CN102224587A - 引线框、使用该引线框的半导体装置、该半导体装置的中间产品以及它们的制造方法 - Google Patents

引线框、使用该引线框的半导体装置、该半导体装置的中间产品以及它们的制造方法 Download PDF

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CN102224587A
CN102224587A CN200980146480XA CN200980146480A CN102224587A CN 102224587 A CN102224587 A CN 102224587A CN 200980146480X A CN200980146480X A CN 200980146480XA CN 200980146480 A CN200980146480 A CN 200980146480A CN 102224587 A CN102224587 A CN 102224587A
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terminal
lead frame
column
resin
distortion
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清水孝司
八河博昭
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Mitsui High Tec Inc
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Abstract

本发明公开了一种用于半导体装置(10)的引线框,其包括具有由树脂密封的一端部的多个端子(13)。每个端子(13)的要被树脂密封的部分(16)由五棱柱或多棱柱,或者具有至少一个形成在外周表面上并在垂直方向上延伸的切口或槽的不规则棱柱构成。通过蚀刻或压制来形成由树脂密封的部分(16),并且通过蚀刻来形成用作每个端子(13)的下半部的露出部分(18)。

Description

引线框、使用该引线框的半导体装置、该半导体装置的中间产品以及它们的制造方法
技术领域
本发明涉及一种在半导体装置中使用的用于提高与密封树脂的密合性的引线框、使用该引线框的半导体装置、该半导体装置的中间产品以及该引线框、该半导体装置和该中间产品的制造方法。
背景技术
专利文献1公开了这样一种方法,其中利用贵金属来对形成板状引线框材料的表面的接合端子等的区域电镀并且形成抗蚀膜,并且进行从正面侧到厚度的大约二分之一的蚀刻(第一次蚀刻)并安装半导体元件,然后进行线接合并且在保留引线框材料的背面半部的情况下利用树脂来密封引线框材料,并且从背面侧有选择地进行蚀刻(第二次蚀刻)并切掉邻接的端子,从而制造了半导体装置。
现有技术文献
专利文献
专利文献1:日本专利JP-A-2001-24135
由上述专利文献1所描述的方法制造的半导体装置特征在于形成了与板状引线框材料分离的端子。每个端子都与密封树脂固定在一起,并且端子与密封树脂之间的密合性的强度取决于该端子与该密封树脂之间的接触面积。端子的剖面通常具有圆形或者四边形。然而,由于近年来对于半导体装置高密度化和小型化的需要,当组装件或引线框的厚度变薄或者托起高度(从密封树脂的底面到安装基底的表面的距离)增大时,树脂与端子之间的密合性降低,使得确保不了端子强度并且端子脱落,因而存在半导体装置的可靠性降低的问题。
发明内容
发明要解决的问题
针对这种情况已经执行了本发明,并且本发明的目的是提供一种能够通过提高端子与密封树脂之间的密合性而获得具有高度可靠性的半导体装置的引线框、使用该引线框的该半导体装置,该半导体装置的中间产品,以及该引线框、半导体装置和中间产品的制造方法。
为了解决上述目的,本发明提供如下。
(1)一种用于半导体装置的引线框,包括多个端子,每个该端子都具有树脂密封部分,其中至少该端子的所述树脂密封部分具有多边形柱状或变形柱状,该多边形柱状是五边或五边以上,该变形柱状具有至少一个在周缘垂直延伸的切口或槽部。
(2)在(1)所述的引线框中,整个所述树脂密封部分都具有所述多边形柱状或者所述变形柱状。
(3)在(1)所述的引线框中,由树脂密封的所述多个端子具有两种或两种以上不同形状的多边形柱状或变形柱状的端子。
(4)在(1)的引线框中,所述端子在所述树脂密封部分以及没有被树脂密封的部分中具有不同的横截面形状。
(5)一种具有(1)所述的引线框的半导体装置的中间产品。这里,半导体装置的中间产品是指在制造作为最终产品的半导体装置的情况的过程中所产生的产品。例如,所述中间产品是指:本应向背面侧突出的端子没有分离,并且为了在最终处理中利用事先形成的抗蚀膜使背面侧的板部分离而需要进行蚀刻等的产品。
(6)一种具有(1)所述的引线框的半导体装置。
(7)一种引线框的制造方法,包括多个端子,每个该端子都具有树脂密封部分,至少所述端子的所述树脂密封部分具有多边形柱状或者变形柱状,该多边形柱状是五边形或更多边形,该边形柱状具有至少一个在周缘垂直延伸的切口或槽部,所述方法的特征在于,通过蚀刻处理或者压制处理来形成具有多边形柱状或变形柱状的各端子。
(8)在(7)所述的引线框的制造方法中,整个所述树脂密封部分都具有所述多边形柱状或者所述变形柱状。
(9)在(7)所述的引线框的制造方法中,由树脂密封的所述多个端子具有两种或多种不同形状的多边形柱状或变形柱状的端子。
(10)一种半导体装置的中间产品的制造方法,包括:上侧端子形成步骤,用于在引线框材料的上侧上形成具有多边形柱状或变形柱状的上侧端子,该多边形柱状是五边形或更多边形,该变形柱状在周缘具有至少一个垂直延伸的切口或槽部;以及中间产品形成步骤,用于将半导体元件安装在所述引线框材料的元件安装部上,并且通过接合线将所述上侧端子连结于所述半导体元件的电极,然后利用树脂来密封所述半导体元件、所述接合线和所述上侧端子而制造中间产品。
(11)一种半导体元件的制造方法,包括:上侧端子形成步骤,用于在引线框材料的上侧上形成具有多边形柱状或变形柱状上侧端子,该多边形柱状是五边形或更多边形,该变形柱状在周缘具有至少一个垂直延伸的切口或槽部;中间产品形成步骤,用于将半导体元件安装在所述引线框材料的元件安装部上,并且通过接合线将所述上侧端子连结于所述半导体元件的电极,然后利用树脂来密封所述半导体元件、所述接合线和所述上侧端子而制造中间产品;以及端子分离步骤,用于使所述中间产品的下侧端子分离。
发明的效果
在根据本发明的引线框、使用该引线框的半导体装置、该半导体装置的中间产品以及制造该引线框、该半导体装置和该中间产品的方法中,端子的树脂密封部分具有五边形或更多边形的多边形柱状或者在周边包含至少一个垂直延伸的切口或槽部的变形柱状,使得能够增加端子与树脂之间的接触面积。因此,即使当组装件或引线框的厚度变薄或者托起高度增加时,也能够确保端子的强度并且能够防止端子脱落。结果,能够提高作为产品的半导体装置的可靠性。
而且,通过改变蚀刻或压制的图案而无需改变传统结构方法或步骤流程就能够实施本发明,并且能够提高端子的接合强度而不会对安装可靠性产生不利影响。
此外,在某些情况下,特别地,通过改变每个独立端子的形状就能够局部提高与密封树脂的密合性较差的区域的接合强度。此外,端子的形状相互不同,使得便于在线接合的情况下的半导体装置的图像识别并且能够防止配线的错误。
附图说明
图1是根据本发明的第一实施例的半导体装置的前剖面图。
图2(A)是同一半导体装置的端子的透视图,而图2(B)是端子的修改实例的透视图。
图3是根据本发明的第二实施例的半导体装置的前剖面图。
图4是同一半导体装置的端子的透视图。
图5(A)至5(C)是根据本发明的第一和第二实施例的修改实例的半导体装置的端子的树脂密封部分的底视图和透视图。
图6(A)是根据本发明的第三实施例的半导体装置中所使用的引线框的表面视图,并且图6(B)是同一引线框的端子放大平面视图,并且图6(C)是同一引线框的端子的放大透视图,并且图6(D)是同一引线框的拐角部的放大侧视图。
图7是根据本发明的一个实施例的半导体装置的制造方法的步骤说明图。
附图标记说明
10半导体装置
11元件安装部
12半导体元件
13、13’端子
14接合线
15密封树脂
16、16’由树脂密封的部分
18、18’露出部分
19上表面
21、22下表面
23导电粘接剂
25半导体装置
26、27端子
28由树脂密封的部分
29上表面
30露出部分
32由树脂密封的部分
33槽部
34露出部分
36引线框
37端子
38切口
39平板
41引线框材料
42、43图案
44、45耐腐蚀电镀
46盖片
47槽部
48、49凹部(或槽部)
50、51、52由树脂密封的部分
具体实施方式
将参考附图来说明用于具体体现本发明的实施例。
如图1和2所示,根据本发明的第一实施例的半导体装置10包括:在中央的元件安装部11上放置的半导体元件12;排布在半导体元件12周边的多个端子13;用于分别将端子13的表面连结到半导体元件12的电极板的接合线14;以及利用树脂来密封端子13的大致上半部、接合线14和半导体元件12的密封树脂15。
这里,端子13的大致上半部的被密封树脂15包围并且由树脂密封的部分16的形状是六边形柱状的(作为五边形以上的多边形柱状的一个实例),并且大致下半部的露出部分18的形状是圆柱状的。此外,如图2(A)中所示,当通过蚀刻来形成由树脂密封的部分16时,其侧表面也被浸蚀并且垂直方向的中央变得比垂直方向的两端部略细。因此,这里的多边形柱状包括垂直方向的中央变得比垂直方向的两端略细的形状以及完全的多边形柱状。
从而,在根据本发明的第一实施例的端子13中,由树脂密封的部分16具有多边形柱状,使得与密封树脂15接触的面积增大并且使端子13牢固地固定于密封树脂15。
而且,图2(B)示出了根据修改实例的端子13’。该根据修改实例的端子13’具有其中在由树脂密封的部分16’的周缘中形成了由多个垂直延伸的凹部和凸部构成的槽部33的变形柱状。而且在该修改实例中,通过利用蚀刻来形成所述由树脂密封的部分16’,其侧表面也被浸蚀并且垂直方向的中央变得比垂直方向的两端稍细。此外,数字18’是端子13’的圆柱状的露出部分。
此外,在端子13的用作线接合部的上表面(正表面)19上,例如,镀镍层被镀有金(贵金属电镀的一个实例),而且在端子13和元件安装部11的下表面(底表面)21、22上,例如,镀镍层被镀有金(贵金属电镀的一个实例)。而且,在该半导体装置10中,元件安装部11的厚度大约是端子13的厚度的二分之一,并且通过导电粘接剂23来安装半导体元件12。
接下来,将描述图3和4中所示的根据第二实施例的半导体装置25。根据第二实施例的半导体装置25与根据第一实施例的半导体装置10不同之处在于端子26、27在一侧上被排布成四列并且该端子26、27具有不同的形状,因此通过将相同的标号指定给相同的部件而省略详细说明(下文中同样适用)。在该半导体装置25中所使用的端子26的树脂密封部分28具有六边形柱状,并且上表面29的六边形形状与树脂密封部分28的横截面形状相同。即,与第一实施例不同,所述树脂密封部分28具有恒定的粗度。端子27具有其中形成了由垂直延伸的凹部和凸部构成的槽部33的变形柱状。露出部30、34的横截面形状是圆形,并且与第一实施例相同,垂直方向的中央变得比垂直方向的两端略细。
从而,在一个引线框与使用该引线框的半导体装置25中,能够改变端子26、27的树脂密封部分28、32的横截面形状而以多边形柱状或变形柱状来形成具有两种或多种不同形状的端子,并且能够根据使用来改变线接合部的形状。
此外,在端子13、26、27中,树脂密封部分16、28、32的形状不限于上述半导体装置10、25中所示的形状。只要端子13、26、27具有预定的端子高度和预定的端子节距(pitch)并且横截面的周长比圆形或四边形的周长更长,就可以采用任何形状。由于这种构造能够增大端子与树脂之间的接触面积,所以密封树脂15与端子13、26、27之间的密合性提高。优选:如图5(A)所示形成切口或槽部47或者如图5(B)和5(C)所示在周缘形成凹部(或槽部)48、49。此外,在图5中,数字50、51、52仅分别表示树脂密封部分而省略了露出部分。通过这样形成,与密封树脂15的密合性进一步提高。
而且,露出部分18、30、34的横截面形状是圆形,但是本发明不限于圆形,而是可以使用在周缘中具有凹部或凸部的任何形状、卵形、椭圆形、包括三角形或四边形的多边形。
图6示出了在根据第三实施例的半导体装置中使用的引线框36(材料是铜或铜合金)。如图6(A)中所示,在引线框36中,由树脂密封的端子37围绕元件安装部11排布成面积阵列状。如图6(B)和6(C)所示,由树脂密封的端子37具有变形柱状,该变形柱状是通过在具有矩形横截面的端子37的拐角中设置圆弧(四分之一圆)的切口38而形成的。此外,在该实施例中,不形成引线框36的露出部分,使得该引线框36形成为如图6(D)所示的平板39。然后,在将半导体元件12安装在中央的元件安装部11上之后,进行线接合,并且利用树脂来密封半导体元件12、接合线14和端子37而形成了中间产品。而后,进行蚀刻,用于使每个端子从背面侧分离并且完成半导体装置。
接下来,将参考图7来描述使用根据本发明的一个实施例的引线框的半导体装置10的制造方法。如图7(A)所示,准备板状的引线框材料41,并且如图7(B)所示,在引线框材料41的正面和背面上形成端子13的上表面19的图案42以及具有端子13的下表面21和元件安装部11的下表面22的图案43。此外,在该实施例中,为了说明的方便,描述一个半导体装置,但是在一个引线框材料41中,实际上排布了多个半导体装置并且形成为矩阵。
这里,端子13的上表面19的图案的空间部(即,不存在图案的部分)的形状形成为多边(五边或更多边)形而不是圆形或四边形,或者形成为在周缘具有一个或多个切口或槽部的形状(即,形成线接合部的区域)。
下面,如图7(C)中所示,在利用图案42、43进行基底电镀(通常是镀镍层)之后进行耐腐蚀电镀(通常是贵金属)44、45。此外,需要利用贵金属来电镀引线框材料41的背面,只要能够耐受来自背面的腐蚀即可,而且可以利用例如镍电镀或锡电镀来电镀所述背面。因此,所述耐腐蚀电镀44被施行为多边(五边或更多边)形形状或者在周缘具有一个或多个切口或槽部的形状。
然后,如图7(D)所示,去除正面和背面的抗蚀膜并且留下耐腐蚀电镀44、45而使引线框材料41露出。然后,如图7(E)所示,将盖片(抗蚀膜)46粘在引线框材料41的背面上,并且防止引线框材料41的背面被蚀刻溶液浸蚀。
如图7(F)中所示,在引线框材料41的正面侧上进行半蚀刻(第一次蚀刻),并且形成由树脂密封的部分16(端子13的上半部、上侧端子)。然后,如图7(G)所示,去除盖片46。此外,可以在第二次的蚀刻(第二次蚀刻)之前的任意时刻来去除该盖片46。按目前为止的步骤,制造了引线框。
而后,如图7(H)所示,利用导电粘接剂23将半导体元件12安装在通过半蚀刻引线框材料41而形成的元件安装部11的中央上,并且进行半导体元件12的电极板与周边的端子13的上表面19上所形成的线接合部之间的线接合。
然后,如图7(I)所示,利用树脂来密封引线框材料41的上半部,即,端子13的树脂密封部分16、接合线14和半导体元件12。每个端子13都由下半侧的平板来连接,并且形成了本发明的中间产品。
然后,如图7(J)所示,蚀刻引线框材料41的下半部(第二次蚀刻)并且在端子13中形成露出部分18(下侧端子),并且每个端子13被电分离。因此,形成了图1中所示的半导体装置10。
此外,在上述各实施例中,由树脂密封的部分16的全部(即,端子13的树脂密封部分的上端至下端)都具有多边形柱状或变形柱状,并且从密封树脂15露出的部分具有圆柱状,但是包含没有被树脂密封的部分的端子13的全部(从上端到下端)也可以具有多边形柱状或者变形柱状。
而且,在图7(J)的步骤之后,为了保护露出的端子13免受氧化,可以进行树脂涂覆、无电镀等。此外,在各实施例中,通过蚀刻处理来形成端子13的树脂密封部分16,但是也可以通过压制处理来形成。在这种情况下,端子的树脂密封部分如根据第二实施例的半导体装置25中所描述的,具有大致恒定的粗度。
而且,在各实施例中,蚀刻所述元件安装部的上半部,但是各实施例不限于这种形式,而是通过第一次蚀刻,元件安装部不被蚀刻一半并且可以被保留为与端子同样的高度。在这种情况下,元件安装部的周缘也形成为与端子的周缘相同的形状。因此,元件安装部与密封树脂之间的密合性提高并且可靠性进一步提高。
已经参考各特定的实施例详细描述了本发明,但是对于本领域技术人员来说显而易见的是,在不脱离本发明的精神和范围的情况下,可以进行各种改变或修改。
本申请基于2008年11月25日提交的日本专利申请(专利申请No.2008-299726),并且该专利申请的内容通过引用结合于此。
工业实用性
根据本发明的引线框,能够增大端子与树脂之间的面积,使得即使当组装件或引线框的厚度变薄或者托起高度增加时,也能够确保端子的强度并且能够防止端子脱落。结果,能够提高作为产品的半导体装置的可靠性。

Claims (11)

1.一种用于半导体装置的引线框,包括多个端子,每个该端子都具有树脂密封部分,其中,至少所述端子的所述树脂密封部分具有多边形柱状或变形柱状,该多边形柱状为五边形或者五边形以上,该变形柱状具有至少一个在周缘垂直延伸的切口或槽部。
2.根据权利要求1所述的引线框,其中,所述整个树脂密封部分都具有所述多边形柱状或者所述变形柱状。
3.根据权利要求1所述的引线框,其中,由树脂密封的所述多个端子具有两种或两种以上不同形状的多边形柱状或变形柱状的端子。
4.根据权利要求1所述的引线框,其中,所述端子在所述树脂密封部分以及没有被树脂密封的部分中具有不同的横截面形状。
5.一种具有根据权利要求1所述的引线框的半导体装置的中间产品。
6.一种具有根据权利要求1所述的引线框的半导体装置。
7.一种引线框的制造方法,该引线框包括多个端子,每个该端子都具有树脂密封部分,至少所述端子的所述树脂密封部分具有多边形柱状或变形柱状,该多边形柱状为五边形或五边形以上,该变形柱状具有至少一个在周缘垂直延伸的切口或槽部,该方法的特征在于,通过蚀刻处理或者压制处理来形成具有所述多边形柱状或变形柱状的各端子。
8.根据权利要求7所述的引线框的制造方法,其中,整个所述树脂密封部分都具有所述多边形柱状或者变形柱状。
9.根据权利要求7所述的引线框的制造方法,其中,由树脂密封的所述多个端子具有两种或多种不同形状的多边形柱状或变形柱状的端子。
10.一种半导体装置的中间产品的制造方法,包括:上侧端子形成步骤,用于在引线框材料的上侧上形成具有多边形柱状或变形柱状的上侧端子,该多边形柱状为五边形或五边形以上,该变形柱状包含至少一个在周缘垂直延伸的切口或槽部;以及中间产品形成步骤,用于将半导体元件安装在所述引线框材料的元件安装部上,并且通过接合线将所述上侧端子连结于所述半导体元件的电极,然后利用树脂来密封所述半导体元件、所述接合线和所述上侧端子而制造所述中间产品。
11.一种半导体元件的制造方法,包括:上侧端子形成步骤,用于在引线框材料的上侧上形成多边形柱状或变形柱状的上侧端子,该多边形柱状为五边形或五边形以上,该变形柱状具有至少一个在周缘垂直延伸的切口或槽部;中间产品形成步骤,用于将半导体元件安装在所述引线框材料的元件安装部上,并且通过接合线将所述上侧端子连结于所述半导体元件的电极,然后利用树脂来密封所述半导体元件、所述接合线和所述上侧端子而制造中间产品;以及端子分离步骤,用于使所述中间产品的下侧端子分离。
CN200980146480XA 2008-11-25 2009-11-24 引线框、使用该引线框的半导体装置、该半导体装置的中间产品以及它们的制造方法 Pending CN102224587A (zh)

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