CN102047408B - 薄片粘贴装置及粘贴方法 - Google Patents

薄片粘贴装置及粘贴方法 Download PDF

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Publication number
CN102047408B
CN102047408B CN2009801211740A CN200980121174A CN102047408B CN 102047408 B CN102047408 B CN 102047408B CN 2009801211740 A CN2009801211740 A CN 2009801211740A CN 200980121174 A CN200980121174 A CN 200980121174A CN 102047408 B CN102047408 B CN 102047408B
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China
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bonding sheet
pressure
workbench
reducing chamber
convered structure
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CN2009801211740A
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Chinese (zh)
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CN102047408A (zh
Inventor
中田斡
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Lintec Corp
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Lintec Corp
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Publication of CN102047408A publication Critical patent/CN102047408A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2009801211740A 2008-06-06 2009-05-22 薄片粘贴装置及粘贴方法 Active CN102047408B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-149067 2008-06-06
JP2008149067A JP4723614B2 (ja) 2008-06-06 2008-06-06 シート貼付装置及び貼付方法
PCT/JP2009/059411 WO2009147954A1 (ja) 2008-06-06 2009-05-22 シート貼付装置及び貼付方法

Publications (2)

Publication Number Publication Date
CN102047408A CN102047408A (zh) 2011-05-04
CN102047408B true CN102047408B (zh) 2013-03-20

Family

ID=41398030

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801211740A Active CN102047408B (zh) 2008-06-06 2009-05-22 薄片粘贴装置及粘贴方法

Country Status (5)

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US (1) US20110061808A1 (enExample)
JP (1) JP4723614B2 (enExample)
KR (1) KR101543630B1 (enExample)
CN (1) CN102047408B (enExample)
WO (1) WO2009147954A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5287273B2 (ja) * 2009-01-13 2013-09-11 株式会社東京精密 ウェーハマウント方法及びウェーハマウント装置
JP5563423B2 (ja) * 2010-10-19 2014-07-30 リンテック株式会社 シート貼付装置および貼付方法
JP2012178471A (ja) * 2011-02-25 2012-09-13 Lintec Corp シート貼付装置および貼付方法
JP5591859B2 (ja) * 2012-03-23 2014-09-17 株式会社東芝 基板の分離方法及び分離装置
JP6126938B2 (ja) * 2013-08-09 2017-05-10 リンテック株式会社 シート貼付装置及びシート貼付方法
WO2016169018A1 (zh) * 2015-04-23 2016-10-27 华为技术有限公司 一种压合装置及方法
JP6559013B2 (ja) * 2015-08-20 2019-08-14 リンテック株式会社 シート貼付装置および貼付方法
JP7051379B2 (ja) * 2017-11-15 2022-04-11 芝浦メカトロニクス株式会社 成膜装置及び埋込処理装置
MY205366A (en) * 2018-04-24 2024-10-17 Disco Hi Tec Europe Gmbh Device and method for attaching protective tape on semiconductor wafer
JP7107436B2 (ja) * 2019-05-23 2022-07-27 三菱電機株式会社 ダイシングテープの貼付方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2945089B2 (ja) * 1990-07-05 1999-09-06 古河電気工業株式会社 ウエハへのテープ貼付装置
CN101140855A (zh) * 2006-09-08 2008-03-12 琳得科株式会社 薄片粘贴装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10233430A (ja) * 1997-02-19 1998-09-02 Nitto Denko Corp 粘着テープ貼付け装置
JP4022306B2 (ja) * 1998-03-03 2007-12-19 不二越機械工業株式会社 ウェーハの接着方法及び接着装置
JP2006196605A (ja) * 2005-01-12 2006-07-27 Seiko Epson Corp 基板へのテープ貼付装置
JP4143623B2 (ja) * 2005-04-26 2008-09-03 Ｎｅｃエンジニアリング株式会社 テープ貼付装置
JP4841355B2 (ja) * 2006-08-08 2011-12-21 日東電工株式会社 半導体ウエハの保持方法
JP4840333B2 (ja) * 2007-11-12 2011-12-21 株式会社デンソー テープ貼り付け装置及びテープ貼り付け方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2945089B2 (ja) * 1990-07-05 1999-09-06 古河電気工業株式会社 ウエハへのテープ貼付装置
CN101140855A (zh) * 2006-09-08 2008-03-12 琳得科株式会社 薄片粘贴装置

Also Published As

Publication number Publication date
JP4723614B2 (ja) 2011-07-13
KR20110033109A (ko) 2011-03-30
JP2009295846A (ja) 2009-12-17
CN102047408A (zh) 2011-05-04
WO2009147954A1 (ja) 2009-12-10
KR101543630B1 (ko) 2015-08-11
US20110061808A1 (en) 2011-03-17

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