CN102076807B - 热熔粘合剂组合物以及它们的制备和使用方法 - Google Patents
热熔粘合剂组合物以及它们的制备和使用方法 Download PDFInfo
- Publication number
- CN102076807B CN102076807B CN200980123821.1A CN200980123821A CN102076807B CN 102076807 B CN102076807 B CN 102076807B CN 200980123821 A CN200980123821 A CN 200980123821A CN 102076807 B CN102076807 B CN 102076807B
- Authority
- CN
- China
- Prior art keywords
- hot melt
- melt adhesive
- adhesive composition
- substrate
- group
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
- B32B2037/1223—Hot-melt adhesive film-shaped
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2170/00—Compositions for adhesives
- C08G2170/20—Compositions for hot melt adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- C08L2666/44—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/28—Non-macromolecular organic substances
- C08L2666/52—Metal-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7503008P | 2008-06-24 | 2008-06-24 | |
| US61/075,030 | 2008-06-24 | ||
| PCT/US2009/047721 WO2010008749A1 (en) | 2008-06-24 | 2009-06-18 | Hot melt adhesive compositions and methods for their preparation and use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102076807A CN102076807A (zh) | 2011-05-25 |
| CN102076807B true CN102076807B (zh) | 2014-09-17 |
Family
ID=41009873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980123821.1A Active CN102076807B (zh) | 2008-06-24 | 2009-06-18 | 热熔粘合剂组合物以及它们的制备和使用方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8580073B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2291482A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5620373B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101624522B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN102076807B (cg-RX-API-DMAC7.html) |
| AU (1) | AU2009271424B2 (cg-RX-API-DMAC7.html) |
| CA (1) | CA2727081C (cg-RX-API-DMAC7.html) |
| MX (1) | MX2010013887A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2010008749A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102482552B (zh) * | 2009-06-04 | 2014-09-17 | 道康宁公司 | 用于建筑膜应用的可喷涂粘合剂组合物 |
| US9593209B2 (en) | 2009-10-22 | 2017-03-14 | Dow Corning Corporation | Process for preparing clustered functional polyorganosiloxanes, and methods for their use |
| WO2013036546A2 (en) * | 2011-09-07 | 2013-03-14 | Dow Corning Corporation | Titanium containing complex and condensation reaction catalysts, methods for preparing the catalysts, and compositions containing the catalysts |
| US9550919B2 (en) * | 2012-01-17 | 2017-01-24 | Illinois Tool Works Inc. | Anti-blocking adhesive-coated substrate, and a method for making the same |
| KR102091994B1 (ko) | 2012-12-21 | 2020-03-23 | 다우 실리콘즈 코포레이션 | 층상 중합체 구조물 및 방법 |
| KR102170923B1 (ko) | 2013-02-11 | 2020-10-29 | 다우 실리콘즈 코포레이션 | 클러스터형 작용성 폴리오르가노실록산 및 실리콘 반응성 희석제를 포함하는 경화성 실리콘 조성물 |
| US10370574B2 (en) | 2013-02-11 | 2019-08-06 | Dow Silicones Corporation | Method for forming thermally conductive thermal radical cure silicone compositions |
| US9593275B2 (en) | 2013-02-11 | 2017-03-14 | Dow Corning Corporation | In situ method for forming thermally conductive thermal radical cure silicone composition |
| US10370572B2 (en) | 2013-02-11 | 2019-08-06 | Dow Silicones Corporation | Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin |
| JP6370812B2 (ja) | 2013-02-11 | 2018-08-08 | ダウ シリコーンズ コーポレーション | クラスタ化官能性ポリオルガノシロキサン、これを生成するプロセス、及びこれを使用する方法 |
| WO2014124388A1 (en) | 2013-02-11 | 2014-08-14 | Dow Corning Corporation | Alkoxy-functional organopolysiloxane resin and polymer and related methods for forming same |
| JP6385370B2 (ja) | 2013-02-11 | 2018-09-05 | ダウ シリコーンズ コーポレーション | 安定な熱ラジカル硬化性シリコーン粘着剤組成物 |
| KR102495932B1 (ko) * | 2015-08-07 | 2023-02-02 | 에스케이온 주식회사 | 리튬 이차 전지 |
| EP3196229B1 (en) | 2015-11-05 | 2018-09-26 | Dow Silicones Corporation | Branched polyorganosiloxanes and related curable compositions, methods, uses and devices |
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| KR20240102976A (ko) | 2021-11-01 | 2024-07-03 | 다우 실리콘즈 코포레이션 | 실리콘 고무에 접착된 실리콘 감압성 접착제를 포함하는 적층 물품의 제조 방법 |
| EP4430124A1 (en) * | 2021-11-10 | 2024-09-18 | Dow Silicones Corporation | Silicone compositions and their applications |
| JP2024543086A (ja) | 2021-11-22 | 2024-11-19 | ダウ グローバル テクノロジーズ エルエルシー | カルビノール官能基を有する有機ケイ素化合物の調製 |
| JP2025509182A (ja) | 2022-03-21 | 2025-04-11 | ダウ グローバル テクノロジーズ エルエルシー | カルボキシ官能性を有する有機ケイ素化合物の調製 |
| WO2023184222A1 (en) | 2022-03-30 | 2023-10-05 | Dow Silicones Corporation | Curable composition for silicone pressure sensitive adhesives |
| JP2025512331A (ja) | 2022-04-13 | 2025-04-17 | ダウ グローバル テクノロジーズ エルエルシー | ポリエーテル官能性有機ケイ素化合物の製造 |
| EP4508054A1 (en) | 2022-04-13 | 2025-02-19 | Dow Global Technologies LLC | Preparation of organosilicon compounds with vinylester functionality |
| US20260028515A1 (en) * | 2022-09-28 | 2026-01-29 | Dow Silicones Corporation | Sealant composition |
| JP2026523948A (ja) | 2023-07-06 | 2026-07-16 | ダウ シリコーンズ コーポレーション | 泡制御配合物に使用するためのシリコーン-ポリエーテルコポリマー |
| WO2025029496A1 (en) | 2023-08-01 | 2025-02-06 | Dow Global Technologies Llc | Radiation curable siloxane compositions and methods for their preparation and use |
| EP4762112A1 (en) | 2023-08-14 | 2026-06-24 | Dow Global Technologies Llc | Cobalt catalyzed hydroformylation of vinyl-functional polyorganosiloxanes |
| WO2026141133A1 (ja) * | 2024-12-25 | 2026-07-02 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0628617A2 (en) * | 1993-06-11 | 1994-12-14 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitivie adhesives |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2676182A (en) | 1950-09-13 | 1954-04-20 | Dow Corning | Copolymeric siloxanes and methods of preparing them |
| US4611042A (en) | 1985-10-03 | 1986-09-09 | Dow Corning Corporation | Resinous copolymeric siloxanes containing alkenyldimethylsiloxanes |
| GB8615862D0 (en) | 1986-06-28 | 1986-08-06 | Dow Corning Ltd | Making siloxane resins |
| US5340887A (en) | 1993-06-11 | 1994-08-23 | Dow Corning Corporation | Oxime-functional moisture-curable hot melt silicone pressure-sensitive adhesives |
| US5561203A (en) * | 1994-06-20 | 1996-10-01 | Dow Corning Corporation | Silicone pressure sensitive adhesive composition |
| US5508360A (en) * | 1995-03-31 | 1996-04-16 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitive adhesives |
| US6433055B1 (en) * | 2000-09-13 | 2002-08-13 | Dow Corning Corporation | Electrically conductive hot-melt silicone adhesive composition |
| JP2003213838A (ja) * | 2002-01-17 | 2003-07-30 | Achilles Corp | 接合発泡成形板およびこれを用いたサンドイッチ構造板 |
| KR20050061554A (ko) | 2002-10-22 | 2005-06-22 | 다우 코닝 코포레이션 | 열용융 접착제 조성물의 연속제조방법 |
| WO2009091463A1 (en) * | 2008-01-18 | 2009-07-23 | Dow Corning Corporation | Hot melt adhesive composition and methods for its preparation and use |
-
2009
- 2009-06-18 KR KR1020117001577A patent/KR101624522B1/ko active Active
- 2009-06-18 AU AU2009271424A patent/AU2009271424B2/en active Active
- 2009-06-18 MX MX2010013887A patent/MX2010013887A/es active IP Right Grant
- 2009-06-18 WO PCT/US2009/047721 patent/WO2010008749A1/en not_active Ceased
- 2009-06-18 US US13/000,751 patent/US8580073B2/en active Active
- 2009-06-18 CA CA2727081A patent/CA2727081C/en active Active
- 2009-06-18 JP JP2011516458A patent/JP5620373B2/ja active Active
- 2009-06-18 EP EP09789841A patent/EP2291482A1/en not_active Ceased
- 2009-06-18 CN CN200980123821.1A patent/CN102076807B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0628617A2 (en) * | 1993-06-11 | 1994-12-14 | Dow Corning Corporation | Moisture-curable hot melt silicone pressure-sensitivie adhesives |
Also Published As
| Publication number | Publication date |
|---|---|
| MX2010013887A (es) | 2011-02-15 |
| US8580073B2 (en) | 2013-11-12 |
| US20110104506A1 (en) | 2011-05-05 |
| JP2011525444A (ja) | 2011-09-22 |
| AU2009271424B2 (en) | 2014-05-08 |
| CA2727081A1 (en) | 2010-01-21 |
| KR101624522B1 (ko) | 2016-05-26 |
| EP2291482A1 (en) | 2011-03-09 |
| WO2010008749A1 (en) | 2010-01-21 |
| CA2727081C (en) | 2016-07-26 |
| CN102076807A (zh) | 2011-05-25 |
| KR20110022070A (ko) | 2011-03-04 |
| AU2009271424A1 (en) | 2010-01-21 |
| JP5620373B2 (ja) | 2014-11-05 |
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