CN102144287B - 薄片剥离装置及剥离方法 - Google Patents

薄片剥离装置及剥离方法 Download PDF

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CN102144287B
CN102144287B CN2009801349905A CN200980134990A CN102144287B CN 102144287 B CN102144287 B CN 102144287B CN 2009801349905 A CN2009801349905 A CN 2009801349905A CN 200980134990 A CN200980134990 A CN 200980134990A CN 102144287 B CN102144287 B CN 102144287B
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小林贤治
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Abstract

一种薄片剥离装置(10)，包括：支承机构(11)，对粘附了粘合片(S)的半导体晶片(W)进行支承；抽出机构(12)，将剥离用带(T)抽出；粘附机构(14)，将剥离用带(T)粘附到粘合片(S)上；保持机构(15)，对剥离用带(T)的抽出方向顶端侧进行保持；剥离机构(16)，将剥离力赋给粘合片(S)。剥离机构(16)包含剥离用辊(44)，该剥离用辊(44)在从粘附在粘合片(S)上的剥离用带(T)的粘合剂层侧与粘合片(S)碰接、并将粘合片(S)的剥离端部侧进行折叠而形成折叠部(c)的状态下，将粘合片(S)剥离。

Description

薄片剥离装置及剥离方法
技术领域
本发明涉及一种薄片剥离装置及剥离方法，尤其，本发明涉及一种适用于将粘贴于半导体晶片等被粘接体上的粘合片进行剥离的薄片剥离装置及剥离方法。
背景技术
在半导体晶片(以下简称为“晶片”)上粘附有保护电路面用的粘合片，在进行了晶片的所规定的处理后的阶段，将粘合片从晶片上进行剥离。
作为上述粘合片的剥离装置，已知的结构有：例如，如专利文献1所记载的那样，通过将细长带状的剥离用带粘附到粘合片上，再卷绕该剥离用带，就能够将粘合片剥离。
专利文献1：日本专利特开2005-175253号公报
但是，如图5概要性地显示的那样，在专利文献1记载的薄片剥离装置中，将粘合片S上所粘附的剥离用带T进行卷绕之际，按压辊R在粘合片S上转动。对于粘附着剥离用带T的粘合片S的区域，因剥离用带T张力的传递从而能实现紧贴于按压辊R外周的剥离，但对于从剥离用带T的粘附位置离开了的粘合片S部分，因该粘合片S的拉伸而发生剥离延迟E。一旦产生该剥离延迟E，就无法使粘合片S的剥离端部紧贴在按压辊R的外周面上，且不能够充分地得到一边用按压辊R压住一边将粘合片S从晶片上剥离的剥离效果。
另一方面，如果减弱按压辊R的按压力，就会导致晶片W隆起、该晶片W被割破。
发明内容
本发明正是着眼于这样的问题而研究出来的，其目的在于提供一种在将粘合片剥离之际，不会在剥离端部侧产生剥离延迟，既能防止晶片等被粘接体的割破、又能将粘合片剥离的薄片剥离装置及剥离方法。
为了达到上述目的，本发明的薄片剥离装置采用如下结构，包括：支承机构，对粘附了粘合片的被粘接体进行支承；抽出机构，将用于剥离粘合片的剥离用带抽出；粘附机构，在剥离用带的引导端侧从粘合片的外周向外侧突出的状态下，将剥离用带粘附到粘合片上；保持机构，对剥离用带的所述引导端侧进行保持；剥离机构，通过与所述支承机构的相对移动来将剥离力赋给粘合片，所述剥离机构包含剥离用辊，该剥离用辊在从粘附在所述粘合片上的剥离用带的粘合剂层侧与所述粘合片碰接、并将粘合片的剥离端部侧进行折叠而形成折叠部的状态下，将该粘合片剥离。
在本发明中，以采用如下结构为佳，所述保持机构包括位移机构，通过使所述剥离用带松弛可以形成所述折叠部。
并且，本发明的薄片剥离方法采用如下方法，将剥离用带粘附到粘贴于被粘接体的粘合片上，通过该剥离用带将所述粘合片进行剥离，在所述剥离用带的引导端侧从粘合片的外周向外侧突出的状态下，将剥离用带粘附到粘合片上之后，使剥离机构位于剥离用带的粘合剂层侧，在使所述剥离机构朝沿着粘合片的剥离方向移动并进行剥离的时候，将所述粘合片的剥离端部侧折叠到被粘接体与剥离机构之间并形成折叠部，然后，通过一边保持所述折叠部，一边让所述剥离机构朝所述剥离方向作相对移动，将粘合片从被粘接体上剥离。
在所述薄片剥离方法中，可以采用如下方法，在将所述剥离用带粘附到粘合片上之后，在该剥离用带上形成松弛，利用该松弛可以形成所述折叠部。
根据本发明，由于是使剥离机构位于粘合片的粘合剂层侧，所以，能够在将粘合片的粘合剂层侧折叠的状态下，将粘合片剥离。因此，可以将粘合片的折弯边、即剥离边保持为直线状态，能够避免因粘合片的一部分延长而产生剥离延迟。
另外，如果是所述保持机构包括位移机构的结构，就能够通过使剥离用带松弛来确保进行上述折叠的长度，且能够防患因张力过大而引起无法剥离于未然。
附图说明
图1是涉及本实施方式的薄片剥离装置的概要正视图；
图2是示意剥离用带粘附到粘合片上之状态的概要正视图；
图3是示意形成了折叠部状态的概要正视图；
图4(A)、(B)是粘合片剥离动作的动作示意说明图；
图5是用于说明现有剥离装置中的不良例的概要透视图。
标号说明
10    薄片剥离装置
11    支承机构
12    抽出机构
14    粘附机构
15    保持机构
16     剥离机构
40     夹紧气缸(位移机构)
44     剥离用辊
c      折叠部
S      粘合片
T      剥离用带
W      半导体晶片(被粘接体)
具体实施方式
下面，参照附图对本发明的实施方式进行说明。
图1示出了涉及本实施方式的薄片剥离装置的概要正视图。在该图中，薄片剥离装置10由支承机构11、抽出机构12、切断机构13、粘附机构14、保持机构15及剥离机构16构成。其中，支承机构11对粘附了粘合片S的作为被粘接体的晶片W进行支承；抽出机构12将用于剥离粘合片S的带状剥离用带T抽出；切断机构13将粘合片S每隔所规定的长度进行切断；粘附机构14在剥离用带T的引导端侧从粘合片S的外周向外侧突出的状态下，将剥离用带T粘附到粘合片S上；保持机构15对剥离用带T的所述引导端侧进行保持；剥离机构16通过与所述支承机构11的相对移动来将剥离力赋给粘合片S。在此，在本实施方式中，晶片W在通过切割带DT被固定于环形框架RF上的部分将粘合片S设置在其上表面一侧的状态下，被支承在支承机构11上。另外，粘合片S的粘合剂层采用紫外线硬化型粘合剂，且在预紫外线硬化的状态下，被支承在支承机构11上。
所述支承机构11由上表面侧作为吸附面的工作台20构成，固定于环形框架RF的晶片W被载置到该工作台20上。此外，工作台20设置成通过未予图示的移动机构能够在图1中的左右方向移动。
所述抽出机构12由支承辊21、驱动辊22、夹送辊23、导辊24及衬套25构成。其中，支承辊21被支承于框架F上，并将剥离用带T可抽出地进行支承；驱动辊22通过马达M的驱动将抽出力赋予剥离用带T；夹送辊23将剥离用带T夹在其与该驱动辊22之间；导辊24位于框架F的下端部；衬套25对支承于带导向板27上的轴26在图1中的左右方向可移动地进行支承。该带导向板27其表面具有凹部27A，并且通过设在轴26外周侧的螺旋弹簧28持续向图1中的左侧赋能。
所述切断机构13由切割刀刃30、气缸31及气缸32构成。其中，气缸31使该切割刀刃30在上下方向进退；气缸32对该气缸31在与图1中纸面正交方向上可移动地进行支承。该切断机构13在切割刀刃30的前端借助气缸31处于带导向板27的凹部27A内位置的状态下，通过气缸32的移动能够将剥离用带T切断。
也如图2所示，所述粘附机构14由加热块35、和使该加热块35在上下方向进退的气缸36构成；用所述加热块35的前端、即下端将剥离用带T熔敷到粘合片S的外周部。
所述保持机构15包含上部夹头38及下部夹头39、和以可以将这些夹头38、39相互离开/靠近的形式进行支承的、作为位移机构的夹紧气缸40。该保持机构15设置成通过未予图示的移动机构可以在图1中的左右方向移动。
所述剥离机构16由剥离用辊44、单轴机械臂46及夹持辊47构成。其中，剥离用辊44设定成比晶片W的直径要长；单轴机械臂46包括对该剥离用辊44在图1中的左右方向可移动支承的滑块45；夹持辊47配置在所述带导向板27的下部近旁。
其次，对基于本实施方式中的薄片剥离装置10的剥离方法，也参照图3及图4进行说明。
在初始设定中，如图1所示，将剥离用带T的引导端设置在位于带导向板27的凹部内。
如果粘附了粘合片S的晶片W通过未予图示的移载装置被移动到工作台20上，夹紧气缸40就向图1中的右侧移动，且使带导向板27向右侧倒退移动并让剥离用带T的引导端侧位于上部夹头38及下部夹头39之间。在此状态下，上下夹头38、39相互靠近并将剥离用带T的引导端侧夹入，通过保持机构15返回到图1所示的初始位置来将剥离用带T拉出。
其次，如图2中的双点划线所示，粘附机构14的加热块35向下方前进并进一步将剥离用带T拉出，且在其前端将剥离用带T按压在粘合片S的外周部分并将剥离用带T与粘合片S熔敷。与此同时，通过切断机构13的切割刀刃30下降并朝与图1中纸面正交方向移动来进行剥离用带T的切断。
剥离用带T的切断一旦结束，剥离用辊44就向右方移动，在该剥离用辊44与剥离用带T碰接的前段，夹紧气缸40下降并形成如图3所示的折叠部c。该折叠部c由剥离用辊44的最低点P一直延伸到图3中的左侧、即剥离用带T熔敷的部分而形成，通过形成这样的折叠部c就可以实现粘合片S的钝角剥离。此外，在本实施方式中，如图4(A)所示，剥离角度θ大致为180度。并且，夹紧气缸40一直下降到延伸于剥离用辊44和上下夹头38、39之间的剥离用带T的面变成与粘合片S的表面平行的位置为止。由此，折叠部c可切实地保持到粘合片S剥离结束。也就是说，折叠部c的长度将被保持为固定。
在此状态下，通过移动夹持辊47且与剥离用辊44一起将剥离用带T夹入，这些剥离用辊44和夹持辊47进一步向右侧移动，在将粘合片S的剥离端部侧折叠到剥离用辊44下面的状态下，就能够一面保持剥离边PE一面进行完全剥离(参见图4(B))。
因此，根据这样的实施方式，由于能够将剥离边PE保持成沿剥离用辊44轴线的直线形状，所以，能够避免在使用带状的剥离用带T进行粘合片S剥离的时候所产生的剥离延迟。
如上所述，记载了用于实施本发明的最佳构成和方法等，但本发明并不限于此。
也就是说，对本发明主要就特定的实施方式，特别做了图示和说明，但只要不脱离本发明的技术思想和目的范围，本领域的技术人员可以根据需要对于以上已做说明的实施方式对形状、位置或者配置等加以种种变更。
例如，虽然图示和说明了剥离用带T采用连续的带的情形，但也可以采用单张型的剥离用带使之与粘合片S熔敷。另外，剥离用带T也可以使用热敏粘合性的胶带或压敏粘合性的胶带。
另外，也可以进行控制，以使构成支承机构11的工作台20和保持机构15能够沿单轴机械臂46的伸出方向移动，且支承机构11及保持机构15与剥离机构16同步地将粘合片S朝剥离方向移动；或者，使剥离机构16处于停止状态，支承机构11及保持机构15朝粘合片S的剥离方向移动。
并且，被粘接体不限于半导体晶片W，也可以是玻璃板、钢板、陶器、木板或树脂板等，其他的被粘接体也可以作为对象。半导体晶片也可以是硅晶片或化合物晶片。

Claims (4)

1.一种薄片剥离装置，包括：支承机构，对粘附了粘合片的被粘接体进行支承；抽出机构，将用于剥离粘合片的剥离用带抽出；粘附机构，在剥离用带的引导端侧从粘合片的外周向外侧突出的状态下，将剥离用带粘附到粘合片上；保持机构，对剥离用带的所述引导端侧进行保持；剥离机构，通过与所述支承机构的相对移动来将剥离力赋给粘合片，其特征在于，
所述剥离机构包含剥离用辊，该剥离用辊在朝沿着粘合片的剥离方向相对移动并进行剥离的时候，所述剥离用辊从粘附在所述粘合片上的剥离用带的粘合剂层侧与所述粘合片碰接，并将粘合片的剥离端部侧折叠到所述被粘接体与所述剥离用辊之间而形成折叠部，所述剥离用辊一边保持所述折叠部一边朝所述剥离方向作相对移动，从而将该粘合片从所述被粘接体上剥离。
2.根据权利要求1所述的薄片剥离装置，其特征在于，所述保持机构包括位移机构，通过使所述剥离用带松弛可以形成所述折叠部。
3.一种薄片剥离方法，将剥离用带粘附到粘贴于被粘接体的粘合片上，通过该剥离用带将所述粘合片进行剥离，其特征在于，
在所述剥离用带的引导端侧从粘合片的外周向外侧突出的状态下，将剥离用带粘附到粘合片上之后，使剥离机构位于剥离用带的粘合剂层侧，
在使所述剥离机构朝沿着粘合片的剥离方向移动并进行剥离的时候，将所述粘合片的剥离端部侧折叠到被粘接体与剥离机构之间并形成折叠部，
然后，通过一边保持所述折叠部，一边使所述剥离机构朝所述剥离方向作相对移动，将粘合片从被粘接体上剥离。
4.根据权利要求3所述的薄片剥离方法，其特征在于，在将所述剥离用带粘附到粘合片上之后，在该剥离用带上形成松弛，利用该松弛可以形成所述折叠部。
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