CN102244025B - 被处理体的输送方法和被处理体的输送装置 - Google Patents

被处理体的输送方法和被处理体的输送装置 Download PDF

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Publication number
CN102244025B
CN102244025B CN201110120235.0A CN201110120235A CN102244025B CN 102244025 B CN102244025 B CN 102244025B CN 201110120235 A CN201110120235 A CN 201110120235A CN 102244025 B CN102244025 B CN 102244025B
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CN102244025A (zh
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远洞征树
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201110120235.0A 2010-05-11 2011-05-10 被处理体的输送方法和被处理体的输送装置 Active CN102244025B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-109712 2010-05-11
JP2010109712A JP5452349B2 (ja) 2010-05-11 2010-05-11 被処理体の搬送方法、被処理体の搬送装置、及び、プログラム

Publications (2)

Publication Number Publication Date
CN102244025A CN102244025A (zh) 2011-11-16
CN102244025B true CN102244025B (zh) 2016-01-20

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CN201110120235.0A Active CN102244025B (zh) 2010-05-11 2011-05-10 被处理体的输送方法和被处理体的输送装置

Country Status (5)

Country Link
US (1) US20110278205A1 (https=)
JP (1) JP5452349B2 (https=)
KR (1) KR101510498B1 (https=)
CN (1) CN102244025B (https=)
TW (1) TWI533391B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5921200B2 (ja) * 2012-01-05 2016-05-24 株式会社日立国際電気 基板処理装置、基板処理方法、半導体装置の製造方法、縮退運用プログラムおよび生産リストの作成プログラム
DE102012100929A1 (de) 2012-02-06 2013-08-08 Roth & Rau Ag Substratbearbeitungsanlage
CN105807732B (zh) * 2014-12-31 2018-11-06 北京北方华创微电子装备有限公司 半导体工艺控制方法及半导体工艺控制系统
CN107507788B (zh) * 2017-07-21 2019-11-08 志圣科技（广州）有限公司 晶圆加工机及其加工处理方法
CN109976100B (zh) * 2017-12-28 2021-12-07 长鑫存储技术有限公司 光刻系统及其光刻方法
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
CN110783236B (zh) * 2019-11-12 2023-06-16 北京北方华创微电子装备有限公司 腔室离线控制方法及系统
JP7682711B2 (ja) * 2021-06-16 2025-05-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置およびプログラム
CN114843181B (zh) * 2022-07-06 2022-09-16 华海清科股份有限公司 控制方法、晶圆倒传方法、后处理装置和晶圆加工设备
CN116884901B (zh) * 2023-09-08 2023-12-22 四川明泰微电子有限公司 一种引线框架自动下料设备
CN119281666A (zh) * 2024-09-30 2025-01-10 苏州天准科技股份有限公司 一种硅片筛选输送装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101979A (en) * 1988-07-08 1992-04-07 Hitachi, Ltd. Paper sheet depositing and dispensing apparatus, abnormality recovery process of the paper sheet depositing and dispensing apparatus, and automatic cashier
US6914233B2 (en) * 2001-12-12 2005-07-05 Shinko Electric Co., Ltd. Wafer mapping system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6102164A (en) * 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
US7313262B2 (en) * 2003-08-06 2007-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for visualization of process chamber conditions
KR100923263B1 (ko) * 2003-09-25 2009-10-23 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 디바이스의 제조 방법 및 기판의 이동 적재 방법
DE102006015686C5 (de) * 2006-03-27 2013-05-29 Thieme Gmbh & Co. Kg Verfahren zum Transportieren von Druckgut und Drucktisch für Flachbettdruckmaschine
JP4863985B2 (ja) * 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101979A (en) * 1988-07-08 1992-04-07 Hitachi, Ltd. Paper sheet depositing and dispensing apparatus, abnormality recovery process of the paper sheet depositing and dispensing apparatus, and automatic cashier
US6914233B2 (en) * 2001-12-12 2005-07-05 Shinko Electric Co., Ltd. Wafer mapping system

Also Published As

Publication number Publication date
US20110278205A1 (en) 2011-11-17
JP2011238808A (ja) 2011-11-24
KR101510498B1 (ko) 2015-04-08
TWI533391B (zh) 2016-05-11
TW201203436A (en) 2012-01-16
JP5452349B2 (ja) 2014-03-26
CN102244025A (zh) 2011-11-16
KR20110124712A (ko) 2011-11-17

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