CN102105981A - 半导体封装的集成干扰屏蔽罩及其制造方法 - Google Patents

半导体封装的集成干扰屏蔽罩及其制造方法 Download PDF

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CN102105981A
CN102105981A CN2008801304971A CN200880130497A CN102105981A CN 102105981 A CN102105981 A CN 102105981A CN 2008801304971 A CN2008801304971 A CN 2008801304971A CN 200880130497 A CN200880130497 A CN 200880130497A CN 102105981 A CN102105981 A CN 102105981A
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lead
wire spring
wire
conductive layer
spring
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CN102105981B (zh
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P·L·韦尔奇
郭一凡
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Skyworks Solutions Inc
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Skyworks Solutions Inc
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Abstract

半导体模块封装的集成电磁干扰屏蔽罩。该集成的EMI屏蔽罩包括电连接在包装的基底的接地面和包装的顶部的铸模复合物的导电层的一组众多引线弹簧。由这组引线弹簧的形状以及其产生的弹性效果使得在引线弹簧和导电层之间提供电连接。这组引线弹簧可以被置于模塑包装的任何位置包围所有或者部分包装中的装置，并在这些装置的周围创建一个完整的EMI屏蔽。

Description

半导体封装的集成干扰屏蔽罩及其制造方法
背景
发明领域
该发明是关于半导体装置的封装，具体的说，是指用于半导体装置的电磁和/或射频信号干扰屏蔽。
背景技术
在射频(RF)通讯系统中普遍需要将RF装置与由其他RF装置所生成的电磁(射频)干扰(EMI)隔离开，以保持合适的装置性能。同样，RF装置也普遍需要与从周围环境中所接收到的，或者传递到环境中的，电磁干扰隔离开。
将RF装置与这种电磁干扰隔离开的传统方法是用接地的金属外壳(通畅称为“金属管壳”)将RF装置覆盖。然而，这种解决方案费用很高，而且缺乏设计的适应性。此外，金属管壳大大增加了在印刷电路板上装置足印的尺寸，还增加了印刷电路板的重量。
发明内容
本发明的各个方面和实施方案是关于采用引线键合工艺技术将电磁干扰屏蔽罩集成到装置包装上的半导体装置包装以及制造方法。在一个实施方案中，采用引线键合工艺形成引线弹簧，该引线弹簧围绕装置的周围被定位并被耦合到装置上方和下方的导电层上，借此在装置周围形成电磁干扰的屏蔽。在接下来的描述中将提到，由引线弹簧的形状以及其所产生的弹性效果使得健壮的制造工艺在模塑包装的顶部的导电层和包装基底中的接地面之间建立可靠的电连接。这些引线弹簧的使用，为可以被应用在任何模塑装置上的集成的电磁干扰屏蔽提供了一种灵活的解决方案。
本发明的一方面是指具有集成电磁干扰屏蔽的封装的半导体模块。在一个实施方案中，封装的半导体模块包括具有接地面的基底、安装在基底表面上的电子装置、众多被置于电子装置周围并且与接地面电耦合的引线弹簧、覆盖电子装置的以及至少部分覆盖引线弹簧的铸模复合物，和置于铸模复合物顶部表面并且与至少一些众多引线弹簧电耦合的导电层，其中所述的众多引线弹簧、导电层和接地面一起，构成了集成电磁干扰屏蔽。
在一个实施例中，导电层包括银填充环氧树脂。引线弹簧可以由多种导电材料制成，如金线或铜线。众多引线弹簧的每一个均包括线状的连续线圈以提供弹性效果，该弹性效果允许导电层与引线弹簧接触，从而在导电层和引线弹簧之间提供电耦合。在一个实施例中，电子设备指的是RF设备。
根据另一个实施方案，构成连续线圈的引线弹簧包括球形结合物、变形区域、顶部、在变形区域和顶部之间延伸的凸形区域、倾斜的尾部区域、以及在顶部和倾斜的尾部区域之间延伸的大致平坦的区域，其中变形区域位于凸形区域和球形结合物之间。在一个实施例中，顶部在变形区域上方实质上是垂直的。如上所述，引线弹簧可以由多种导电材料制成，如金线或铜线。在一个实施例中，具有这种结构的引线弹簧将被应用于前文提到的半导体模块中。
另一方面是关于具有集成了电磁干扰屏蔽的半导体模块包装。在一个实施方案中，该半导体模块包装包括基底、安置在基底的第一个表面上的第一和第二金属处理的连接点、以及引线弹簧，所述的引线弹簧包括在第一和第二金属处理的连接点之间延伸的连续的线。引线弹簧包括与第一金属处理的连接点电连接的球形结合物、变形区域、顶部、在变形区域和顶部之间延伸的凸形区域、在顶部附近的大致平坦的区域、以及在大致平坦的区域与第二金属处理的连接点之间延伸的倾斜的尾部区域。在一个实施例中，半导体模块包装还包括安置在基底上并与第一和第二金属处理的连接点中的至少一个电耦合的接地面。在另一个实施例中，半导体模块包装还包括电子设备、众多附加的与引线弹簧实质上相同的引线弹簧，其中所述的众多引线弹簧被安置在电子装置周边的基底上。在另一个实施例中，半导体模块包装还包含覆盖电子设备以及至少部分覆盖众多引线弹簧的铸模复合物、和置于铸模复合物的表面上并且与至少一些众多引线弹簧电连接的导电层，其中接地面、导电层和至少一些众多引线弹簧一起构成了集成电磁干扰屏蔽。
另一方面是关于具有集成电磁干扰屏蔽的模块的制造方法。根据一个实施方案，该方法包括将电子设备与基底相连，在基底上的提供金属喷镀，形成与金属喷镀相连的众多引线弹簧，进行转移铸型工艺将电子设备封装在铸模复合物之中，并用铸模复合物至少部分覆盖众多引线弹簧，并且将导电层置于铸模复合物的表面上，所述的导电层与至少一些众多引线弹簧电连接。在一个实施例中，该方法还包括在将导电层置于铸模复合物的表面上之前，对铸模复合物进行风化处理，以将至少一些众多引线弹簧的区域暴露出来。在另一个实施例中，提供金属喷镀包括提供接地面和至少一个与接地面电连接的引线接触区域。在另一个实施例中，形成所述的众多引线弹簧包括将线球置于金属喷镀上，从线球中抽出线以形成线圈，使得所述的线圈具有与线球相连的第一端和第二端，并将第二端与金属喷镀相连。在另一个实施例中，将导电层置于铸模复合物表面包括将银填充的环氧树脂层涂在铸模复合物表面上。
根据另一个实施方案，电子模块包括基底、安置在基底之上的电子装置，以及由大致围绕电子装置周围的众多分散结构形成的集成电磁干扰屏蔽，所述的结构具有由集成电磁干扰屏蔽所要屏蔽的信号的波长的一小部分所限定的最小间隔。在一个实施例中，所述的波长的一小部分是1/20。在另一个实施例中，众多分散的结构包括众多引线弹簧，如下面将具体论述的那样。
本发明其他方面、实施方案，以及这些可仿效的各个方面和实施方案的优势将在下面进行详细论述。此外，必须说明的是前述的信息以及接下来的详细描述都仅仅是各种不同方面和实施方案的示意性的实施例，只是为了理解所保护的各个方面和实施方案的性质和特性提供一个概述和框架。此处提到的任何实施方案都可能与任何其他的实施方案以与在此所公开的目标、目的和需求相同的方式结合起来，所提到的“实施方案”、“某些实施方案”、“作为替代的实施方案”、“各种不同的实施方案”、“一个实施方案”以及类似的说法，它们之间并不是必须相互排除的，而是用来说明与可能包括在至少一个实施方案中的实施方案相关联的描述的特定的特征、结构或者特性。本篇中出现的术语也并不一定仅限于同一个实施方案之中。附图是用来对各个方面和实施方案提供说明和以便更好的理解，并入到说明书中构成说明书的一部分。附图和说明书的剩余部分，将一起用来解释所描述的、请求保护的各个方面和实施方案中的原则和操作方法。
附图说明
至少一个实施方案的各个方面在下面将结合附图进行讨论，附图并不是依照比例绘制的。有些地方附图、具体实施方式和权利要求中的技术特性，后面会有附图标记，这些符号是用来使附图、具体实施方式和权利要求更加容易的被理解。但是，有或是没有引用附图标记都不会对权利要求的保护范围有任何限制作用。在附图中，在各个不同附图中出现的每一个相同或几乎相同的部分，会用相同的数字来表示。为了清楚起见，并不是每一个部件都会出现在每一张附图中。附图是用来为本发明提供说明和解释，而不是起到定义限制的作用。在附图中：
附图1根据本发明的多个方面示出作为包装工艺的一部分的提供集成EMI屏蔽的方法的一个实施例的流程图；
附图2是包括基底和一个或多个安装在其上的硬模的电子模块的一个实施例的图解；
附图3是根据本发明的多个方面结合了集成EMI屏蔽的装置包装的一个实施例的图解；
附图4A是根据本发明的多个方面结合了集成EMI屏蔽的装置包装的另一个实施例的图解；
附图4B是根据本发明的多个方面表明部分封装装置的连续引线轨迹的平面图；
附图5是根据本发明的多个方面对引线弹簧的说明的一个实施例；
附图6是根据本发明的多个方面示出形成一个引线弹簧的方法的实施例的流程图；
附图7是根据本发明的多个方面的引线弹簧的一个实施例的图解；
附图8是根据本发明的多个方面示出引线弹簧在转移成型工艺中的变形；
附图9是根据本发明的多个方面的引线弹簧并入封装装置的一个实施例的图片；
附图10是根据本发明的多个方面的引线弹簧的一个实施例的平面图。
具体实施方式
在很多现代应用中，包括移动手机电话、个人数字助理(PDAs)、媒体播放器，以及其他使用射频(RF)元件的移动装置，这些最终产品的尺寸(长度，宽度和厚度)和重量经常被视为关键的设计参数。比如，尤其是对移动电话，一个持续的趋势是装置变得更小而轻，同时具有更强的功能性和特点。相应地，这些装置上元件的尺寸和重量也就变得重要起来。正如上文所讨论的那样，射频装置屏蔽电磁干扰传统的方法包括，在需要屏蔽的射频装置上放置一个接地的金属外壳。这种方法增加了设计的尺寸、重量及成本，因此在很多应用中并不受欢迎。
本发明的研究方向和实施方案，主要是针对需要进行干扰屏蔽的独立装置或模块，在封装过程中只在其规格和/或重量上做极小的增加。本文所用到的“EMI屏蔽罩”，既用作电磁干扰的屏蔽，也用作射频干扰的屏蔽。在一个实施方案中，集成的EMI屏蔽罩的加工会用到引线制造工艺，它可以和常规的用来连接电子装置的引线一起，应用已有的工具制造，以及在普通的生产线上进行组装，下面的进一步讨论将涉及这一问题。通过本发明中的方法可以提供更高的设计灵活性，以及更为简单、便宜的制造EMI屏蔽罩。此外，根据本发明的另一方面，集成的“引线笼型屏蔽罩”可以提供一种方法，以达到在模块内/之间的隔离以及更加轻薄，这是现有常规已有技术所不能达到的。下文将讨论到，应用一个在设计和形状上很特别且易于控制的“引线弹簧”形成引线笼，以在多种封装和工序情况下作为牢固实用的EMI屏蔽罩。
必须说明的是，此处讨论的实施方案和仪器，不仅限于在接下来的描述或者附图说明中的细节的应用和阐述的安排。这些方法和仪器也适用于在其他实施方案中应用，也可以通过其他多种方法进行或表现出来。这里提出特定的实施例只是出于阐述的目的，而并不是为了做出限制。特别是一个或多个实施方案中提到的技术、元件和特性不能排除其在某一其他的实施方案中的起到类似的作用。同样，这里所使用的措辞和术语是出于描述的目的，不应作为限制。在系统和方法的实施方案、元件或技术中单独提到基准，也适用于那些包括多个这些元素的实施方案；同时，那些包括多个实施方案、元件或技术中涉及的基准，也适用于包括单个元素的实施方案。这里所使用的“包括”、“包含”、“含有”、“拥有”、“涉及”以及其他用语，是等同于列在之后的包含此含义的用语的，其他附加的用语也是同样情况。所涉及到的“或者”一词可构成“包括”之意，因此，任何表述时使用“或者”的措词，有可能表示“单一”、“几个”或者“全部”之意。任何从前到后，从左至右，从头到尾，从上部到下部的表述，是为了表述的方便，而非限制现有的系统和方法，也非限制他们的构成成分至一个特定的位置或空间方向。
参照附图1，它说明的是依据本发明的一个实施例中，将带有集成电磁干扰屏蔽装置的电子装置或者模块封装的一种方法。该方法的其他方面和实施例将在下面继续参照附图1进行探讨。
步骤100包括准备一个基板来并入电子模块。在下面的探讨中，步骤100还包括在基板上建立金属连接点，以使电子模块以及至少部分可能会成为集成电磁干扰EMI屏蔽装置的各组成部分之间相互连接。在步骤102中，一个电子模块可能是根据在行业技术领域中为人熟知的方法和技术来装配的。步骤102可能包括在基板上安装一个或多个模具，建立必要的内部或外部的连接或连接点(包括安置金属和/或电介质层)等等。因此必须说明的是，尽管模块的装配仅仅作为附图1中的单独的步骤102来说明，然而它可能同时也组成了在不同时间且/或在不同地点的其他步骤。此外还应说明的是，步骤100可以认为是步骤102的一部分。
附图2说明了该模块的一个实施例。模块200包含一个或多个模具202，安置在基板204上。模块200的一些实施例中包括但不仅限于，功率放大器、收发器、线性装置，过滤器和其他可能需要电子干扰EMI屏蔽或从能够中受益的其他设备。根据前面的探讨，电子干扰EMI屏蔽是射频装置普遍需要的，因此模具202中的至少一个为射频装置，模具200也可以是射频模具；然而，必须说明的是，该发明并不仅限于此，模具202可构成多种数字或模拟设备或元件。在一个实施例中，模具202被安装在基板204上，使用引线206连接到焊盘208上，如附图2所示。另外模具202可采用倒装键合或者任何其他领域内已知技术手段来安装在基板204上。
根据一个实施例，在封装过程中，是通过在基板204的边缘建立一个引线笼状结构，来把集成电磁信号屏蔽装置并入到模块200之中。加工该引线的工艺与加工引线206的常规工艺类似，下文将提到，应用相同的设备还可以加工引线弹簧。众多引线弹簧可以安置在基板204上模具202的周围，并且在封装中与接地平面连通，已形成起到电磁干扰屏蔽作用的笼状结构，这将在下面进行探讨。在模塑的模块中集成一个屏蔽装置，加工的困难主要在将基板上的接地平面与顶部的导电层相连的方法上。本发明的实施方案中，应用引线弹簧来连接上述两者，解决了加工制造困难的问题，这将在下文中提到。
再一次参照图1，正如上面所讨论的，步骤100可以包括在基板204上形成金属物，成为集成EMI屏蔽罩的一个部分。参照附图3，这些金属物包括引线焊盘210，接地平面212，以及连接引线焊盘到接地平面的孔214。然后，引线弹簧216被连接到引线焊盘210(第104步)，这将在下文有进一步的讨论。必须说明的是，在附图3阐释的实施例中，两个分离的引线焊盘210以及相关的孔214是为引线弹簧216提供的，本发明并不仅限于此，其它的构造也可以考虑。比如说，正如在图4A和图4B中所阐释的那样，一个独立的引线焊盘210可用一个金属化轨道或者环218替换，来环绕模具202。在这个实施例中，一个或者多个孔214可以设于轨道218两边的接触点处，以连接这一轨道，以及连接引线弹簧216和接地平面212。此外，在一个实施例中，轨道218可以处在两个或多个引线弹簧216之间。因此，每个引线弹簧并不需要都单独的穿过孔214。另外，尽管在图3中，引线弹簧216被阐释为两个连接点(位于引线焊盘210)都穿过孔214连接到接地平面212上，其实不需如此，引线弹簧的一端可以为自由端(即不与接地平面电连接)。
根据一个实施例，形成电磁信号屏蔽的方法包括通过转移成型工艺(步骤106)将模具202封装在铸模复合物220之中。下面将探讨的是，在转移成型加工过程中，基板204被放置于一个较低的包封模具中，较高的包封模具放置在较低的包封模具之上，以使在装置周围形成一个密封腔。并且铸模复合物220压入该空腔，以将模具202封装在基板上。其中转移成型工艺为专业内的共识。
仍然参照附图1和3，在转移成型加工(步骤106)之后，还要应用一个烧蚀加工的步骤来使引线弹簧216的两端穿过铸模复合物220暴露出来。烧蚀加工还包括很多步骤，如激光烧蚀加工，和研磨并/或抛光铸模复合物220的表面层，使引线弹簧216的两端暴露出来。在一个实施例中，烧蚀加工去掉的铸模复合物的厚度不到40微米。在另一个实施例中，烧蚀加工去掉的铸模复合物的厚度为10微米。在引线弹簧216的两端露出之后，较厚的可导电的涂层或者层面222将被安置在铸模复合物220的顶端(步骤110)与引线弹簧216的露出端相连。可应用多种专业内的已知技术将导电层222安置在铸模复合物220的顶端，比如印制、沉积、喷溅涂覆等。在一个实施例中，导电层222由金属填充的环氧树脂构成，如银填充环氧树脂，喷涂在铸模复合物220的顶端。导电层222与引线弹簧216的露出端接触，于是与引线弹簧电连同。
综上所述，在一个实施方案中，模块200包括置于基板204底部平面的接地面212，并通过孔214与引线弹簧216连接起来，这从图3就可以看出。通过引线弹簧216的端点与导电层222之间的接触，于是接地面212与导电层之间便形成通路，在模块200中形成了完整的电磁干扰屏蔽罩。在基板204中的接地面212与电磁干扰屏蔽罩的顶部之间，引线弹簧216构成了灵活(因为它可能被置于基板上任意合适的位置)和完整的连接结构。在一个实施方案中，引线弹簧216具有明确的形状，被用来产生一个弹性效应，形成其与导电层222之间可靠的电路连接。因此，从本质上来说，底部的一个或多个模具202形成的电磁场将在导电层222、引线弹簧216(以及相关的金属附件，如过孔214和焊盘210等)和接地面212之间形成的电磁干扰屏蔽装置中被“屏蔽”。对于模块200来说，此方案中的电磁干扰屏蔽装置有别于传统的金属管式屏蔽装置，体积更小且质量更轻。
根据一个实施案例，引线弹簧216具有特定的形状和高度，可控性很好，与传统的引线206有本质的区别。如附图2和附图3所示，众所周知，对于本领域的技术人员来说，要形成传统引线206，需要使用引线结合机，控制其运转，将引线的一端与模具202连接，保证引线远离不接触模具以形成闭合线路，然后再将引线的另一端与底部的焊盘相连。此案例中的引线弹簧216也是以同样的技术方法来构成的，但是结合引线结合机在X轴和Y轴方向的运动轨迹，线圈经过处理，形成了独特的形状，能够提供想要的弹性效果和其他下面将要继续讨论的属性。
从附图5可以看到，此项发明的核心部分——引线弹簧的主要结构：它包含一个连接引线弹簧216和基板204的金属连接点224，线圈226从金属连接点224一直延伸到基板的第二个连接点228。结合附图5和附图6不难发现，引线弹簧216的制作过程(步骤104)从步骤112开始，首先是制作金属连接点224。此步骤包括在基板204的焊盘210(见图3)上放置一个金属小球(步骤114)，将金属小球与焊盘焊接起来(步骤116)，这样便形成了金属连接点224。制作引线弹簧的材料可以是铜线和用作传统引线的金线等多种金属。如果使用的材料是金，那么焊盘210的材料也要与金相似或者是镀金的，金属连接点224必须用超声焊接方式与基板204连接。类似的处理方式，如果引线弹簧使用的材料是铜，铜制金属连接点224也将用超声焊接的方式连接在金制、铜制或者镀锡的焊盘上。
在该实施案例中，线圈226的形状是由金属连接点224一端的金属线，结合引线结合机X轴和Y轴的运动轨迹(步骤118)，连接到另一端焊盘210(步骤120)上所形成的。线圈226具体的形状见附图5，或者形状与之类似。
结合以上讨论内容，附图7所示综合显示了引线弹簧216与基板204上焊盘210(或者轨道218)的连接方式。引线弹簧216在靠近球形结合物224附近的区域，有一个形变区域230，然后继续向上延伸达到引线弹簧216的顶部区域232，凸形区域234在变形区域230和顶部区域232之间延伸。引线弹簧216还包括一个紧邻顶部区域232的上部区域236以及在236区域和第二个连接点228之间呈下滑趋势的区域238。236区域大致平坦，为的是能够与导电层222(见附图4)充分接触，扩大接触面积，让电流更加畅通。230区域是为了让引线弹簧216与传统引线相比更加富有弹性，能够很好地抵抗来自模具自身和模具复合应力产生的压力，在模具转移成型过程中保持不形变，这一点下面将要更加详细地讨论。如图中辅助线240所示，顶部区域232被放置在236区域之上，将使引线弹簧216的弹性更好，下面会进一步说明。
根据专业内的共识以及前文所述，在转移成型加工过程中，装置被放置于一个较低的包封模具中，将另一包封模具放置在较低的包封模具之上，以使在装置周围形成一个密封腔，铸模复合物220放置入这个腔内。引线弹簧216的高度，指由引线焊点210到顶部232的距离，在制造时需要比铸模复合物220的预期或设计厚度稍微高一些。在转移成型加工过程(106步)中，引线弹簧216是被递减的上层包封模具242压紧的，如附图8中所示。在一个实施例中，上层的包封模具242首先接触到引线弹簧216的顶部区域232。依据引线弹簧216的弹簧常数，取决于变形区域230和顶部区域232的相对于变形区域的实质位置，弹簧始终接触上层包封模具242的表面，如附图8。这种由引线弹簧216的形状来提供的弹簧效果使集成EMI罩的发挥作用，原因在于引线弹簧顶部始终保持与模腔接触，从而只有一小片模具混合料会粘附在引线顶部，从而使引线的顶部可以很容易并且可靠的随着烧蚀过程而伸长(第108步)。在一个实施例中，引线弹簧216在垂直方向有一个较大的行程并且可以吸收由于磨料厚度变化引起的成模高度的变化，和在转移成型过程中可能发生的衬底厚度变化和弯曲。引线弹簧的高度要求足够高，从而使引线可以随着上层包封模具242的减少而充分压缩，但是又不能太高从而使上层包封模具下降时压坏引线。因此，引线弹簧高度的选择，既要足够高以使上层包封模具242下降所需的变形量不超过了弹性极限。类似的，又不能过高，使其顶端可能无法接触或者不能随着转移成型加工过程充分接近铸模复合物的上表面。在一个实施例中，引线弹簧216的高度比铸模复合物的设计厚度高了大概90微米。然后，需要注意的是，引线弹簧的高度，根据比如用来制成该引线的金属或者模具材料等等因素而变化。
在一个实施方案中，引线弹簧216形状进行了优化，以提供给导电层222更大的接触面积，从而促进导电层222形成良好的通路。如上所述，在一个实施例中，引线弹簧216的上侧236基本上是平的。因此，当受到上侧的包封模具242挤压时，引线弹簧的上侧236与模具接合处(或者模塑料的表面)将形成一个长度较大的平面。这个平面将会通过烧蚀步骤(步骤108)曝露在封装的顶部，并通过与导电层222的接触形成通路，最终形成完整的电磁干扰屏蔽罩。附图9中可以看到一个引线弹簧包含于设备封装中的例子。根据附图9所示，引线弹簧的上侧236在铸模复合物220的上方形成了一个大的平面，并且与导电层222相接触。附图10是引线弹簧的附图9的平面视图。根据附图10所示，曝露的电线的一长段224，从铸模复合物220的顶部看过去，主要是，但不一定完全是相应的引线弹簧的上侧236与顶部区域232。根据制造与模拟出的封装实例中，引线弹簧曝露出的那一长段224的长度最大是400微米，最小是200微米。从这些实例中可以得知，相对于传统引线线圈(附图4A中的206)，现在的引线曝露的那一段的长度增加了10倍左右。这样在增大接触面积的同时可以为电磁干扰屏蔽提供一个阻力小且稳固的通路。此外，如果为了降低成本而使用铜线而不是金线作为引线弹簧的材料，由于铜的导电性低于金，这时这个大的接触面就显得尤为重要。
另外，由于导电层222与引线弹簧曝露的部分没有使用焊接(两个导体之间仅仅是靠接触相连)，所以接触面积越大，连接越稳固。引线弹簧216不仅可以为导电层222提供一个弹簧的作用以及较大的接触面积形成一个稳固和良好的通路，也可以提供传递模塑过程中的弹性力。经过试验证明，引线弹簧在传输过程中保持直立成型十分重要，这样可以使得接近模塑料顶部的地区随时都能最小的剥蚀曝露出来。实验测试以及模拟证明，传统的引线线圈由于形状不稳定，在模塑过程中会产生折叠甚至断裂，因此，传统引线线圈在上模具242以及模塑料流动产生的压力作用下可以向任意方向移动。相比之下，引线弹簧216的形状可以控制它的运动方向在压缩时主要是在垂直方向(附图3中的y向)，造成上述讨论的弹簧效应。在其中一个实例中，引线弹簧在平面方向(附图3中的x-z向)比较稳固，具有良好的耐模流及避免线性延展缺陷的特性，这也是大半径线圈的主要关注点。
总之，任何转移成型加工模具，只要使用现有典型的模块基板，加上薄薄一层导电材料沉积在模塑料的顶部，以及在此讨论的引线弹簧，就可以提供一个有效的、低成本且稳固的集成电磁干扰屏蔽，从而形成一个模块中部分或所有设备的全屏蔽。引线弹簧可选的冗余连接可以确保与导电层222的接触符合所有电路的要求，这样一来，引线弹簧可以放置在封装中的任何位置，同时也可以允许非常灵活的电磁干扰的屏蔽设计，可以很容易地修改，以适应不同的模块布局和设备。同样的，根据之前讨论的附图4A和4B，过孔214连接引线焊盘210(或轨道218)到平面方向是不需要与每个焊盘重合，或者在平面方向的特定位置上，允许在模块上灵活安置焊盘210和过孔214。能够提供足够的电磁干扰屏蔽的引线弹簧的数量取决于被屏蔽设备的工作频率和所需要屏蔽的强度等级。例如，线密度(即在任意指定的方向下，相邻的引线216之间的间距)有可能随着信号频率的增加而增加。在某个具体实例中，引线间距约λ/20时可以被使用(其中λ是被屏蔽的信号的波长)。值得注意的是，引线不需要间距均匀，只要最小间距可以在维持稳定频率的情况下达到预期的屏蔽效果就可以了。通过对引线屏蔽干扰笼的测试得知其可以提供大约20分贝的屏蔽，这已经可以满足大多数手机射频应用的要求。因此，这里讨论的引线弹簧可用于提供一个完全集成的电磁干扰屏蔽，该屏蔽不仅非常灵活，还使得模块确定了最低成本，最小的重量以及尺寸。利用传统加工技术处理生产出来的引线弹簧成本低，性能稳固，而且不需要采购任何额外的或者专门配备的设备。
以上对多个具体方案的各个方面的描述，还请相关领域的专家随时提出各种改进和修改的地方。相应地，上述的描述和图示只是用于举例，本发明专利的应用范围还将取决于实际应用的附加声明以及类似的约定。

Claims (21)

1.该封装的半导体模块有集成的电磁干扰屏蔽罩，模块由以下几部分构成：有接地面的基板；安置在基板表面上的电子装置；安置在电子装置周围并与接地面电耦合的众多引线弹簧；一个覆盖电子装置以及至少部分覆盖引线弹簧的铸模复合物；一个安置在铸模复合物上表面并且至少与一些众多引线弹簧电耦合的导电层；其中，众多引线弹簧、导电层和接地面共同组成了集成电磁干扰屏蔽装置。
2.权利要求1中提到的封装半导体模块，其中引线弹簧可由金线制成。
3.权利要求1中提到的封装半导体模块，其中引线弹簧可由铜线制成。
4.任何前面权利要求中提到的封装半导体模块，其中导电层都是由银填充环氧树脂制成。
5.任何前面权利要求中提到的封装半导体模块，其中电子装置是指射频装置。
6.权利要求1-5中提到的封装半导体模块，其中每个众多引线弹簧均可以构成一个连续线圈，形成弹簧效应以使导电层和引线弹簧接触，形成导电层和引线弹簧之间的电耦合。
7.权利要求1-5中提到的封装半导体模块，其中每个引线弹簧均可以构成一个连续线圈，包括：一个安置在基板表面的球形结合物；一个变形区域；一个顶部；变形区域和顶部之间延伸的凸形区域；一个倾斜的尾部区域；顶部和倾斜的尾部区域之间延伸的大致平坦的区域；其中变形区域在凸形区域和球形结合物之间；其中倾斜的尾部区域与基板相连。
8.权利要求7中提到的封装半导体模块，还包括以下几个部分：安置在基板表面的第一和第二金属处理的连接点；其中球形结合物与第一金属连接点相连；其中倾斜尾部区域的一端与第二金属连接点相连。
9.一个引线弹簧可以构成一个连续线圈，包括：一个球形结合物；一个变形区域；一个顶部；变形区域和顶部之间延伸的凸形区域；一个倾斜的尾部区域；顶部和倾斜的尾部区域之间延伸的大致平坦的区域；其中变形区域在凸形区域和球形结合物之间。
10.权利要求9中提到的引线弹簧，其中顶部大致在变形区域的垂直上方。
11.权利要求9、10中提到的引线弹簧，是由金线制成的。
12.权利要求9、10中提到的引线弹簧，也可由铜线制成。
14.一个包含集成电磁干扰屏蔽装置的半导体模具封装，包括以下几个部分：一个基板；安置在基板第一表面的第一和第二金属连接点；一个引线弹簧，包含连接第一金属连接点和第二金属连接点的连续线圈；其中引线弹簧包括：一个与第一金属连接点相连的球形结合物；一个变形区域；一个顶部；变形区域和顶部之间延伸的凸形区域；一个顶部之前大致平缓的区域；一个处在大致平坦区域和第二金属连接点之间的倾斜尾部区域。
15.如权利要求14中所说，半导体模具封装还包括一个安置在基板上，并且至少与第一、第二金属连接点中的一个电耦合的接地面。
16.如权利要求15中所说的半导体模块封装，还包括以下几个部分：一个电子装置；众多附加的与原引线弹簧类似的引线弹簧；其中，众多引线弹簧被安置在电子装置周围的基板上。
17.如权利要求16中所说的半导体模块封装，还包括：一个覆盖电子装置以及至少部分引线弹簧的铸模复合物；一个安置在铸模复合物上表面并且至少与一些众多引线弹簧电耦合的导电层；其中，接地面、导电层和一些众多引线弹簧共同组成了集成电磁干扰屏蔽装置。
18.集成了电磁干扰屏蔽装置的半导体模块的制造方法，包括以下几个部分：将电子装置与基板相连；在基板上的安置金属连接点；形成与金属连接点相连的众多引线弹簧；通过转移成型工艺将电子装置封装在铸模复合物之中，铸模复合物至少部分覆盖引线弹簧；并且将至于与部分引线弹簧电连接的导电层安置在铸模复合物表面。
19.权利要求18中所说的制造方法，还包括烧蚀铸模复合物的表面，在铸模复合物表面安置导电层以前，先使至少部分引线弹簧所在区域暴露出来。
20.权利要求18中所说的制造方法，还包括建立金属连接点，包括提供一个接地面，以及至少一个与接地平面相连的引线接触区域。
21.权利要求18中所说的制造方法，还包括形成众多引线弹簧，包括：在金属连接点上安置一个线圈；用导线一端与线圈相连，另一端与金属点相连形成通路。
22.权利要求18中所说的制造方法，在铸模复合物表面安置导电层，包括在铸模复合物表面在铸模复合物表面喷涂一层银填充的环氧树脂层。
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