CN102049901B - 喷墨涂敷装置以及方法 - Google Patents

喷墨涂敷装置以及方法 Download PDF

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Publication number
CN102049901B
CN102049901B CN201010523356.5A CN201010523356A CN102049901B CN 102049901 B CN102049901 B CN 102049901B CN 201010523356 A CN201010523356 A CN 201010523356A CN 102049901 B CN102049901 B CN 102049901B
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China
Prior art keywords
diaphragm
mentioned
coating
film
suction
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Expired - Fee Related
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CN201010523356.5A
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English (en)
Chinese (zh)
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CN102049901A (zh
Inventor
宮本芳次
岸村敏治
真锅仁志
渡边胜义
中村秀男
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Hitachi Ltd
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Hitachi Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN201010523356.5A 2009-10-29 2010-10-28 喷墨涂敷装置以及方法 Expired - Fee Related CN102049901B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009248905A JP5548426B2 (ja) 2009-10-29 2009-10-29 インクジェット塗布装置及び方法
JP2009-248905 2009-10-29

Publications (2)

Publication Number Publication Date
CN102049901A CN102049901A (zh) 2011-05-11
CN102049901B true CN102049901B (zh) 2014-11-26

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CN201010523356.5A Expired - Fee Related CN102049901B (zh) 2009-10-29 2010-10-28 喷墨涂敷装置以及方法

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JP (1) JP5548426B2 (enExample)
KR (1) KR101287784B1 (enExample)
CN (1) CN102049901B (enExample)
TW (1) TWI485008B (enExample)

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US10434804B2 (en) 2008-06-13 2019-10-08 Kateeva, Inc. Low particle gas enclosure systems and methods
US12064979B2 (en) 2008-06-13 2024-08-20 Kateeva, Inc. Low-particle gas enclosure systems and methods
US11975546B2 (en) 2008-06-13 2024-05-07 Kateeva, Inc. Gas enclosure assembly and system
JP5529673B2 (ja) * 2010-08-16 2014-06-25 中外炉工業株式会社 両面塗工装置
DE112012001689T5 (de) 2011-04-13 2014-01-09 Megtec Systems, Inc. Verfahren und Vorrichtung zum Beschichten von diskreten Segmenten
EP2714284B1 (en) 2011-06-03 2020-04-15 Durr Systems, Inc. System with web lifter/stabilizer and associated method
US9120344B2 (en) * 2011-08-09 2015-09-01 Kateeva, Inc. Apparatus and method for control of print gap
CN106299116B (zh) * 2011-08-09 2019-07-12 科迪华公司 面向下的打印设备和方法
JP5896820B2 (ja) * 2012-04-19 2016-03-30 株式会社アルバック フィルム搬送処理装置
KR20220039837A (ko) * 2012-08-08 2022-03-29 카티바, 인크. 프린팅 시스템
KR20140123362A (ko) * 2013-04-12 2014-10-22 삼성디스플레이 주식회사 표시 장치용 하부 보호 필름의 컬 발생 방지 장치
US10468279B2 (en) 2013-12-26 2019-11-05 Kateeva, Inc. Apparatus and techniques for thermal treatment of electronic devices
WO2015112454A1 (en) 2014-01-21 2015-07-30 Kateeva, Inc. Apparatus and techniques for electronic device encapsulation
CN103801482A (zh) * 2014-01-25 2014-05-21 东莞东聚电子电讯制品有限公司 一种胶水涂布、贴合工艺
JP6528476B2 (ja) * 2014-03-17 2019-06-12 株式会社リコー 塗布装置及び塗布方法
WO2015168036A1 (en) 2014-04-30 2015-11-05 Kateeva, Inc. Gas cushion apparatus and techniques for substrate coating
CN104124306B (zh) * 2014-07-11 2016-05-18 中国电子科技集团公司第四十八研究所 喷墨打印制备光伏电池超细栅电极的传送机构及制备方法
CN104494310B (zh) * 2014-09-16 2017-04-12 苏州锐发打印技术有限公司 用于太阳能电池网格导线制作的3d打印系统及控制方法
JP6254108B2 (ja) 2015-01-07 2017-12-27 住友化学株式会社 有機elパネルの製造方法
CN105690997A (zh) * 2016-02-15 2016-06-22 山东丽鹏股份有限公司 板材自动赋码机
JP6782087B2 (ja) * 2016-03-28 2020-11-11 株式会社日本マイクロニクス シート治具、ステージ、製造装置、及び二次電池の製造方法
JP6953823B2 (ja) * 2017-06-20 2021-10-27 東洋紡株式会社 液体塗布装置、および液体塗布方法。
CN107284032A (zh) * 2017-08-02 2017-10-24 中国建筑设计院有限公司 一种用于全自动数码蓝图打印机的打印喷头保护装置
KR102410347B1 (ko) * 2017-09-04 2022-06-17 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
WO2020242867A1 (en) 2019-05-31 2020-12-03 Kateeva, Inc. Printer calibration module
CN110538777B (zh) * 2019-09-24 2024-12-27 威格科技(苏州)股份有限公司 一种用于薄柔薄膜基底的固定平台
EP3925787A1 (en) * 2020-06-19 2021-12-22 Agfa Nv Inkjet printing method
EP3925788B1 (en) * 2020-06-19 2023-02-15 Agfa Nv Inkjet printing method
JP7391437B1 (ja) * 2023-05-01 2023-12-05 トムビジネスコンサルティング有限会社 表示部形成装置、表示部形成システム、及び表示部形成方法

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CN101497409A (zh) * 2008-01-29 2009-08-05 诺日士钢机株式会社 卷曲消除机构

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JP2551203B2 (ja) * 1990-06-05 1996-11-06 三菱電機株式会社 半導体装置
JPH09239968A (ja) * 1996-03-06 1997-09-16 Toray Ind Inc プリント装置及びプリント製品の製造方法
US7073902B2 (en) * 2001-03-30 2006-07-11 L&P Property Management Company Method and apparatus for ink jet printing
JP2003211652A (ja) * 2002-01-25 2003-07-29 Konica Corp インクジェットプリンタ
JP4042737B2 (ja) * 2004-10-27 2008-02-06 セイコーエプソン株式会社 パターン形成システム
JP4654948B2 (ja) * 2006-03-10 2011-03-23 セイコーエプソン株式会社 吐出検査装置、液滴吐出装置および電気光学装置の製造方法
JP4848869B2 (ja) * 2006-07-13 2011-12-28 セイコーエプソン株式会社 描画装置
JP5292834B2 (ja) * 2008-01-29 2013-09-18 Nkワークス株式会社 デカール機構
JP4985434B2 (ja) * 2008-01-29 2012-07-25 Nkワークス株式会社 デカール機構

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN101497409A (zh) * 2008-01-29 2009-08-05 诺日士钢机株式会社 卷曲消除机构

Also Published As

Publication number Publication date
KR20110047148A (ko) 2011-05-06
CN102049901A (zh) 2011-05-11
KR101287784B1 (ko) 2013-07-19
JP5548426B2 (ja) 2014-07-16
JP2011092855A (ja) 2011-05-12
TWI485008B (zh) 2015-05-21
TW201138985A (en) 2011-11-16

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Owner name: HITACHI,LTD.

Free format text: FORMER OWNER: HITACHI PLANT TECHNOLOGIES LTD.

Effective date: 20140108

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20140108

Address after: Tokyo, Japan

Applicant after: Hitachi Ltd.

Address before: Tokyo, Japan, Japan

Applicant before: Hitachi Plant Technologies Ltd.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141126

Termination date: 20161028

CF01 Termination of patent right due to non-payment of annual fee