CN102047181B - 感光性树脂组合物 - Google Patents

感光性树脂组合物 Download PDF

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Publication number
CN102047181B
CN102047181B CN200980119560.6A CN200980119560A CN102047181B CN 102047181 B CN102047181 B CN 102047181B CN 200980119560 A CN200980119560 A CN 200980119560A CN 102047181 B CN102047181 B CN 102047181B
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China
Prior art keywords
group
methoxy
compound
carbon number
integer
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Expired - Fee Related
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CN200980119560.6A
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English (en)
Chinese (zh)
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CN102047181A (zh
Inventor
丹羽基博
涩井智史
金田隆行
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Asahi Chemical Co Ltd
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Asahi Chemical Co Ltd
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Publication of CN102047181A publication Critical patent/CN102047181A/zh
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Expired - Fee Related legal-status Critical Current
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
CN200980119560.6A 2008-05-29 2009-05-27 感光性树脂组合物 Expired - Fee Related CN102047181B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2008-141253 2008-05-29
JP2008141253 2008-05-29
JP2008-229982 2008-09-08
JP2008229982 2008-09-08
JP2009-011352 2009-01-21
JP2009011352 2009-01-21
PCT/JP2009/059711 WO2009145227A1 (ja) 2008-05-29 2009-05-27 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
CN102047181A CN102047181A (zh) 2011-05-04
CN102047181B true CN102047181B (zh) 2013-01-23

Family

ID=41377098

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980119560.6A Expired - Fee Related CN102047181B (zh) 2008-05-29 2009-05-27 感光性树脂组合物

Country Status (5)

Country Link
JP (1) JP5185999B2 (ko)
KR (1) KR101355788B1 (ko)
CN (1) CN102047181B (ko)
TW (1) TWI401530B (ko)
WO (1) WO2009145227A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5547933B2 (ja) * 2008-09-08 2014-07-16 旭化成イーマテリアルズ株式会社 アルコキシメチル化合物
JP5431027B2 (ja) * 2009-05-26 2014-03-05 旭化成イーマテリアルズ株式会社 熱架橋性化合物
KR101333704B1 (ko) 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101400192B1 (ko) * 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
TWI428699B (zh) * 2011-12-01 2014-03-01 Chi Mei Corp 光硬化性聚矽氧烷組成物、保護膜及具有保護膜的元件
JP6195018B2 (ja) * 2015-03-27 2017-09-13 東レ株式会社 ジアミン化合物に由来する構造を有する耐熱性樹脂または耐熱性樹脂前駆体
EP3755764B1 (en) 2017-03-09 2023-05-10 Merck Patent GmbH Polymerisable compounds and the use thereof in liquid-crystal displays
KR102645134B1 (ko) * 2020-09-03 2024-03-06 삼성에스디아이 주식회사 중합체, 하드마스크 조성물 및 패턴 형성 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002069041A1 (fr) * 2001-02-26 2002-09-06 Toray Industries, Inc. Composition precurseur de resine photosensible positive et affichage fabrique au moyen de cette composition
CN1573546A (zh) * 2003-06-23 2005-02-02 住友电木株式会社 正型感光性树脂组合物、树脂膜的制造方法、半导体装置和显示元件及其制造方法
JP2007016214A (ja) * 2005-06-09 2007-01-25 Toray Ind Inc 樹脂組成物およびそれを用いた表示装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4600644B2 (ja) * 2003-06-23 2010-12-15 住友ベークライト株式会社 ポジ型感光性樹脂組成物、半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP4327616B2 (ja) 2004-01-26 2009-09-09 旭化成イーマテリアルズ株式会社 感光性コーティング樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002069041A1 (fr) * 2001-02-26 2002-09-06 Toray Industries, Inc. Composition precurseur de resine photosensible positive et affichage fabrique au moyen de cette composition
EP1365289A1 (en) * 2001-02-26 2003-11-26 Toray Industries, Inc. Precursor composition for positive photosensitive resin and display made with the same
CN1573546A (zh) * 2003-06-23 2005-02-02 住友电木株式会社 正型感光性树脂组合物、树脂膜的制造方法、半导体装置和显示元件及其制造方法
JP2007016214A (ja) * 2005-06-09 2007-01-25 Toray Ind Inc 樹脂組成物およびそれを用いた表示装置

Also Published As

Publication number Publication date
TWI401530B (zh) 2013-07-11
TW201011464A (en) 2010-03-16
CN102047181A (zh) 2011-05-04
WO2009145227A1 (ja) 2009-12-03
KR20100133495A (ko) 2010-12-21
JP5185999B2 (ja) 2013-04-17
JPWO2009145227A1 (ja) 2011-10-13
KR101355788B1 (ko) 2014-01-24

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Termination date: 20160527