TWI533391B - 待處理物之運送方法與設備及用來儲存程式之電腦可讀取儲存媒體 - Google Patents

待處理物之運送方法與設備及用來儲存程式之電腦可讀取儲存媒體 Download PDF

Info

Publication number
TWI533391B
TWI533391B TW100115601A TW100115601A TWI533391B TW I533391 B TWI533391 B TW I533391B TW 100115601 A TW100115601 A TW 100115601A TW 100115601 A TW100115601 A TW 100115601A TW I533391 B TWI533391 B TW I533391B
Authority
TW
Taiwan
Prior art keywords
abnormality
detected
transport
automatic
semiconductor wafer
Prior art date
Application number
TW100115601A
Other languages
English (en)
Chinese (zh)
Other versions
TW201203436A (en
Inventor
遠洞征樹
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW201203436A publication Critical patent/TW201203436A/zh
Application granted granted Critical
Publication of TWI533391B publication Critical patent/TWI533391B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW100115601A 2010-05-11 2011-05-04 待處理物之運送方法與設備及用來儲存程式之電腦可讀取儲存媒體 TWI533391B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010109712A JP5452349B2 (ja) 2010-05-11 2010-05-11 被処理体の搬送方法、被処理体の搬送装置、及び、プログラム

Publications (2)

Publication Number Publication Date
TW201203436A TW201203436A (en) 2012-01-16
TWI533391B true TWI533391B (zh) 2016-05-11

Family

ID=44910816

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100115601A TWI533391B (zh) 2010-05-11 2011-05-04 待處理物之運送方法與設備及用來儲存程式之電腦可讀取儲存媒體

Country Status (5)

Country Link
US (1) US20110278205A1 (https=)
JP (1) JP5452349B2 (https=)
KR (1) KR101510498B1 (https=)
CN (1) CN102244025B (https=)
TW (1) TWI533391B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5921200B2 (ja) * 2012-01-05 2016-05-24 株式会社日立国際電気 基板処理装置、基板処理方法、半導体装置の製造方法、縮退運用プログラムおよび生産リストの作成プログラム
DE102012100929A1 (de) 2012-02-06 2013-08-08 Roth & Rau Ag Substratbearbeitungsanlage
CN105807732B (zh) * 2014-12-31 2018-11-06 北京北方华创微电子装备有限公司 半导体工艺控制方法及半导体工艺控制系统
CN107507788B (zh) * 2017-07-21 2019-11-08 志圣科技（广州）有限公司 晶圆加工机及其加工处理方法
CN109976100B (zh) * 2017-12-28 2021-12-07 长鑫存储技术有限公司 光刻系统及其光刻方法
JP7246256B2 (ja) * 2019-05-29 2023-03-27 東京エレクトロン株式会社 搬送方法及び搬送システム
CN110783236B (zh) * 2019-11-12 2023-06-16 北京北方华创微电子装备有限公司 腔室离线控制方法及系统
JP7682711B2 (ja) * 2021-06-16 2025-05-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法、基板処理装置およびプログラム
CN114843181B (zh) * 2022-07-06 2022-09-16 华海清科股份有限公司 控制方法、晶圆倒传方法、后处理装置和晶圆加工设备
CN116884901B (zh) * 2023-09-08 2023-12-22 四川明泰微电子有限公司 一种引线框架自动下料设备
CN119281666A (zh) * 2024-09-30 2025-01-10 苏州天准科技股份有限公司 一种硅片筛选输送装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5101979A (en) * 1988-07-08 1992-04-07 Hitachi, Ltd. Paper sheet depositing and dispensing apparatus, abnormality recovery process of the paper sheet depositing and dispensing apparatus, and automatic cashier
US6102164A (en) * 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
US6914233B2 (en) * 2001-12-12 2005-07-05 Shinko Electric Co., Ltd. Wafer mapping system
US7313262B2 (en) * 2003-08-06 2007-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for visualization of process chamber conditions
KR100923263B1 (ko) * 2003-09-25 2009-10-23 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치, 반도체 디바이스의 제조 방법 및 기판의 이동 적재 방법
DE102006015686C5 (de) * 2006-03-27 2013-05-29 Thieme Gmbh & Co. Kg Verfahren zum Transportieren von Druckgut und Drucktisch für Flachbettdruckmaschine
JP4863985B2 (ja) * 2007-12-20 2012-01-25 大日本スクリーン製造株式会社 基板処理装置

Also Published As

Publication number Publication date
US20110278205A1 (en) 2011-11-17
JP2011238808A (ja) 2011-11-24
KR101510498B1 (ko) 2015-04-08
CN102244025B (zh) 2016-01-20
TW201203436A (en) 2012-01-16
JP5452349B2 (ja) 2014-03-26
CN102244025A (zh) 2011-11-16
KR20110124712A (ko) 2011-11-17

Similar Documents

Publication Publication Date Title
TWI533391B (zh) 待處理物之運送方法與設備及用來儲存程式之電腦可讀取儲存媒體
US9960065B2 (en) Substrate processing apparatus for managing transfer state of substrate gas storage container based on supply flow rate
US9437465B2 (en) Substrate processing apparatus and method of manufacturing semiconductor device
JP5131094B2 (ja) 熱処理装置及び熱処理方法並びに記憶媒体
JP5224744B2 (ja) 基板処理装置
US11869785B2 (en) Method of manufacturing semiconductor device and non-transitory computer-readable recording medium
CN102903657B (zh) 热处理装置及朝该热处理装置输送基板的基板输送方法
US8352069B2 (en) Substrate processing apparatus and display method for substrate processing apparatus
US9966289B2 (en) Substrate processing apparatus, method for manufacturing semiconductor device, and non-transitory computer-readable recording medium
TWI427446B (zh) 基板處理系統、群管理裝置、群管理裝置的異常檢測方法、群管理裝置的顯示方法
KR101690229B1 (ko) 기판 반송 방법, 기판 반송 장치 및 기억 매체
TW201438128A (zh) 真空處理裝置的運轉方法
JP4503088B2 (ja) 基板処理装置及び基板処理装置の表示方法
JP2017050372A (ja) 基板処理装置及び基板搬送方法並びに基板搬送プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP2005175083A (ja) 基板処理装置および基板処理方法
KR101743780B1 (ko) 기판 처리 장치, 기판 처리 방법 및 기억 매체
JP4486692B2 (ja) 基板処理装置
WO2018154829A1 (ja) 基板処理装置、半導体装置の製造方法及びプログラム
JP4734185B2 (ja) 基板処理装置及び基板処理装置の制御方法
JP4415006B2 (ja) カセットの運用管理方法及び基板の処理方法
JP2011171648A (ja) 基板処理システム
JP2010225617A (ja) 基板処理システム
JP2008078351A (ja) 基板処理システム
JP2012104700A (ja) 基板処理システム
JP2011023589A (ja) 基板処理システム