019-03-19 2022-06-21 株式会社デンソー 半導体モジュールおよびこれに用いられる半導体装置
KR102727977B1 (ko) * 2019-11-14 2024-11-07 현대자동차주식회사 전력모듈에 적용되는 기판 구조
CN113078149B (zh) * 2021-03-12 2023-11-10 上海易卜半导体有限公司 半导体封装结构、方法、器件和电子产品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001223287A (ja) * 2000-02-07 2001-08-17 Mitsui High Tec Inc インターポーザーの製造方法
JP2004207324A (ja) * 2002-12-24 2004-07-22 Fujikura Ltd 半導体装置とその製造方法及び電子装置
CN1189939C (zh) * 2001-03-19 2005-02-16 卡西欧计算机株式会社 半导体器件及其制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002170839A (ja) * 2000-11-30 2002-06-14 Nec Corp 半導体装置とその製造方法及び半導体装置の実装構造とその実装方法
JP2002313992A (ja) * 2001-04-16 2002-10-25 Sharp Corp 半導体装置およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001223287A (ja) * 2000-02-07 2001-08-17 Mitsui High Tec Inc インターポーザーの製造方法
CN1189939C (zh) * 2001-03-19 2005-02-16 卡西欧计算机株式会社 半导体器件及其制造方法
JP2004207324A (ja) * 2002-12-24 2004-07-22 Fujikura Ltd 半導体装置とその製造方法及び電子装置

Also Published As

Publication number Publication date
CN101312169B (zh) 2011-12-28
CN101312169A (zh) 2008-11-26
JP2008277742A (ja) 2008-11-13
JP5118982B2 (ja) 2013-01-16

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Application publication date: 20111123