CN102088000B - Eeprom的存储单元及其制造方法 - Google Patents
Eeprom的存储单元及其制造方法 Download PDFInfo
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- CN102088000B CN102088000B CN200910199991XA CN200910199991A CN102088000B CN 102088000 B CN102088000 B CN 102088000B CN 200910199991X A CN200910199991X A CN 200910199991XA CN 200910199991 A CN200910199991 A CN 200910199991A CN 102088000 B CN102088000 B CN 102088000B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
- 238000007667 floating Methods 0.000 claims abstract description 84
- 238000000034 method Methods 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000003647 oxidation Effects 0.000 claims abstract description 35
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 35
- 238000002513 implantation Methods 0.000 claims description 35
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 25
- 229920005591 polysilicon Polymers 0.000 claims description 25
- 230000005641 tunneling Effects 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000005468 ion implantation Methods 0.000 claims description 11
- 230000008021 deposition Effects 0.000 claims description 7
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- 150000002500 ions Chemical class 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical group [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- HAYXDMNJJFVXCI-UHFFFAOYSA-N arsenic(5+) Chemical group [As+5] HAYXDMNJJFVXCI-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008672 reprogramming Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
- H10B41/35—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26586—Bombardment with radiation with high-energy radiation producing ion implantation characterised by the angle between the ion beam and the crystal planes or the main crystal surface
Abstract
Description
Claims (8)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910199991XA CN102088000B (zh) | 2009-12-04 | 2009-12-04 | Eeprom的存储单元及其制造方法 |
US12/959,229 US8470669B2 (en) | 2009-12-04 | 2010-12-02 | System and method for EEPROM architecture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910199991XA CN102088000B (zh) | 2009-12-04 | 2009-12-04 | Eeprom的存储单元及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102088000A CN102088000A (zh) | 2011-06-08 |
CN102088000B true CN102088000B (zh) | 2013-03-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910199991XA Active CN102088000B (zh) | 2009-12-04 | 2009-12-04 | Eeprom的存储单元及其制造方法 |
Country Status (2)
Country | Link |
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US (1) | US8470669B2 (zh) |
CN (1) | CN102088000B (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102088000B (zh) * | 2009-12-04 | 2013-03-27 | 中芯国际集成电路制造(上海)有限公司 | Eeprom的存储单元及其制造方法 |
CN103094284B (zh) * | 2011-10-31 | 2016-03-16 | 中芯国际集成电路制造(上海)有限公司 | Eeprom存储器及其制作方法 |
US9025266B2 (en) * | 2013-06-14 | 2015-05-05 | Rohm Co., Ltd. | Semiconductor integrated circuit device, magnetic disk storage device, and electronic apparatus |
CN105789132B (zh) * | 2014-12-16 | 2019-01-08 | 中芯国际集成电路制造(上海)有限公司 | 一种侧墙的形成方法 |
CN105845631A (zh) * | 2015-01-14 | 2016-08-10 | 中芯国际集成电路制造(上海)有限公司 | 一种嵌入式闪存及其制备方法、电子装置 |
CN104681628A (zh) | 2015-03-17 | 2015-06-03 | 京东方科技集团股份有限公司 | 多晶硅薄膜晶体管和阵列基板及制造方法与一种显示装置 |
CN106611796A (zh) * | 2015-10-22 | 2017-05-03 | 中芯国际集成电路制造(北京)有限公司 | P型mos闪存存储单元、存储器及其制备方法 |
US9972493B2 (en) * | 2016-08-08 | 2018-05-15 | Silicon Storage Technology, Inc. | Method of forming low height split gate memory cells |
CN106449387A (zh) * | 2016-11-30 | 2017-02-22 | 上海华力微电子有限公司 | 一种通过结形貌改善闪存耐久性的方法 |
CN112563322A (zh) * | 2020-12-01 | 2021-03-26 | 珠海博雅科技有限公司 | 场效应晶体管及其制造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5066992A (en) * | 1989-06-23 | 1991-11-19 | Atmel Corporation | Programmable and erasable MOS memory device |
CN1115911A (zh) * | 1994-04-11 | 1996-01-31 | 摩托罗拉公司 | 具有隔离晶体管的eeprom单元及其制造与操作方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5482881A (en) * | 1995-03-14 | 1996-01-09 | Advanced Micro Devices, Inc. | Method of making flash EEPROM memory with reduced column leakage current |
DE69630107D1 (de) * | 1996-04-15 | 2003-10-30 | St Microelectronics Srl | Mit einem EEPROM integrierter FLASH-EPROM |
US5780341A (en) * | 1996-12-06 | 1998-07-14 | Halo Lsi Design & Device Technology, Inc. | Low voltage EEPROM/NVRAM transistors and making method |
US6518618B1 (en) * | 1999-12-03 | 2003-02-11 | Intel Corporation | Integrated memory cell and method of fabrication |
TW461093B (en) * | 2000-07-07 | 2001-10-21 | United Microelectronics Corp | Fabrication method for a high voltage electrical erasable programmable read only memory device |
US6355524B1 (en) * | 2000-08-15 | 2002-03-12 | Mosel Vitelic, Inc. | Nonvolatile memory structures and fabrication methods |
US7154140B2 (en) * | 2002-06-21 | 2006-12-26 | Micron Technology, Inc. | Write once read only memory with large work function floating gates |
KR100481856B1 (ko) * | 2002-08-14 | 2005-04-11 | 삼성전자주식회사 | 이이피롬 및 마스크롬을 구비하는 반도체 장치 및 그 제조방법 |
KR100481871B1 (ko) * | 2002-12-20 | 2005-04-11 | 삼성전자주식회사 | 플로팅 게이트를 갖는 비휘발성 기억 셀 및 그 형성방법 |
KR100564629B1 (ko) * | 2004-07-06 | 2006-03-28 | 삼성전자주식회사 | 이이피롬 소자 및 그 제조 방법 |
KR100661225B1 (ko) | 2005-12-26 | 2006-12-22 | 동부일렉트로닉스 주식회사 | 이이피롬 소자 제조 방법 |
JP4921848B2 (ja) * | 2006-05-09 | 2012-04-25 | 株式会社東芝 | 半導体装置およびその製造方法 |
US8247861B2 (en) * | 2007-07-18 | 2012-08-21 | Infineon Technologies Ag | Semiconductor device and method of making same |
US20090242961A1 (en) * | 2008-03-31 | 2009-10-01 | Sanh Tang | Recessed channel select gate for a memory device |
CN102088000B (zh) * | 2009-12-04 | 2013-03-27 | 中芯国际集成电路制造(上海)有限公司 | Eeprom的存储单元及其制造方法 |
US8546214B2 (en) * | 2010-04-22 | 2013-10-01 | Sandisk Technologies Inc. | P-type control gate in non-volatile storage and methods for forming same |
US8278203B2 (en) * | 2010-07-28 | 2012-10-02 | Sandisk Technologies Inc. | Metal control gate formation in non-volatile storage |
US20120228691A1 (en) * | 2011-03-08 | 2012-09-13 | Mohan Dunga | Pn floating gate non-volatile storage element |
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2009
- 2009-12-04 CN CN200910199991XA patent/CN102088000B/zh active Active
-
2010
- 2010-12-02 US US12/959,229 patent/US8470669B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5066992A (en) * | 1989-06-23 | 1991-11-19 | Atmel Corporation | Programmable and erasable MOS memory device |
CN1115911A (zh) * | 1994-04-11 | 1996-01-31 | 摩托罗拉公司 | 具有隔离晶体管的eeprom单元及其制造与操作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20110133264A1 (en) | 2011-06-09 |
CN102088000A (zh) | 2011-06-08 |
US8470669B2 (en) | 2013-06-25 |
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Owner name: SEMICONDUCTOR MANUFACTURING (BEIJING) INTERNATIONA Effective date: 20121102 |
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Effective date of registration: 20121102 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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